Zhidong Xia
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Biomedical Engineering top 10%
- Aerospace Engineering top 5%
- Polymers and Plastics top 10%
- Topics
- Electronic Packaging and Soldering Technologies (50 papers)3D IC and TSV technologies (25 papers)Aluminum Alloys Composites Properties (22 papers)
- Partner nations
- ChinaUnited States
In The Last Decade
Zhidong Xia
82 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 1.3k
- Mechanical Engineering 1.2k
- Biomedical Engineering 264
- Aerospace Engineering 196
- Polymers and Plastics 144
Countries citing papers authored by Zhidong Xia
This map shows the geographic impact of Zhidong Xia's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhidong Xia with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhidong Xia more than expected).
Fields of papers citing papers by Zhidong Xia
This network shows the impact of papers produced by Zhidong Xia. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhidong Xia. The network helps show where Zhidong Xia may publish in the future.
Co-authorship network of co-authors of Zhidong Xia
This figure shows the co-authorship network connecting the top 25 collaborators of Zhidong Xia. A scholar is included among the top collaborators of Zhidong Xia based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhidong Xia. Zhidong Xia is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 4 | |
| 3 | 6 | |
| 4 | 4 | |
| 5 | 8 | |
| 6 | 9 | |
| 7 | 5 | |
| 8 | 11 | |
| 9 | Vacuum brazing TA15 titanium alloy with Ti-based amorphous filler metal | 1 |
| 10 | 5 | |
| 11 | CORROSION BEHAVIOR OF TIN-ZINC BASED ALLOY SOLDER | 1 |
| 12 | 11 | |
| 13 | Reliability evaluation of VOC-free no-clean flux residues | 0 |
| 14 | Microstructure and performance of SnAgCuEr lead-free solders with rare earth | 1 |
| 15 | 39 | |
| 16 | Effect of Rare Earth Element Er on Microstructure and Properties of AlSi-Cu Solder Alloy | 1 |
| 17 | The influence of temperature on creep behavior of Cu particles enhanced SnPb based composite solder | 1 |
| 18 | 8 | |
| 19 | Effect of Mixed Rare Earth on the Properties of SnAgCu Lead-free Solder Alloy | 2 |
| 20 | 80 |
About Zhidong Xia
Zhidong Xia is a scholar working on General Materials Science, Mechanical Engineering and Polymers and Plastics, having authored 83 papers that have together received 1.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (22 papers). The work is most often cited by research in General Materials Science (125 citations), Mechanical Engineering (1.2k citations) and Electrical and Electronic Engineering (1.3k citations). Zhidong Xia has collaborated with scholars based in China and United States. Frequent co-authors include Yao Shi, Yongping Lei, Fu Guo, Fu Guo, Hao Hu, Xiaoyan Li, Zhi‐Gang Chen, Yuling Yan, Yanfu Yan and Jun Tian. Their work appears in journals such as Journal of Materials Science, Journal of Alloys and Compounds and Materials & Design.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.