Limin Ma

739 total citations
73 papers, 570 citations indexed

About

Limin Ma is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Limin Ma has authored 73 papers receiving a total of 570 indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 39 papers in Mechanical Engineering and 12 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Limin Ma's work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (32 papers) and Advanced Welding Techniques Analysis (15 papers). Limin Ma is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (32 papers) and Advanced Welding Techniques Analysis (15 papers). Limin Ma collaborates with scholars based in China, United States and Singapore. Limin Ma's co-authors include Fu Guo, Fu Guo, Xitao Wang, Sihan Liu, Yishu Wang, Jing Han, Shuyuan Ma, Jing Guo, Cheng Chen and Jiping Lu and has published in prestigious journals such as Journal of Applied Physics, Applied Energy and Computer Methods in Applied Mechanics and Engineering.

In The Last Decade

Limin Ma

59 papers receiving 562 citations

Peers

Limin Ma
Bálint Medgyes Hungary
Lizhuang Yang China
Keisuke Uenishi Japan
Anna Wierzbicka-Miernik Poland
Weimin Long China
Feng Ye China
J. K. Shang United States
Wan Fahmin Faiz Wan Ali Malaysia
Annie Gagnoud China
O Minho Japan
Bálint Medgyes Hungary
Limin Ma
Citations per year, relative to Limin Ma Limin Ma (= 1×) peers Bálint Medgyes

Countries citing papers authored by Limin Ma

Since Specialization
Citations

This map shows the geographic impact of Limin Ma's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Limin Ma with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Limin Ma more than expected).

Fields of papers citing papers by Limin Ma

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Limin Ma. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Limin Ma. The network helps show where Limin Ma may publish in the future.

Co-authorship network of co-authors of Limin Ma

This figure shows the co-authorship network connecting the top 25 collaborators of Limin Ma. A scholar is included among the top collaborators of Limin Ma based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Limin Ma. Limin Ma is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Zhang, Zhilang, et al.. (2025). GPU-accelerated multi-phase, multi-resolution SPH method with ray tracing for laser powder bed fusion. Computer Methods in Applied Mechanics and Engineering. 448. 118423–118423.
3.
Jia, Qiang, et al.. (2025). Composition design for laser powder bed fusion (LPBF) fabricated Ni-based superalloys: A review. Journal of Manufacturing Processes. 155. 119–136.
4.
Hu, Huan, Qiang Jia, Ruochen Liu, et al.. (2025). Rapid in-situ formation of Cu-Sn full intermetallic compound films and their joint strengthening mechanisms. Materials & Design. 256. 114241–114241.
5.
Qiu, Shujun, Guangyao Li, Yiming Wang, et al.. (2025). Core-shell structured nickel glycerolate spheres @ amorphous ZIF-67 nanosheets to enhance electrochemical performance of supercapacitors. Journal of Energy Storage. 114. 115736–115736. 2 indexed citations
6.
Cui, Zhe, Qiang Jia, Xu Gao, et al.. (2025). Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles. Journal of Materials Science Materials in Electronics. 36(16).
7.
Hu, Huan, Qiang Jia, Yishu Wang, et al.. (2024). Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging. Journal of Materials Processing Technology. 329. 118438–118438. 4 indexed citations
8.
Jia, Qiang, et al.. (2024). Ag-Pd nanoalloy film with ultra-high thermal and electrochemical stability for power electronic packaging. Materials Today Communications. 41. 110791–110791.
9.
Jia, Qiang, Yishu Wang, Dan Li, et al.. (2024). Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging. Journal of Laser Applications. 36(2). 2 indexed citations
10.
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Ma, Limin, et al.. (2024). The Future of Solar Energy in Developing Countries. Asian Journal of Environment & Ecology. 23(12). 149–164.
12.
Ma, Limin, et al.. (2023). Pressure dependence of mechanical and thermodynamic properties of Al2Si4Sr3: A first-principles study. Computational and Theoretical Chemistry. 1230. 114400–114400. 1 indexed citations
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Jia, Qiang, Zhongyang Deng, Lei Liu, et al.. (2023). Interface enhancing strategy for low-temperature bonding of Ag-based nanoalloy. Materials Letters. 339. 134050–134050. 1 indexed citations
15.
Han, Jing, et al.. (2023). Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu. Journal of Materials Science Materials in Electronics. 34(3).
16.
Zhao, Jin, Qiang Jia, Yuxiang Wang, et al.. (2023). Effect of electric pulse incubation melt on solidified microstructures and mechanical properties of Sn58Bi alloy. Journal of Materials Science Materials in Electronics. 34(30). 1 indexed citations
17.
Jia, Qiang, Guisheng Zou, Hongqiang Zhang, et al.. (2022). Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging. Applied Surface Science. 612. 155663–155663. 14 indexed citations
18.
Wang, Yishu, et al.. (2020). Effect of grain boundary on failure behavior of SABI333 solder joints during creep. Journal of Materials Science Materials in Electronics. 31(6). 5017–5024. 1 indexed citations
19.
Ma, Limin, et al.. (2015). WHISKER MITIGATION FOR Sn-BASED Pb-FREE SOLDERS BY POSS ADDITION. Acta Metallurgica Sinica. 51(6). 685–692. 3 indexed citations
20.
Ma, Limin, et al.. (2010). CENTRIFUGAL MODEL TESTS FOR RESPONSES OF SHALLOW-BURIED UNDERGROUND STRUCTURES UNDER SURFACE BLASTING. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 29. 3672. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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