Yongping Lei

4.9k total citations
188 papers, 4.2k citations indexed

About

Yongping Lei is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Yongping Lei has authored 188 papers receiving a total of 4.2k indexed citations (citations by other indexed papers that have themselves been cited), including 158 papers in Mechanical Engineering, 70 papers in Electrical and Electronic Engineering and 54 papers in Materials Chemistry. Recurrent topics in Yongping Lei's work include Electronic Packaging and Soldering Technologies (62 papers), Metal Alloys Wear and Properties (39 papers) and Advanced Welding Techniques Analysis (38 papers). Yongping Lei is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), Metal Alloys Wear and Properties (39 papers) and Advanced Welding Techniques Analysis (38 papers). Yongping Lei collaborates with scholars based in China, Japan and Ireland. Yongping Lei's co-authors include Hanguang Fu, Yao Shi, Jian Lin, Zhidong Xia, Fu Guo, Xiaoyan Li, Jinguo Ge, Hidekazu Murakawa, Yinghua Lin and Ninshu Ma and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Applied Surface Science.

In The Last Decade

Yongping Lei

184 papers receiving 4.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yongping Lei China 37 3.7k 1.2k 1.1k 767 574 188 4.2k
Zhishui Yu China 40 3.5k 0.9× 540 0.4× 1.1k 1.0× 960 1.3× 853 1.5× 164 4.3k
Ninshu Ma Japan 40 4.2k 1.1× 273 0.2× 1.2k 1.0× 1.2k 1.5× 931 1.6× 239 5.2k
Yukio MIYASHITA Japan 30 2.3k 0.6× 615 0.5× 785 0.7× 842 1.1× 652 1.1× 162 2.9k
Blair E. Carlson United States 39 4.7k 1.3× 294 0.2× 782 0.7× 1.3k 1.7× 1.4k 2.4× 185 5.3k
Sansan Ao China 28 1.9k 0.5× 519 0.4× 660 0.6× 283 0.4× 353 0.6× 100 2.3k
Hao Lü China 27 1.7k 0.5× 617 0.5× 702 0.6× 457 0.6× 220 0.4× 134 2.4k
Zhen Luo China 35 2.9k 0.8× 556 0.5× 651 0.6× 583 0.8× 901 1.6× 159 3.3k
F. Khodabakhshi Iran 45 5.3k 1.4× 365 0.3× 2.1k 1.9× 656 0.9× 1.2k 2.1× 118 5.7k
Ru Lin Peng Sweden 40 4.1k 1.1× 412 0.3× 1.8k 1.6× 836 1.1× 1.1k 1.9× 185 4.9k
Auezhan Amanov South Korea 34 3.2k 0.9× 220 0.2× 1.8k 1.6× 1.7k 2.3× 302 0.5× 155 3.8k

Countries citing papers authored by Yongping Lei

Since Specialization
Citations

This map shows the geographic impact of Yongping Lei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yongping Lei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yongping Lei more than expected).

Fields of papers citing papers by Yongping Lei

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yongping Lei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yongping Lei. The network helps show where Yongping Lei may publish in the future.

Co-authorship network of co-authors of Yongping Lei

This figure shows the co-authorship network connecting the top 25 collaborators of Yongping Lei. A scholar is included among the top collaborators of Yongping Lei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yongping Lei. Yongping Lei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Wenqian, et al.. (2024). Study on the effect of anti-oxidation film formed by composite system on solder balls performance. Microelectronics Reliability. 155. 115367–115367. 2 indexed citations
2.
Liu, Shuai, et al.. (2023). A review of welding simulation methods for large components. Progress in Natural Science Materials International. 33(5). 551–568. 14 indexed citations
3.
Lin, Jian, et al.. (2021). Additively manufactured δ-ferrite-free 410 stainless steel with desirable performance. Materials Letters. 293. 129579–129579. 19 indexed citations
4.
Ge, Jinguo, Xingchen Yan, Yongping Lei, et al.. (2020). A Detailed Analysis on the Microstructure and Compressive Properties of Selective Laser Melted Ti6Al4V Lattice Structures. SSRN Electronic Journal. 2 indexed citations
5.
Ju, Jiang, et al.. (2016). Effect of aluminum content on solidification structure and hardness of Fe-12Cr-1.5B-Al alloy. 37(9). 138. 4 indexed citations
6.
Lü, Wei, Yao Shi, Xiaoyan Li, & Yongping Lei. (2013). Fracture assessment for electron beam welded damage tolerant Ti-6Al-4V alloy by the FITNET procedure. Chinese Journal of Mechanical Engineering. 26(5). 1013–1021. 3 indexed citations
7.
Lü, Wei, Yao Shi, Xiaoyan Li, & Yongping Lei. (2012). Limit load solution for electron beam welded joints with single edge weld center crack in tension. Chinese Journal of Mechanical Engineering. 25(3). 624–628. 4 indexed citations
8.
Lei, Yongping. (2011). Development of an alcohol-based low solid content no-clean flux. Electronic Components and Materials. 1 indexed citations
9.
Lei, Yongping. (2011). Effect of Boron Content on the Structure and Property of Fe-B-C Alloy. Rejiagong gongyi. 7 indexed citations
10.
Lei, Yongping, et al.. (2009). Effects of Surface-Active Elements Sulfur on Flow Patterns of Welding Pool. Journal of Material Science and Technology. 21(3). 408–414. 4 indexed citations
11.
Tai, Feng, Fu Guo, Zhidong Xia, Yongping Lei, & Yao Shi. (2009). Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints. International Journal of Minerals Metallurgy and Materials. 16(6). 677–684. 5 indexed citations
12.
Lei, Yongping. (2009). Mechanism of tin whisker morphology. The Chinese Journal of Nonferrous Metals. 2 indexed citations
13.
Lei, Yongping, et al.. (2009). Numerical analysis of two-way interaction between weld-pool and arc for GTA welding process. Journal of Material Science and Technology. 17(1). 171–172. 2 indexed citations
14.
Lin, Jian, Haiyan Zhao, Zhipeng Cai, & Yongping Lei. (2009). STUDY ON THE RELATIONSHIP BETWEEN MAGNETIC FIELD AND RESIDUAL STRESS IN STEEL MATERIALS. Acta Metallurgica Sinica. 44(4). 451–456. 2 indexed citations
15.
Lei, Yongping. (2008). STUDY ON THE RELATIONSHIP BETWEEN MAGNETOVIBRATION AND RESIDUAL STRESS IN STEEL MATERIALS. Acta Metallurgica Sinica. 1 indexed citations
16.
Lei, Yongping. (2008). Effects of Process Condition on Morphologies of Intermetallic Compounds in Ni Particle Reinforced Lead-free Composite Solder. 3 indexed citations
17.
Lei, Yongping. (2008). Study on tin whisker growth of SnAgCuLa solder alloy surface. Electronic Components and Materials. 1 indexed citations
18.
Lei, Yongping. (2007). Effect of the microelements on the oxidation-resistance of Sn-0.7Cu lead-free solder. Electronic Components and Materials. 2 indexed citations
19.
Lei, Yongping. (2006). Pneumatic Separation Research of Printed Circuit Board Scrap.
20.
Lei, Yongping. (2001). NUMERICAL ANALYSIS OF THE TWO-WAY INTERACTION BETWEEN A MUTUALLY COUPLED WELD-POOL AND WELDARC FOR GTA WELDING PROCESS. Acta Metallurgica Sinica. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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