G.Q. Zhang

1.7k total citations
87 papers, 1.2k citations indexed

About

G.Q. Zhang is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, G.Q. Zhang has authored 87 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 58 papers in Electrical and Electronic Engineering, 26 papers in Mechanics of Materials and 14 papers in Mechanical Engineering. Recurrent topics in G.Q. Zhang's work include Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (20 papers) and Mechanical Behavior of Composites (13 papers). G.Q. Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (20 papers) and Mechanical Behavior of Composites (13 papers). G.Q. Zhang collaborates with scholars based in Netherlands, China and United States. G.Q. Zhang's co-authors include W.D. van Driel, L.J. Ernst, Sau Koh, Xuejun Fan, Daoguo Yang, M. Yazdan Mehr, K.M.B. Jansen, H.J.L. Bressers, Michael Graef and C. YUAN and has published in prestigious journals such as Optics Express, Applied Thermal Engineering and Reliability Engineering & System Safety.

In The Last Decade

G.Q. Zhang

85 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G.Q. Zhang Netherlands 21 789 302 297 215 162 87 1.2k
G. Q. Zhang Netherlands 16 533 0.7× 266 0.9× 218 0.7× 137 0.6× 108 0.7× 50 844
Sau Koh Netherlands 19 530 0.7× 210 0.7× 121 0.4× 281 1.3× 117 0.7× 52 975
Chun‐Yao Hsu Taiwan 24 703 0.9× 342 1.1× 340 1.1× 52 0.2× 193 1.2× 91 1.4k
Henning Heuer Germany 14 357 0.5× 369 1.2× 326 1.1× 33 0.2× 224 1.4× 69 1.1k
Zhifang Zhang China 22 354 0.4× 520 1.7× 275 0.9× 113 0.5× 151 0.9× 86 1.4k
Tae‐Woo Kim South Korea 19 1.3k 1.6× 72 0.2× 156 0.5× 143 0.7× 331 2.0× 133 1.6k
Hongguang Wang China 22 364 0.5× 58 0.2× 348 1.2× 86 0.4× 303 1.9× 150 1.4k
Frederick R. Phelan United States 23 265 0.3× 637 2.1× 579 1.9× 56 0.3× 353 2.2× 38 1.8k
Tao Jin China 19 407 0.5× 107 0.4× 367 1.2× 91 0.4× 292 1.8× 84 1.2k
Ritesh Bhat India 15 409 0.5× 81 0.3× 185 0.6× 38 0.2× 91 0.6× 67 859

Countries citing papers authored by G.Q. Zhang

Since Specialization
Citations

This map shows the geographic impact of G.Q. Zhang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G.Q. Zhang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G.Q. Zhang more than expected).

Fields of papers citing papers by G.Q. Zhang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G.Q. Zhang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G.Q. Zhang. The network helps show where G.Q. Zhang may publish in the future.

Co-authorship network of co-authors of G.Q. Zhang

This figure shows the co-authorship network connecting the top 25 collaborators of G.Q. Zhang. A scholar is included among the top collaborators of G.Q. Zhang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G.Q. Zhang. G.Q. Zhang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Wenkang, Peixuan Li, Lijun Lei, et al.. (2025). Experimental study on the performance of polypropylene film-type indirect evaporative cooling core. Applied Thermal Engineering. 279. 127567–127567.
2.
Zhang, G.Q., et al.. (2024). Dora: A Low-Latency Partial Reconfiguration Controller for Reconfigurable System. IEEE Transactions on Circuits & Systems II Express Briefs. 72(1). 268–272. 2 indexed citations
3.
Mehr, M. Yazdan, W.D. van Driel, Sau Koh, & G.Q. Zhang. (2014). Reliability and optical properties of LED lens plates under high temperature stress. Microelectronics Reliability. 54(11). 2440–2447. 20 indexed citations
4.
Mehr, M. Yazdan, W.D. van Driel, & G.Q. Zhang. (2014). Accelerated life time testing and optical degradation of remote phosphor plates. Microelectronics Reliability. 54(8). 1544–1548. 36 indexed citations
5.
Ye, Huaiyu, M. Mihailovic, Chi‐Kong Wong, et al.. (2012). Two-phase cooling of light emitting diode for higher light output and increased efficiency. Applied Thermal Engineering. 52(2). 353–359. 38 indexed citations
6.
Koh, Sau, W.D. van Driel, & G.Q. Zhang. (2011). Degradation of epoxy lens materials in LED systems. 1/5–5/5. 18 indexed citations
7.
Zeijl, Henk van, et al.. (2011). An approach to “Design for Reliability” in solid state lighting systems at high temperatures. Microelectronics Reliability. 52(5). 783–793. 30 indexed citations
8.
Chen, Xianping, C. YUAN, Chi‐Kong Wong, Sau Koh, & G.Q. Zhang. (2011). Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline. Molecular Simulation. 37(12). 990–996. 34 indexed citations
9.
Yang, Daoguo, et al.. (2011). Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules. 1/5–5/5. 5 indexed citations
10.
Liu, Yang, et al.. (2010). The effects of response features on failure modes of board level drop impact test. 984–988. 1 indexed citations
11.
Driel, W.D. van, et al.. (2008). An alternative solder interconnect reliability test to evaluate drop impact performance. 1181–1186. 5 indexed citations
12.
Jansen, K.M.B., et al.. (2007). Characterization of moisture properties of polymers for IC packaging. Microelectronics Reliability. 47(9-11). 1685–1689. 6 indexed citations
13.
14.
Driel, W.D. van, et al.. (2005). Virtual prototyping and qualification of board level assembly. 772–775. 10 indexed citations
15.
Schreurs, P.J.G., et al.. (2005). Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures. Journal of Materials Science Materials in Electronics. 16(10). 693–700. 22 indexed citations
16.
Bressers, H.J.L., W.D. van Driel, K.M.B. Jansen, L.J. Ernst, & G.Q. Zhang. (2004). From chemical building blocks of polymers to microelectronics reliability. 621–625. 2 indexed citations
17.
He, Yu, et al.. (2003). Cracking prediction of IC's passivation layer using J-integral. 29. 362–367. 10 indexed citations
18.
Yang, Daoguo, G.Q. Zhang, L.J. Ernst, et al.. (2003). Investigation on flip chip solder joint fatigue with cure-dependent underfill properties. IEEE Transactions on Components and Packaging Technologies. 26(2). 388–398. 19 indexed citations
19.
Campen, D.H. van, et al.. (2002). Semi-analytical stability analysis of doubly-curved orthotropic shallow panels — considering the effects of boundary conditions. International Journal of Non-Linear Mechanics. 37(4-5). 659–667. 20 indexed citations
20.
Zhang, G.Q., A.A.O. Tay, & L.J. Ernst. (2002). Virtual thermo-mechanical prototyping of electronic packaging-the bottlenecks and solutions for damage modeling. 26 2. 263–269. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by G. Q. Zhang Breakdown of academic impact, for papers by Sau Koh Breakdown of academic impact, for papers by Chun‐Yao Hsu Breakdown of academic impact, for papers by Henning Heuer Breakdown of academic impact, for papers by Zhifang Zhang Breakdown of academic impact, for papers by Tae‐Woo Kim Breakdown of academic impact, for papers by Hongguang Wang Breakdown of academic impact, for papers by Frederick R. Phelan Breakdown of academic impact, for papers by Tao Jin Breakdown of academic impact, for papers by Ritesh Bhat
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