Yongping Lei
- Mechanical Engineering top 0.2%
- Electrical and Electronic Engineering top 5%
- Materials Chemistry top 5%
- Mechanics of Materials top 1%
- Aerospace Engineering top 2%
- Topics
- Electronic Packaging and Soldering Technologies (62 papers)Metal Alloys Wear and Properties (39 papers)Advanced Welding Techniques Analysis (38 papers)
In The Last Decade
Yongping Lei
184 papers receiving 4.1k citations
Peers
Comparison fields: 5 of 68
- Mechanical Engineering 3.7k
- Electrical and Electronic Engineering 1.2k
- Materials Chemistry 1.1k
- Mechanics of Materials 767
- Aerospace Engineering 574
Countries citing papers authored by Yongping Lei
This map shows the geographic impact of Yongping Lei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yongping Lei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yongping Lei more than expected).
Fields of papers citing papers by Yongping Lei
This network shows the impact of papers produced by Yongping Lei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yongping Lei. The network helps show where Yongping Lei may publish in the future.
Co-authorship network of co-authors of Yongping Lei
This figure shows the co-authorship network connecting the top 25 collaborators of Yongping Lei. A scholar is included among the top collaborators of Yongping Lei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yongping Lei. Yongping Lei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 14 | |
| 3 | 19 | |
| 4 | A Detailed Analysis on the Microstructure and Compressive Properties of Selective Laser Melted Ti6Al4V Lattice Structures | 2 |
| 5 | Effect of aluminum content on solidification structure and hardness of Fe-12Cr-1.5B-Al alloy | 4 |
| 6 | 3 | |
| 7 | 4 | |
| 8 | Development of an alcohol-based low solid content no-clean flux | 1 |
| 9 | Effect of Boron Content on the Structure and Property of Fe-B-C Alloy | 7 |
| 10 | Effects of Surface-Active Elements Sulfur on Flow Patterns of Welding Pool | 4 |
| 11 | 5 | |
| 12 | Mechanism of tin whisker morphology | 2 |
| 13 | Numerical analysis of two-way interaction between weld-pool and arc for GTA welding process | 2 |
| 14 | STUDY ON THE RELATIONSHIP BETWEEN MAGNETIC FIELD AND RESIDUAL STRESS IN STEEL MATERIALS | 2 |
| 15 | STUDY ON THE RELATIONSHIP BETWEEN MAGNETOVIBRATION AND RESIDUAL STRESS IN STEEL MATERIALS | 1 |
| 16 | Effects of Process Condition on Morphologies of Intermetallic Compounds in Ni Particle Reinforced Lead-free Composite Solder | 3 |
| 17 | Study on tin whisker growth of SnAgCuLa solder alloy surface | 1 |
| 18 | Effect of the microelements on the oxidation-resistance of Sn-0.7Cu lead-free solder | 2 |
| 19 | Pneumatic Separation Research of Printed Circuit Board Scrap | 0 |
| 20 | NUMERICAL ANALYSIS OF THE TWO-WAY INTERACTION BETWEEN A MUTUALLY COUPLED WELD-POOL AND WELDARC FOR GTA WELDING PROCESS | 1 |
About Yongping Lei
Yongping Lei is a scholar working on Mechanical Engineering, Metals and Alloys and Mechanics of Materials, having authored 188 papers that have together received 4.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (62 papers), Metal Alloys Wear and Properties (39 papers) and Advanced Welding Techniques Analysis (38 papers). The work is most often cited by research in Mechanical Engineering (3.7k citations), Metals and Alloys (146 citations) and General Materials Science (114 citations). Yongping Lei has collaborated with scholars based in China, Japan and Ireland. Frequent co-authors include Hanguang Fu, Yao Shi, Jian Lin, Zhidong Xia, Fu Guo, Xiaoyan Li, Jinguo Ge, Hidekazu Murakawa, Yinghua Lin and Ninshu Ma. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Science and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.