D.C. Lin

628 total citations
19 papers, 532 citations indexed

About

D.C. Lin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, D.C. Lin has authored 19 papers receiving a total of 532 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Mechanical Engineering, 11 papers in Electrical and Electronic Engineering and 4 papers in Mechanics of Materials. Recurrent topics in D.C. Lin's work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (6 papers). D.C. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (6 papers). D.C. Lin collaborates with scholars based in United States, Australia and Germany. D.C. Lin's co-authors include Radovan Kovacevic, T. S. Srivatsan, G.-X. Wang, M. Petraroli, Meslet Al‐Hajri, T. S. Srivatsan, Ehsan Foroozmehr, Fanrong Kong, Soundarapandian Santhanakrishnan and Guixue Wang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Processing Technology and Powder Technology.

In The Last Decade

D.C. Lin

19 papers receiving 502 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
D.C. Lin United States	9	471	257	145	49	44	19	532
Alice C. Kilgo United States	7	356 0.8×	377 1.5×	109 0.8×	41 0.8×	60 1.4×	26	454
Robert L Terpstra United States	7	315 0.7×	362 1.4×	87 0.6×	26 0.5×	16 0.4×	8	427
Young-Eui Shin South Korea	10	222 0.5×	329 1.3×	59 0.4×	15 0.3×	60 1.4×	44	386
Xuewen Li China	12	230 0.5×	133 0.5×	52 0.4×	91 1.9×	88 2.0×	25	354
Adrian Lis Japan	12	320 0.7×	189 0.7×	42 0.3×	132 2.7×	61 1.4×	24	426
A. Rezaee-Bazzaz Iran	10	320 0.7×	121 0.5×	132 0.9×	125 2.6×	127 2.9×	16	367
Rodrigo André Valenzuela Reyes Brazil	12	320 0.7×	99 0.4×	223 1.5×	163 3.3×	33 0.8×	25	374
Nima Yazdian United States	11	399 0.8×	52 0.2×	105 0.7×	76 1.6×	50 1.1×	15	450
Ning-Cheng Lee Taiwan	11	348 0.7×	548 2.1×	59 0.4×	25 0.5×	48 1.1×	76	576
Y.B. Liu China	13	379 0.8×	34 0.1×	237 1.6×	140 2.9×	68 1.5×	18	428

Countries citing papers authored by D.C. Lin

Since Specialization

Citations

This map shows the geographic impact of D.C. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.C. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.C. Lin more than expected).

Fields of papers citing papers by D.C. Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D.C. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.C. Lin. The network helps show where D.C. Lin may publish in the future.

Co-authorship network of co-authors of D.C. Lin

This figure shows the co-authorship network connecting the top 25 collaborators of D.C. Lin. A scholar is included among the top collaborators of D.C. Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D.C. Lin. D.C. Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

19 of 19 papers shown

Kong, Fanrong, Soundarapandian Santhanakrishnan, D.C. Lin, & Radovan Kovacevic. (2009). Modeling of temperature field and grain growth of a dual phase steel DP980 in direct diode laser heat treatment. Journal of Materials Processing Technology. 209(18-19). 5996–6003. 23 indexed citations

Foroozmehr, Ehsan, D.C. Lin, & Radovan Kovacevic. (2009). Application of vibration in the laser powder deposition process. Journal of Manufacturing Processes. 11(1). 38–44. 23 indexed citations

Huang, Wei, Shanglu Yang, D.C. Lin, & Radovan Kovacevic. (2009). Real-Time Monitoring of the Weld Penetration State in Laser Welding of High-Strength Steels by Airborne Acoustic Signal. 799–805. 3 indexed citations

Lin, D.C., et al.. (2009). Real-time observation of cathodic cleaning during variable-polarity gas tungsten arc welding of aluminium alloy. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture. 223(9). 1143–1157. 6 indexed citations

Lin, D.C., et al.. (2008). Numerical and Experimental Investigations on the Loads Carried by the Tool During Friction Stir Welding. Journal of Materials Engineering and Performance. 18(4). 339–350. 109 indexed citations

Lin, D.C., et al.. (2008). A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging. Sadhana. 33(3). 251–259. 3 indexed citations

Yang, Shanglu, Wei Huang, D.C. Lin, Fanrong Kong, & Radovan Kovacevic. (2008). Monitoring of the Spatter Formation in Laser Welding of Galvanized Steels in Lap Joint Configuration by the Measurement of the Acoustic Emission. 143–146. 5 indexed citations

Lin, D.C., T. S. Srivatsan, Guixue Wang, & Radovan Kovacevic. (2007). Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder. Journal of Materials Engineering and Performance. 16(5). 647–654. 18 indexed citations

Lin, D.C., T. S. Srivatsan, G.-X. Wang, & Radovan Kovacevic. (2006). Microstructural development in a rapidly cooled eutectic Sn–3.5% Ag solder reinforced with copper powder. Powder Technology. 166(1). 38–46. 21 indexed citations

10.

Lin, D.C., Chao‐Yin Kuo, T. S. Srivatsan, M. Petraroli, & Guoxiu Wang. (2005). Synthesis and Characterization of Nano-Composite Lead-Free Solder. Journal of Metastable and Nanocrystalline Materials. 23. 145–150. 2 indexed citations

11.

Lin, D.C., et al.. (2004). Influence of hold time on cyclic stress response and fracture behavior of an Al–Mg–Si alloy. Materials Science and Engineering A. 372(1-2). 316–326. 1 indexed citations

12.

Faizan, Mohammad, et al.. (2003). An Investigation of Copper Dissolution and Microstructural Development in Lead-Free Solders. 245–251. 1 indexed citations

13.

Lin, D.C., Chao‐Yin Kuo, T. S. Srivatsan, & G.-X. Wang. (2003). Understanding Solidification Kinetics and Microstructural Development of a Lead-Free Composite Solder. 253–258. 1 indexed citations

14.

Lin, D.C., et al.. (2003). An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder. Materials Science and Engineering A. 360(1-2). 285–292. 79 indexed citations

15.

Lin, D.C., G.-X. Wang, & T. S. Srivatsan. (2003). A mechanism for the formation of equiaxed grains in welds of aluminum–lithium alloy 2090. Materials Science and Engineering A. 351(1-2). 304–309. 83 indexed citations

16.

Lin, D.C., et al.. (2003). Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder. Materials Letters. 57(21). 3193–3198. 79 indexed citations

17.

Faizan, Mohammad, et al.. (2003). An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders. 289–294. 4 indexed citations

18.

Lin, D.C., et al.. (2002). The influence of copper nanopowders on microstructure and hardness of lead–tin solder. Materials Letters. 53(4-5). 333–338. 63 indexed citations

19.

Kallmayer, Christine, et al.. (2002). Fluxless flip-chip attachment techniques using the Au/Sn metallurgy. d 15. 20–28. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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