Yang Liu

3.2k total citations · 2 hit papers
225 papers, 2.4k citations indexed

About

Yang Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Yang Liu has authored 225 papers receiving a total of 2.4k indexed citations (citations by other indexed papers that have themselves been cited), including 129 papers in Electrical and Electronic Engineering, 109 papers in Mechanical Engineering and 25 papers in Mechanics of Materials. Recurrent topics in Yang Liu's work include Electronic Packaging and Soldering Technologies (112 papers), 3D IC and TSV technologies (85 papers) and Aluminum Alloys Composites Properties (40 papers). Yang Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (112 papers), 3D IC and TSV technologies (85 papers) and Aluminum Alloys Composites Properties (40 papers). Yang Liu collaborates with scholars based in China, Netherlands and United States. Yang Liu's co-authors include Fenglian Sun, Yang Jiao, Xiang Wu, Ahmad Umar, Fengyu Qu, Zhenglin Zhang, Hao Zhang, Guoqi Zhang, Huanxin Yuan and Xuemei Li and has published in prestigious journals such as SHILAP Revista de lepidopterología, Advanced Functional Materials and Langmuir.

In The Last Decade

Yang Liu

193 papers receiving 2.3k citations

Hit Papers

Hierarchical SnO2 Nanostructures Made of Intermingled Ult... 2014 2026 2018 2022 2014 2024 100 200 300 400
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Hierarchical SnO2 Nanostructures Made of Intermingled Ultrathin Nanosheets for Environmental Remediation, Smart Gas Sensor, and Supercapacitor Applications
    2014 470 citations Yang Liu et al. profile →
  2. Fatigue behavior of high-strength steel wires considering coupled effect of multiple corrosion-pitting
    2024 68 citations Yang Liu et al. profile →

Peers

Yang Liu
Gerard F. Fernando United Kingdom
Yuxi Jia China
Zhijian Li China
Donghoon Kang South Korea
Quan Wen China
Yun Peng China
Meng Zhao China
Yifan Guo China
Daniel P. Cole United States
Gerard F. Fernando United Kingdom
Yang Liu
Citations per year, relative to Yang Liu Yang Liu (= 1×) peers Gerard F. Fernando

Countries citing papers authored by Yang Liu

Since Specialization
Citations

This map shows the geographic impact of Yang Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yang Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yang Liu more than expected).

Fields of papers citing papers by Yang Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yang Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yang Liu. The network helps show where Yang Liu may publish in the future.

Co-authorship network of co-authors of Yang Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Yang Liu. A scholar is included among the top collaborators of Yang Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yang Liu. Yang Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Hui, et al.. (2025). Multi-objective optimization for vibration suppression and weight reduction in composite sandwich shallow-spherical shells with functionally graded coating. Mechanical Systems and Signal Processing. 236. 113049–113049. 9 indexed citations
2.
Liu, Yang, et al.. (2025). Cooling innovations: Elastocaloric shape memory alloys, manufacturing, simulation, and refrigerator. Progress in Materials Science. 153. 101477–101477. 6 indexed citations
3.
Pan, Zhen, et al.. (2025). Research on the interface structure composite behavior and performance influence of Ni and Cr elements in Sn–Cu–Bi–in solder microstructure. Journal of Materials Research and Technology. 36. 713–726. 2 indexed citations
4.
Chen, Xiao, et al.. (2025). Effects of Electron Irradiation and Thermal Cycling on Electrical Properties of SiC MOSFET. IEEE Transactions on Device and Materials Reliability. 25(3). 684–691.
5.
Liu, Yang, et al.. (2024). Device packaging and integration optimization based on neural network method: Effect of microchannel structure on heat sink performance. Materials Science in Semiconductor Processing. 185. 108977–108977. 2 indexed citations
6.
Liu, Yang, Na Tan, Yang Li, et al.. (2024). Microstructure, hardness, and tribological properties of CoCrFeNiX (X = Mo, Ti, W) high entropy alloy coating by red-blue composite laser cladding on copper alloy. Surface and Coatings Technology. 483. 130761–130761. 30 indexed citations
7.
8.
Yang, Qingxin, et al.. (2024). Analysis of shock resistance and vibration isolation performance of a dual-layer vibration isolation device. IET conference proceedings.. 2023(31). 459–461.
9.
Liu, Yang, et al.. (2021). Cr对工业V-Mo/Ti脱硝催化剂的毒化作用研究. 53(8). 112–116.
10.
Liu, Yang, et al.. (2020). 高度取向ZSM-5分子筛膜的制备及其CO2/H2分离性能. 36(2). 301–307. 1 indexed citations
11.
Zhang, Hao, et al.. (2019). Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging. Materials Letters. 241. 108–110. 9 indexed citations
12.
Liu, Yang, et al.. (2019). Fe3O4@Au核-壳纳米复合材料的制备及对农药福美双的SERS检测研究. Gaodeng xuexiao huaxue xuebao. 40(10). 2067–2074. 2 indexed citations
13.
14.
Zhang, Hao, Yang Liu, Ling‐en Wang, et al.. (2018). Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(5). 963–972. 26 indexed citations
15.
Liu, Yang, et al.. (2017). Stein variational policy gradient. Uncertainty in Artificial Intelligence. 4 indexed citations
16.
Liu, Yang, et al.. (2015). Landsat TM8及GF-1影像黑龙江省线状地物实际与解译宽度对比. 31(16). 196–205. 1 indexed citations
17.
Liu, Yang, et al.. (2014). Self-attenuation corrections calculated by LabSOCS Simulations for gamma-spectrometric measurements with HPGe detectors. 82–87. 3 indexed citations
18.
Liu, Yang, et al.. (2012). 青藏高原东缘高山森林-苔原交错带土壤微生物生物量碳、氮和可培养微生物数量的季节动态. Chinese Journal of Plant Ecology. 36(5). 382–392. 3 indexed citations
19.
Liu, Yang, et al.. (2009). Creep Behaviors of DA Casting and Rolling GH4169 Superalloy. 20–23.
20.
Liu, Yang, et al.. (2007). Clinical analysis of early postoperative inflammatory small bowel obstruction. Zhōnghuá xiāohuà wàikē zázhì/Zhonghua xiaohua waike zazhi. 6(2). 104–106. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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