David Shaddock

411 total citations
50 papers, 329 citations indexed

About

David Shaddock is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, David Shaddock has authored 50 papers receiving a total of 329 indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 8 papers in Automotive Engineering. Recurrent topics in David Shaddock's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (12 papers) and Silicon Carbide Semiconductor Technologies (8 papers). David Shaddock is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (12 papers) and Silicon Carbide Semiconductor Technologies (8 papers). David Shaddock collaborates with scholars based in United States, Norway and Israel. David Shaddock's co-authors include Junghyun Cho, Liang Yin, Aaron Knobloch, Shubhra Bansal, Wayne Johnson, Mohammed Alhendi, Nancy Stoffel, Mark D. Poliks, Ioannis Chasiotis and Peter Børgesen and has published in prestigious journals such as Materials Science and Engineering A, Additive manufacturing and Advanced Engineering Materials.

In The Last Decade

David Shaddock

41 papers receiving 315 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
David Shaddock United States	11	236	135	64	62	58	50	329
Jan Kowal United Kingdom	7	219 0.9×	118 0.9×	37 0.6×	105 1.7×	24 0.4×	10	365
K.-J. Wolter Germany	11	419 1.8×	193 1.4×	54 0.8×	71 1.1×	28 0.5×	74	506
Barbara Horváth Hungary	14	355 1.5×	191 1.4×	82 1.3×	57 0.9×	21 0.4×	31	445
Choong-Jae Lee South Korea	13	393 1.7×	282 2.1×	42 0.7×	49 0.8×	30 0.5×	49	469
Kyeongjae Jeong South Korea	10	192 0.8×	185 1.4×	126 2.0×	40 0.6×	54 0.9×	16	364
Angkur Jyoti Dipanka Shaikeea United Kingdom	8	109 0.5×	136 1.0×	37 0.6×	119 1.9×	35 0.6×	16	314
L. Mendizabal France	5	399 1.7×	206 1.5×	92 1.4×	37 0.6×	30 0.5×	11	496
Didier Landru France	9	230 1.0×	68 0.5×	77 1.2×	66 1.1×	46 0.8×	42	336
Jong-Tae Moon South Korea	9	256 1.1×	185 1.4×	77 1.2×	37 0.6×	43 0.7×	31	387

Countries citing papers authored by David Shaddock

Since Specialization

Citations

This map shows the geographic impact of David Shaddock's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Shaddock with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Shaddock more than expected).

Fields of papers citing papers by David Shaddock

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David Shaddock. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Shaddock. The network helps show where David Shaddock may publish in the future.

Co-authorship network of co-authors of David Shaddock

This figure shows the co-authorship network connecting the top 25 collaborators of David Shaddock. A scholar is included among the top collaborators of David Shaddock based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David Shaddock. David Shaddock is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Shaddock, David, et al.. (2024). Demonstration of 800°C SiC MOSFETs for Extreme Temperature Applications. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 361. 111–116. 1 indexed citations

Popp, Jeremy, et al.. (2023). Extended Lifetime Testing of SiC CMOS Electronics at 500°C. IMAPSource Proceedings. 2022(HiTEN). 1 indexed citations

Shaddock, David, et al.. (2023). Direct Write Extreme Environment Packaging. IMAPSource Proceedings. 2022(HiTEN).

Alhendi, Mohammed, David Shaddock, Nancy Stoffel, et al.. (2023). Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications. Advanced Engineering Materials. 25(20). 4 indexed citations

Alhendi, Mohammed, Mark D. Poliks, Peter Børgesen, et al.. (2022). High Temperature Die Interconnection Approaches. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1539–1545. 12 indexed citations

Lin, David C., et al.. (2020). Sub-Degree-Per-Hour MEMS Gyroscope for Measurement While Drilling at 300°C. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 1425–1431. 4 indexed citations

Alhendi, Mohammed, Peter Børgesen, Mark D. Poliks, et al.. (2019). Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics. 768–776. 4 indexed citations

Greene, Christopher, Mark D. Poliks, Peter Børgesen, et al.. (2018). Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor. 948–953. 2 indexed citations

Yin, Liang, et al.. (2018). Lead-Free Alternatives for Interconnects in High-Temperature Electronics. Journal of Electronic Packaging. 140(1). 6 indexed citations

10.

Jiang, Qian, et al.. (2016). Mechanical constitutive properties of a bi-rich high temperature solder alloy. 2. 1236–1239. 1 indexed citations

11.

Yin, Liang, et al.. (2014). Developments of high-Bi alloys as a high temperature Pb-free solder. 1328–1334. 8 indexed citations

12.

Shaddock, David & Liang Yin. (2014). High Temperature Laminate Characterization. Journal of Microelectronics and Electronic Packaging. 11(4). 146–157.

13.

Fang, Kun, et al.. (2012). Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(HITEC). 407–412. 2 indexed citations

14.

Zhang, Tan, David Shaddock, Alexey Vert, Rui Zhang, & Wayne Johnson. (2011). Characterization of LTCC-Thick Film Technology for 300°C Packaging. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2011(HITEN). 46–51. 4 indexed citations

15.

Zhang, Rui, Wayne Johnson, V. Tilak, Tan Zhang, & David Shaddock. (2010). Characterization of Thick Film Technology for 300°C Packaging. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(HITEC). 97–107. 14 indexed citations

16.

Pan, Jianbiao, Jyhwen Wang, & David Shaddock. (2005). Lead-free Solder Joint Reliability – State of the Art and Perspectives. Journal of Microelectronics and Electronic Packaging. 2(1). 72–83. 20 indexed citations

17.

Pan, Jianbiao, Jyhwen Wang, & David Shaddock. (2004). Lead-free Solder Joint Reliability – State of the Art and Perspectives. DigitalCommons - CalPoly (California State Polytechnic University). 1 indexed citations

18.

Dasgupta, Samhita, et al.. (2003). A silicon-carbide micro-capillary pumped loop for cooling high power devices. 364–368. 18 indexed citations

19.

Shaddock, David, et al.. (2002). Chip scale packaging using chip-on-flex technology. 638–642.

20.

Shaddock, David, et al.. (1998). Reliability evaluation of chip-on-flex CSP devices. 242–246. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact