Chi-Yang Yu
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Aerospace Engineering
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Topics
- Electronic Packaging and Soldering Technologies (15 papers)3D IC and TSV technologies (11 papers)Advanced Welding Techniques Analysis (10 papers)
- Journals
- Journal of The Electrochemical SocietyMaterials Science and Engineering AJournal of Materials Science
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Chi-Yang Yu
17 papers receiving 389 citations
Peers
Comparison fields: 5 of 20
- Electrical and Electronic Engineering 367
- Mechanical Engineering 309
- Aerospace Engineering 52
- Materials Chemistry 26
- Electronic, Optical and Magnetic Materials 22
Countries citing papers authored by Chi-Yang Yu
This map shows the geographic impact of Chi-Yang Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chi-Yang Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chi-Yang Yu more than expected).
Fields of papers citing papers by Chi-Yang Yu
This network shows the impact of papers produced by Chi-Yang Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chi-Yang Yu. The network helps show where Chi-Yang Yu may publish in the future.
Co-authorship network of co-authors of Chi-Yang Yu
This figure shows the co-authorship network connecting the top 25 collaborators of Chi-Yang Yu. A scholar is included among the top collaborators of Chi-Yang Yu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chi-Yang Yu. Chi-Yang Yu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 13 | |
| 2 | 18 | |
| 3 | 11 | |
| 4 | 11 | |
| 5 | 35 | |
| 6 | 21 | |
| 7 | 21 | |
| 8 | 24 | |
| 9 | 36 | |
| 10 | 27 | |
| 11 | 8 | |
| 12 | 59 | |
| 13 | 8 | |
| 14 | 34 | |
| 15 | 49 | |
| 16 | 11 | |
| 17 | 11 | |
| 18 | 2 |
About Chi-Yang Yu
Chi-Yang Yu is a scholar working on Mechanical Engineering, General Materials Science and Electrical and Electronic Engineering, having authored 18 papers that have together received 399 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (10 papers). The work is most often cited by research in Mechanical Engineering (309 citations), Electrical and Electronic Engineering (367 citations) and General Materials Science (18 citations). Chi-Yang Yu has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Jenq‐Gong Duh, Wei-Yu Chen, Kuo-Chuan Liu, Wei-Yu Chen, Tae-Kyu Lee, Wenlin Chen, Juan Pu, Haiming Lu, Wen‐Cai Lu and Joseph Lee. Their work appears in journals such as Journal of The Electrochemical Society, Materials Science and Engineering A and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.