Chiapyng Lee

1.7k total citations
65 papers, 1.5k citations indexed

About

Chiapyng Lee is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Chiapyng Lee has authored 65 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 28 papers in Electronic, Optical and Magnetic Materials and 20 papers in Mechanical Engineering. Recurrent topics in Chiapyng Lee's work include Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (27 papers) and Electronic Packaging and Soldering Technologies (21 papers). Chiapyng Lee is often cited by papers focused on Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (27 papers) and Electronic Packaging and Soldering Technologies (21 papers). Chiapyng Lee collaborates with scholars based in Taiwan, United States and China. Chiapyng Lee's co-authors include Yee‐Wen Yen, Yu‐Lin Kuo, Jing‐Cheng Lin, Chung‐Yung Lin, Meng‐Jiy Wang, Wei‐Bor Tsai, Wei‐Hsuan Kuo, Ta‐Chin Wei, Hsiu‐Wen Chien and Yong‐Siou Chen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Chiapyng Lee

64 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chiapyng Lee Taiwan 24 925 489 387 356 339 65 1.5k
Zhongzhen Wu China 24 910 1.0× 852 1.7× 408 1.1× 372 1.0× 544 1.6× 74 1.9k
Suihan Cui China 19 1.1k 1.2× 469 1.0× 310 0.8× 359 1.0× 326 1.0× 46 1.7k
Yuttanant Boonyongmaneerat Thailand 21 675 0.7× 734 1.5× 526 1.4× 118 0.3× 296 0.9× 82 1.4k
Viviane Turq France 17 727 0.8× 712 1.5× 299 0.8× 720 2.0× 256 0.8× 40 1.6k
İsmail Hakkı Karahan Türkiye 22 680 0.7× 887 1.8× 353 0.9× 82 0.2× 296 0.9× 103 1.5k
E. Tomasella France 24 749 0.8× 1.0k 2.1× 166 0.4× 203 0.6× 366 1.1× 81 1.5k
Sutanu Samanta India 24 479 0.5× 603 1.2× 614 1.6× 217 0.6× 365 1.1× 122 1.9k
Hejie Yang China 24 307 0.3× 516 1.1× 328 0.8× 147 0.4× 200 0.6× 41 1.3k
Shu Xiao China 19 434 0.5× 614 1.3× 301 0.8× 233 0.7× 356 1.1× 56 1.2k

Countries citing papers authored by Chiapyng Lee

Since Specialization
Citations

This map shows the geographic impact of Chiapyng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chiapyng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chiapyng Lee more than expected).

Fields of papers citing papers by Chiapyng Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chiapyng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chiapyng Lee. The network helps show where Chiapyng Lee may publish in the future.

Co-authorship network of co-authors of Chiapyng Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Chiapyng Lee. A scholar is included among the top collaborators of Chiapyng Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chiapyng Lee. Chiapyng Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kuo, Wei‐Hsuan, Meng‐Jiy Wang, Hsiu‐Wen Chien, et al.. (2011). Surface Modification with Poly(sulfobetaine methacrylate-co-acrylic acid) To Reduce Fibrinogen Adsorption, Platelet Adhesion, and Plasma Coagulation. Biomacromolecules. 12(12). 4348–4356. 131 indexed citations
2.
Yen, Yee‐Wen, et al.. (2011). Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates. Journal of Alloys and Compounds. 517. 111–117. 21 indexed citations
3.
Chien, Hsiu‐Wen, Wei‐Hsuan Kuo, Meng‐Jiy Wang, et al.. (2010). Modulation of hemocompatibility of polysulfone by polyelectrolyte multilayer films. Colloids and Surfaces B Biointerfaces. 77(2). 270–278. 21 indexed citations
4.
Lee, Chiapyng, et al.. (2008). Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs. Soldering and Surface Mount Technology. 20(3). 18–25. 7 indexed citations
5.
Yen, Yee‐Wen, et al.. (2007). Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples. Journal of Electronic Materials. 36(2). 147–158. 23 indexed citations
6.
Lin, Chung‐Yung, Chiapyng Lee, Xingjun Liu, & Yee‐Wen Yen. (2007). Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C. Intermetallics. 16(2). 230–238. 18 indexed citations
7.
Yen, Yee‐Wen, et al.. (2007). Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders. Journal of Electronic Materials. 37(1). 73–83. 36 indexed citations
8.
Yen, Yee‐Wen, et al.. (2006). Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag. Journal of materials research/Pratt's guide to venture capital sources. 21(12). 2986–2990. 29 indexed citations
9.
Kuo, Yu‐Lin, et al.. (2005). Evaluation of the thermal stability of reactively sputtered (Ti, Zr)Nx nano-thin films as diffusion barriers between Cu and Silicon. Thin Solid Films. 484(1-2). 265–271. 24 indexed citations
10.
Kuo, Yu‐Lin, Chiapyng Lee, Jing‐Cheng Lin, et al.. (2003). Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization. Electrochemical and Solid-State Letters. 6(9). C123–C123. 8 indexed citations
11.
Lee, Chiapyng, et al.. (2003). Growth of tantalum boron nitride films on Si by radio frequency reactive sputtering: effect of N2/Ar flow ratio. Materials Chemistry and Physics. 82(3). 691–697. 11 indexed citations
12.
Lee, Chiapyng, et al.. (2002). Effects of CH4/SiH4 flow ratio and microwave power on the growth of β-SiC on Si by ECR-CVD using CH4/SiH4/Ar at 200 °C. Thin Solid Films. 405(1-2). 17–22. 3 indexed citations
13.
14.
Lin, Jing‐Cheng & Chiapyng Lee. (2000). Growth of Tantalum Nitride Films on Si by Radio Frequency Reactive Sputtering of Ta in N[sub 2]/Ar Gas Mixtures: Effect of Bias. Journal of The Electrochemical Society. 147(2). 713–713. 16 indexed citations
15.
Lin, Jing‐Cheng & Chiapyng Lee. (1999). Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films. Journal of The Electrochemical Society. 146(9). 3466–3471. 53 indexed citations
16.
Cheng, Huang‐Chung, et al.. (1997). Deposition of polycrystalline β-SiC films on Si substrates at room temperature. Applied Physics Letters. 70(2). 223–225. 13 indexed citations
17.
Lin, Jing‐Cheng & Chiapyng Lee. (1997). Nucleation and growth of Cu thin films on silicon wafers deposited by radio frequency sputtering. Thin Solid Films. 307(1-2). 96–99. 13 indexed citations
18.
Lee, Chiapyng, et al.. (1997). Effect of precursor solution composition on lead titanate thin films prepared by a sol-gel method. Materials Chemistry and Physics. 51(2). 147–151. 5 indexed citations
19.
Lin, Jing‐Cheng, et al.. (1996). Interdiffusion and reactions in the Cu/TiN/Si thin film system. Applied Surface Science. 92. 335–339. 6 indexed citations
20.
Lee, Chiapyng, et al.. (1995). Atomic force microscopy and Raman spectroscopy studies on the oxidation of Cu thin films. Journal of Applied Physics. 77(10). 5422–5425. 149 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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