C. Penny

473 total citations
9 papers, 104 citations indexed

About

C. Penny is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, C. Penny has authored 9 papers receiving a total of 104 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanics of Materials. Recurrent topics in C. Penny's work include Copper Interconnects and Reliability (6 papers), Semiconductor materials and devices (5 papers) and Gear and Bearing Dynamics Analysis (2 papers). C. Penny is often cited by papers focused on Copper Interconnects and Reliability (6 papers), Semiconductor materials and devices (5 papers) and Gear and Bearing Dynamics Analysis (2 papers). C. Penny collaborates with scholars based in United States, Germany and Vietnam. C. Penny's co-authors include Nicholas A. Lanzillo, O. van der Straten, K. Motoyama, T. Standaert, Karl Fabian, C.-C. Yang, Griselda Bonilla, K. Cheng, Adrian R. Muxworthy and Huai Huang and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Electron Device Letters and Physical review. B..

In The Last Decade

C. Penny

9 papers receiving 97 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C. Penny United States 6 74 54 19 17 16 9 104
Robert R. Robison United States 7 111 1.5× 27 0.5× 22 1.2× 40 2.4× 13 0.8× 16 126
L. Pinzelli France 5 102 1.4× 26 0.5× 39 2.1× 9 0.5× 7 0.4× 12 109
S.L. Shue Taiwan 7 116 1.6× 79 1.5× 48 2.5× 26 1.5× 31 1.9× 21 143
B. Krist United States 6 108 1.5× 50 0.9× 15 0.8× 22 1.3× 10 0.6× 8 124
D. Canaperi United States 4 65 0.9× 44 0.8× 14 0.7× 17 1.0× 7 0.4× 8 72
A. Upham United States 5 89 1.2× 35 0.6× 21 1.1× 9 0.5× 51 3.2× 6 106
Prasanna Khare United States 5 76 1.0× 17 0.3× 16 0.8× 23 1.4× 14 0.9× 8 102
P. Brun France 5 67 0.9× 36 0.7× 19 1.0× 5 0.3× 11 0.7× 9 77
U. Kwon United States 9 121 1.6× 59 1.1× 34 1.8× 87 5.1× 19 1.2× 21 193
S. Siddiqui United States 7 137 1.9× 32 0.6× 31 1.6× 22 1.3× 12 0.8× 18 151

Countries citing papers authored by C. Penny

Since Specialization
Citations

This map shows the geographic impact of C. Penny's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Penny with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Penny more than expected).

Fields of papers citing papers by C. Penny

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Penny. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Penny. The network helps show where C. Penny may publish in the future.

Co-authorship network of co-authors of C. Penny

This figure shows the co-authorship network connecting the top 25 collaborators of C. Penny. A scholar is included among the top collaborators of C. Penny based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Penny. C. Penny is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

9 of 9 papers shown
1.
Houpert, L., C. Penny, & James H. Clarke. (2023). Bearing Models for Advanced Ball Bearing Simulation. Tribology Transactions. 66(5). 845–868. 2 indexed citations
2.
Houpert, L., James H. Clarke, & C. Penny. (2023). Tribological Models for Advanced Ball Bearing Simulation. Tribology Transactions. 66(4). 645–660. 3 indexed citations
3.
Bonilla, Griselda, et al.. (2020). Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch. 20.4.1–20.4.4. 16 indexed citations
4.
Penny, C., Adrian R. Muxworthy, & Karl Fabian. (2019). Mean-field modelling of magnetic nanoparticles: The effect of particle size and shape on the Curie temperature. Physical review. B.. 99(17). 13 indexed citations
5.
Lanzillo, Nicholas A., C.-C. Yang, K. Motoyama, et al.. (2019). Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects. IEEE Electron Device Letters. 40(11). 1804–1807. 39 indexed citations
6.
Penny, C., S. James Gates, B. Peethala, et al.. (2017). Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits. 1–4. 11 indexed citations
7.
Straten, O. van der, et al.. (2014). ALD and PVD Tantalum Nitride Barrier Resistivity and Their Significance in via Resistance Trends. ECS Transactions. 64(9). 117–122. 11 indexed citations
8.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2013). Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers. Journal of The Electrochemical Society. 160(12). D3171–D3178. 6 indexed citations
9.
Bonilla, Griselda, T. Shaw, E. Liniger, et al.. (2012). Tailoring dielectric materials for robust BEOL reliability. 3A.1.1–3A.1.6. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026