Yee‐Wen Yen

1.5k total citations
106 papers, 1.3k citations indexed

About

Yee‐Wen Yen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, Yee‐Wen Yen has authored 106 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 87 papers in Electrical and Electronic Engineering, 74 papers in Mechanical Engineering and 17 papers in General Materials Science. Recurrent topics in Yee‐Wen Yen's work include Electronic Packaging and Soldering Technologies (80 papers), Intermetallics and Advanced Alloy Properties (42 papers) and 3D IC and TSV technologies (39 papers). Yee‐Wen Yen is often cited by papers focused on Electronic Packaging and Soldering Technologies (80 papers), Intermetallics and Advanced Alloy Properties (42 papers) and 3D IC and TSV technologies (39 papers). Yee‐Wen Yen collaborates with scholars based in Taiwan, Indonesia and Philippines. Yee‐Wen Yen's co-authors include Chiapyng Lee, Sinn-wen Chen, Chung‐Yung Lin, Wei-Kai Liou, Yu‐Lin Kuo, Chih‐Ming Chen, Jianwei Su, Rainer Schmid‐Fetzer, Chien‐Liang Lee and Song‐Mao Liang and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of The Electrochemical Society.

In The Last Decade

Yee‐Wen Yen

101 papers receiving 1.2k citations

Peers

Countries citing papers authored by Yee‐Wen Yen

Since Specialization

Citations

This map shows the geographic impact of Yee‐Wen Yen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yee‐Wen Yen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yee‐Wen Yen more than expected).

Fields of papers citing papers by Yee‐Wen Yen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yee‐Wen Yen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yee‐Wen Yen. The network helps show where Yee‐Wen Yen may publish in the future.

Co-authorship network of co-authors of Yee‐Wen Yen

This figure shows the co-authorship network connecting the top 25 collaborators of Yee‐Wen Yen. A scholar is included among the top collaborators of Yee‐Wen Yen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yee‐Wen Yen. Yee‐Wen Yen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	High-temperature oxidation behavior of high-density nanotwinned Al5SiCo22Cr22Ni44NbMo5 high-entropy alloy thin films in dry air	Corrosion Science	Yee‐Wen Yen, Fan-Yi Ouyang et al.	0
2	Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder	JOM	Yu-An Shen, Yee‐Wen Yen et al.	3
3	Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder	Metals	Chao-hong Wang, Yee‐Wen Yen et al.	5
4	Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples	Journal of the Taiwan Institute of Chemical Engineers	Yee‐Wen Yen et al.	1
5	Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples	JOM	Chih‐Ming Chen, Yee‐Wen Yen et al.	3
6	Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au-xAg/Al Couples at 450 °C	Materials	Chien-Lung Liang, Yee‐Wen Yen et al.	0
7	Influences of Impurity Incorporation in Electroplated Cu on the SnAgCu and Ni-Containing SnAgCu Solder Joints	Journal of The Electrochemical Society	Yee‐Wen Yen, Chih‐Ming Chen et al.	2
8	Femtosecond pulse laser fabrication of zinc oxide quantum clusters/nanoparticles and their electrical, optical, and chemical characteristics	Journal of Colloid and Interface Science	Toyoko Imae, Yee‐Wen Yen et al.	9
9	The Effect of Increasing Nickel Content on the Microstructure, Hardness, and Corrosion Resistance of the CuFeTiZrNix High-Entropy Alloys	Materials	William W. Yu, Ryo Okumura et al.	9
10	Investigating Pyrolysis Characteristics of Dendrocalamus Asper Bamboo	SSRN Electronic Journal	Yee‐Wen Yen et al.	1
11	Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) couple		Yee‐Wen Yen et al.	5
12	Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints	Journal of Materials Science Materials in Electronics	Hsuan Lee, Yee‐Wen Yen et al.	6
13	Phase equilibria in the Au–Bi–Sn ternary system at temperatures of 80, 125, and 150 °C	International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde)	Chih‐Ming Chen, Pei‐Yu Chen et al.	1
14	Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples	Journal of Electronic Materials	Yee‐Wen Yen, Chung‐Yung Lin et al.	4
15	Investigation of interfacial reactions in the Sn/Fe-xNi couple		Yee‐Wen Yen, Yishan Li et al.	1
16	Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System	Japanese Journal of Applied Physics	Yee‐Wen Yen et al.	1
17	Synthesize carbon nanotubes by a novel method using chemical vapor deposition-fluidized bed reactor from solid-stated polymers	Diamond and Related Materials	Yee‐Wen Yen et al.	23
18	Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples	Journal of Electronic Materials	Yee‐Wen Yen, Chung‐Yung Lin et al.	23
19	Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C	Intermetallics	Chung‐Yung Lin, Chiapyng Lee et al.	18
20	Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag	Journal of materials research/Pratt's guide to venture capital sources	Yee‐Wen Yen, Chiapyng Lee et al.	29

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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