Fenglian Sun

1.6k total citations
96 papers, 1.4k citations indexed

About

Fenglian Sun is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Fenglian Sun has authored 96 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 92 papers in Electrical and Electronic Engineering, 65 papers in Mechanical Engineering and 10 papers in Mechanics of Materials. Recurrent topics in Fenglian Sun's work include Electronic Packaging and Soldering Technologies (80 papers), 3D IC and TSV technologies (61 papers) and Aluminum Alloys Composites Properties (25 papers). Fenglian Sun is often cited by papers focused on Electronic Packaging and Soldering Technologies (80 papers), 3D IC and TSV technologies (61 papers) and Aluminum Alloys Composites Properties (25 papers). Fenglian Sun collaborates with scholars based in China, Netherlands and United States. Fenglian Sun's co-authors include Yang Liu, Fuyi Cui, Wei Wang, Jiaojie He, Hao Zhang, Guoqi Zhang, Zuozhu Yin, Hongbo Xü, Xintong Zhang and Xuemei Li and has published in prestigious journals such as ACS Nano, Scientific Reports and Chemical Engineering Journal.

In The Last Decade

Fenglian Sun

89 papers receiving 1.4k citations

Peers

Fenglian Sun

EEE

IME

WST

Bingliang Gao China

Jun Hong China

Masafumi Maeda Japan

Silvia Franz Italy

Jianzhong Li China

Xiao Yang China

Gökhan Orhan Türkiye

Liangyan Hao China

D. Pilone Italy

Shoji Taniguchi Japan

Bingliang Gao China

Fenglian Sun

431 ×0.5

EEE

579 ×0.8

276 ×0.8

86 ×0.3

IME

46 ×0.2

WST

Citations per year, relative to Fenglian Sun Fenglian Sun (= 1×) peers Bingliang Gao

Countries citing papers authored by Fenglian Sun

Since Specialization

Citations

This map shows the geographic impact of Fenglian Sun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fenglian Sun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fenglian Sun more than expected).

Fields of papers citing papers by Fenglian Sun

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fenglian Sun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fenglian Sun. The network helps show where Fenglian Sun may publish in the future.

Co-authorship network of co-authors of Fenglian Sun

This figure shows the co-authorship network connecting the top 25 collaborators of Fenglian Sun. A scholar is included among the top collaborators of Fenglian Sun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fenglian Sun. Fenglian Sun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Pan, Zhen, et al.. (2025). Research on the interface structure composite behavior and performance influence of Ni and Cr elements in Sn–Cu–Bi–in solder microstructure. Journal of Materials Research and Technology. 36. 713–726. 2 indexed citations

Pan, Zhen, et al.. (2025). Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder. Metals. 15(2). 157–157. 1 indexed citations

Liu, Z.Y., et al.. (2024). Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition. Scientific Reports. 14(1). 32141–32141. 1 indexed citations

Zhai, Junjun, et al.. (2024). Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures. Crystals. 14(3). 269–269. 2 indexed citations

Sun, Fenglian, et al.. (2022). Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging. Journal of Materials Science Materials in Electronics. 33(33). 25025–25040. 7 indexed citations

Li, Xuemei, Liping Wang, Xiangwei Li, et al.. (2022). The effects of solder joint height on the solid–liquid interface diffusion in micro solder joints. Materials Letters. 316. 131969–131969. 8 indexed citations

Sun, Fenglian, et al.. (2021). The fracture mechanism of Cu3Sn-microporous copper composite joint by thermal compression bonding process. Materials Letters. 291. 129536–129536. 4 indexed citations

Zhang, Peng, Yang Liu, Min Zhou, et al.. (2020). Rationally designed C/Co ₉ S ₈ @SnS ₂ nanocomposite as a highly efficient anode for lithium-ion batteries. Nanotechnology. 31(39). 395401–395401. 9 indexed citations

Liu, Yang, et al.. (2019). Microstructure, hardness, and shear behavior of Sn3.0Ag0.5Cu–Sn58Bi composite solder joint. Materials Research Express. 6(11). 116328–116328. 9 indexed citations

10.

Sun, Fenglian, et al.. (2018). Analysis of Creep Performance of Micro Solder Joints under Different Loading Mode. Cailiao yanjiu xuebao. 32(3). 184–190. 1 indexed citations

11.

Liu, Yang, et al.. (2018). Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates. Modern Physics Letters B. 33(1). 1850425–1850425. 2 indexed citations

12.

Liu, Yang, Fenglian Sun, Ping Liu, Xiaolong Gu, & Guoqi Zhang. (2017). Shear strength of LED solder joints using SAC-nano Cu solder pastes. Journal of Semiconductors. 38(9). 96003–96003. 1 indexed citations

13.

Liu, Yang, et al.. (2016). Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes. Journal of Materials Processing Technology. 238. 290–296. 37 indexed citations

14.

Liu, Yang, et al.. (2015). Thermal simulation of flexible LED package enhanced with copper pillars. Journal of Semiconductors. 36(6). 64011–64011. 5 indexed citations

15.

Sun, Fenglian, et al.. (2013). Geometrical size effect on interfacial reaction of Cu/SAC305/Cu during high-temperature storage aging. 1025–1028. 3 indexed citations

16.

Sun, Fenglian, et al.. (2011). Geometrical size effect on interfacial diffusion of solder joint. 242–245. 3 indexed citations

17.

Sun, Fenglian, et al.. (2011). Effect of Ni on the morphology of IMC and mechanical properties of SAC-Bi-Ni/Cu joints. 129. 267–271.

18.

Liu, Yang, Fenglian Sun, & Xiaojing Liu. (2010). Improving Sn-0.3Ag-0.7Cu low-Ag lead-free solder performance by adding Bi element. 25. 343–346. 10 indexed citations

19.

Liu, Yang, et al.. (2010). The effects of response features on failure modes of board level drop impact test. 984–988. 1 indexed citations

20.

Zhang, Ziyang, et al.. (2006). Heat Control of an Integrated Silica VMUX Using Constant Working Power. IEEE Journal of Selected Topics in Quantum Electronics. 12(5). 1054–1059. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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