Zhidong Xia

2.0k total citations
83 papers, 1.7k citations indexed

About

Zhidong Xia is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Zhidong Xia has authored 83 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 49 papers in Mechanical Engineering and 20 papers in Biomedical Engineering. Recurrent topics in Zhidong Xia's work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (22 papers). Zhidong Xia is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (22 papers). Zhidong Xia collaborates with scholars based in China and United States. Zhidong Xia's co-authors include Yao Shi, Yongping Lei, Fu Guo, Fu Guo, Hao Hu, Xiaoyan Li, Zhi‐Gang Chen, Yuling Yan, Yanfu Yan and Jun Tian and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Materials & Design.

In The Last Decade

Zhidong Xia

82 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Zhidong Xia China 23 1.3k 1.2k 264 196 144 83 1.7k
Feng Ji China 21 454 0.3× 1.1k 0.9× 238 0.9× 369 1.9× 131 0.9× 58 1.5k
Zhiwu Xu China 23 468 0.4× 1.4k 1.2× 334 1.3× 628 3.2× 98 0.7× 92 1.9k
L.C. Tsao Taiwan 28 1.5k 1.2× 1.9k 1.7× 199 0.8× 470 2.4× 33 0.2× 80 2.4k
Kyung W. Paik South Korea 17 726 0.6× 302 0.3× 283 1.1× 92 0.5× 135 0.9× 58 1.1k
Ming‐Chuen Yip Taiwan 20 305 0.2× 382 0.3× 363 1.4× 139 0.7× 324 2.3× 61 1.3k
Shaoming Dong China 22 216 0.2× 593 0.5× 335 1.3× 175 0.9× 130 0.9× 69 1.3k
Xuan Su China 16 373 0.3× 390 0.3× 141 0.5× 76 0.4× 298 2.1× 38 1.0k
Zechao Tao China 21 272 0.2× 574 0.5× 137 0.5× 124 0.6× 142 1.0× 54 1.3k
Jiayun Feng China 19 712 0.5× 464 0.4× 440 1.7× 81 0.4× 172 1.2× 60 1.2k
Hangyu Zhu China 18 257 0.2× 593 0.5× 625 2.4× 99 0.5× 227 1.6× 74 1.2k

Countries citing papers authored by Zhidong Xia

Since Specialization
Citations

This map shows the geographic impact of Zhidong Xia's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhidong Xia with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhidong Xia more than expected).

Fields of papers citing papers by Zhidong Xia

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zhidong Xia. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhidong Xia. The network helps show where Zhidong Xia may publish in the future.

Co-authorship network of co-authors of Zhidong Xia

This figure shows the co-authorship network connecting the top 25 collaborators of Zhidong Xia. A scholar is included among the top collaborators of Zhidong Xia based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhidong Xia. Zhidong Xia is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Xing, Yu, et al.. (2025). Fabric resistive and capacitive sensors using wet-spinning wire of conductive silicone rubber. Sensors and Actuators A Physical. 387. 116426–116426. 4 indexed citations
2.
Xia, Zhidong, et al.. (2023). Investigation of EPET, EPEI, and EPU pyrolysis characteristics: Thermal decomposition behaviours, pyrolysis products and mechanism. Journal of Analytical and Applied Pyrolysis. 175. 106203–106203. 4 indexed citations
3.
Gao, Qian, et al.. (2023). Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste. Journal of Materials Science Materials in Electronics. 34(21). 6 indexed citations
4.
Xia, Zhidong, et al.. (2023). Simplified finite element method for resistance response of graphene composites considering size distribution and agglomeration. Journal of Materials Science. 58(40). 15696–15713. 4 indexed citations
5.
Wang, Xiaolu, et al.. (2023). Effects of Copper(II) Oxide on the Co-Pyrolysis of Waste Polyester Enameled Wires and Poly(vinyl chloride). Polymers. 16(1). 27–27. 8 indexed citations
6.
Xia, Zhidong, et al.. (2022). An embedded printed flexible strain resistance sensor via micro-structure design on graphene-filled conductive silicon rubber. Smart Materials and Structures. 31(11). 115017–115017. 9 indexed citations
7.
Xia, Zhidong, et al.. (2022). Structural design of flexible interdigital capacitor based upon 3D printing and spraying process. Smart Materials and Structures. 31(4). 45005–45005. 5 indexed citations
8.
Gao, Mu, et al.. (2019). Fabrication of a flexible capacitor sensor with surface-fabric-structured conductive silicon rubber. Sensors and Actuators A Physical. 295. 141–150. 11 indexed citations
9.
Xia, Zhidong, et al.. (2012). Vacuum brazing TA15 titanium alloy with Ti-based amorphous filler metal. Materials Science and Technology. 20(3). 67–71. 1 indexed citations
10.
Tai, Feng, Fu Guo, Zhidong Xia, Yongping Lei, & Yao Shi. (2009). Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints. International Journal of Minerals Metallurgy and Materials. 16(6). 677–684. 5 indexed citations
11.
Xia, Zhidong, et al.. (2009). CORROSION BEHAVIOR OF TIN-ZINC BASED ALLOY SOLDER. Zhongguo fushi yu fanghu xuebao. 23(4). 234–238. 1 indexed citations
12.
Guo, Fu, Mengke Zhao, Zhidong Xia, et al.. (2009). Lead-free solders with rare earth additions. JOM. 61(6). 39–44. 11 indexed citations
13.
Xia, Zhidong. (2008). Reliability evaluation of VOC-free no-clean flux residues. Electronic Components and Materials.
14.
Xia, Zhidong. (2008). Microstructure and performance of SnAgCuEr lead-free solders with rare earth. Materials Science and Technology. 1 indexed citations
15.
Hu, Hao, Yao Shi, Zhidong Xia, Yongping Lei, & Fu Guo. (2007). Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging. Journal of Electronic Materials. 37(1). 2–8. 39 indexed citations
16.
Xia, Zhidong. (2006). Effect of Rare Earth Element Er on Microstructure and Properties of AlSi-Cu Solder Alloy. Journal of Beijing University of Technology. 1 indexed citations
17.
Xia, Zhidong. (2004). The influence of temperature on creep behavior of Cu particles enhanced SnPb based composite solder. Materials Science and Technology. 1 indexed citations
18.
Yan, Yanfu, Jianping Liu, Yao Shi, & Zhidong Xia. (2004). Study on Cu particles-enhanced SnPb composite solder. Journal of Electronic Materials. 33(3). 218–223. 8 indexed citations
19.
Xia, Zhidong. (2003). Effect of Mixed Rare Earth on the Properties of SnAgCu Lead-free Solder Alloy. 2 indexed citations
20.
Xia, Zhidong, et al.. (2002). Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder. Journal of Electronic Materials. 31(6). 564–567. 80 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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