Fu Guo

2.5k total citations
142 papers, 2.0k citations indexed

About

Fu Guo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Fu Guo has authored 142 papers receiving a total of 2.0k indexed citations (citations by other indexed papers that have themselves been cited), including 109 papers in Electrical and Electronic Engineering, 80 papers in Mechanical Engineering and 18 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Fu Guo's work include Electronic Packaging and Soldering Technologies (104 papers), 3D IC and TSV technologies (59 papers) and Advanced Welding Techniques Analysis (34 papers). Fu Guo is often cited by papers focused on Electronic Packaging and Soldering Technologies (104 papers), 3D IC and TSV technologies (59 papers) and Advanced Welding Techniques Analysis (34 papers). Fu Guo collaborates with scholars based in China, United States and Hong Kong. Fu Guo's co-authors include Yao Shi, Yongping Lei, Zhidong Xia, Jing Han, Yufeng Wu, K. N. Subramanian, J. P. Lucas, Limin Ma, Guangchen Xu and Xiaoyan Li and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Applied Energy.

In The Last Decade

Fu Guo

131 papers receiving 2.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fu Guo China 26 1.6k 1.5k 209 193 181 142 2.0k
Tadashi Takemoto Japan 24 1.1k 0.7× 1.1k 0.8× 240 1.1× 182 0.9× 67 0.4× 115 1.7k
Fengshun Wu China 20 954 0.6× 728 0.5× 80 0.4× 102 0.5× 14 0.1× 119 1.4k
Pengting Li China 23 401 0.3× 1.2k 0.8× 623 3.0× 173 0.9× 74 0.4× 110 1.6k
Mohd Arif Anuar Mohd Salleh Malaysia 19 720 0.5× 588 0.4× 129 0.6× 49 0.3× 20 0.1× 138 1.3k
M. Goodarzi Iran 23 246 0.2× 1.6k 1.1× 241 1.2× 358 1.9× 127 0.7× 44 1.8k
Zhansheng Guo China 25 1.2k 0.7× 508 0.4× 26 0.1× 332 1.7× 29 0.2× 116 1.9k
Yanfei Wang China 29 264 0.2× 2.5k 1.7× 565 2.7× 548 2.8× 38 0.2× 81 3.1k
Xiaowei Zhang China 16 612 0.4× 1.1k 0.8× 84 0.4× 217 1.1× 34 0.2× 38 1.6k

Countries citing papers authored by Fu Guo

Since Specialization
Citations

This map shows the geographic impact of Fu Guo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fu Guo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fu Guo more than expected).

Fields of papers citing papers by Fu Guo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fu Guo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fu Guo. The network helps show where Fu Guo may publish in the future.

Co-authorship network of co-authors of Fu Guo

This figure shows the co-authorship network connecting the top 25 collaborators of Fu Guo. A scholar is included among the top collaborators of Fu Guo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fu Guo. Fu Guo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhao, Kang, et al.. (2025). Study the coupling relationship between dielectric constant and breakdown strength in PVDF-based dielectric flexible composites. Journal of Materials Science Materials in Electronics. 36(6).
2.
Zhou, Jiawei, et al.. (2025). Plane odd elasticity problems: Failure of Saint-Venant’s principle. International Journal of Solids and Structures. 319. 113459–113459. 1 indexed citations
3.
Wang, Yishu, et al.. (2025). Atomic insight into the interfacial reactions in Ni-Sn-Cu systems: A TEM and molecular dynamic study. Applied Surface Science. 705. 163507–163507. 1 indexed citations
4.
5.
Liu, Aiwei, et al.. (2024). Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging. Engineering Fracture Mechanics. 307. 110265–110265. 1 indexed citations
6.
Wang, Xiaolu, et al.. (2024). One‐Pot Polyol Syntheses of Ag Right Bipyramids and Nanocubes, and their Surface‐Enhanced Raman Scattering Properties. Particle & Particle Systems Characterization. 42(5). 1 indexed citations
7.
Liu, Aiwei, et al.. (2024). Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field. Journal of Materials Processing Technology. 326. 118345–118345. 3 indexed citations
8.
9.
10.
Wang, Xiaolu, et al.. (2023). Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods. Crystal Growth & Design. 23(3). 1455–1465. 8 indexed citations
11.
Wang, Xiaolu, et al.. (2023). Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition. Journal of Material Cycles and Waste Management. 25(2). 1108–1119. 9 indexed citations
12.
An, Rong, et al.. (2023). Anisotropy of hardness and impression morphology in body-centered tetragonal tin (Sn) at cryogenic temperature and room temperature. Journal of Materials Science Materials in Electronics. 34(4). 3 indexed citations
13.
Ma, Limin, et al.. (2015). WHISKER MITIGATION FOR Sn-BASED Pb-FREE SOLDERS BY POSS ADDITION. Acta Metallurgica Sinica. 51(6). 685–692. 3 indexed citations
14.
Guo, Fu. (2012). Flexural Behavior and Bearing Capacity Calculation of RC Beams Strengthened with Reinforced High Performance Mortar. Zhongguo gonglu xuebao. 2 indexed citations
15.
Guo, Fu. (2009). Tin whisker growth accelerated by the oxidization of RE-phase on lead-free solder surface. Electronic Components and Materials. 1 indexed citations
16.
Guo, Fu. (2008). Progress of study on electromigration reliability in lead-free solder. Electronic Components and Materials. 1 indexed citations
17.
Guo, Fu. (2008). Experimental study on shear behavior of steel-concrete composite beams under negative moment. Jianzhu jiegou xuebao. 1 indexed citations
18.
Guo, Fu. (2008). Electromigration suppressing effect of Ni particle on SnBi soldering point. Electronic Components and Materials. 3 indexed citations
19.
Guo, Fu. (2008). Wettability evaluation of new soldering fluxes for Sn-Zn lead-free solder. Journal of Functional Biomaterials. 1 indexed citations
20.
Guo, Fu. (2007). Electromigration behavior of SnAgCu lead-free soldering point. Electronic Components and Materials. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Tadashi Takemoto Breakdown of academic impact, for papers by Fengshun Wu Breakdown of academic impact, for papers by Pengting Li Breakdown of academic impact, for papers by Mohd Arif Anuar Mohd Salleh Breakdown of academic impact, for papers by M. Goodarzi Breakdown of academic impact, for papers by Zhansheng Guo Breakdown of academic impact, for papers by Yanfei Wang Breakdown of academic impact, for papers by Xiaowei Zhang
Rankless by CCL
2026