Yang Liu
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Materials Chemistry top 10%
- Civil and Structural Engineering top 5%
- Mechanics of Materials top 5%
- Co-authors
- Fenglian SunYang JiaoXiang WuAhmad UmarFengyu QuZhenglin ZhangHao ZhangGuoqi Zhang
- Topics
- Electronic Packaging and Soldering Technologies (112 papers)3D IC and TSV technologies (85 papers)Aluminum Alloys Composites Properties (40 papers)
- Journals
- SHILAP Revista de lepidopterologíaAdvanced Functional MaterialsLangmuir
- Partner nations
- ChinaNetherlandsUnited States
In The Last Decade
Yang Liu
193 papers receiving 2.3k citations
Hit Papers
Peers
Comparison fields: 5 of 105
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 1.0k
- Materials Chemistry 458
- Civil and Structural Engineering 393
- Mechanics of Materials 302
Countries citing papers authored by Yang Liu
This map shows the geographic impact of Yang Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yang Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yang Liu more than expected).
Fields of papers citing papers by Yang Liu
This network shows the impact of papers produced by Yang Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yang Liu. The network helps show where Yang Liu may publish in the future.
Co-authorship network of co-authors of Yang Liu
This figure shows the co-authorship network connecting the top 25 collaborators of Yang Liu. A scholar is included among the top collaborators of Yang Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yang Liu. Yang Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 9 | |
| 2 | 6 | |
| 3 | 2 | |
| 4 | 0 | |
| 5 | 2 | |
| 6 | 30 | |
| 7 | 0 | |
| 8 | 0 | |
| 9 | 0 | |
| 10 | 1 | |
| 11 | 9 | |
| 12 | 2 | |
| 13 | 0 | |
| 14 | 26 | |
| 15 | Stein variational policy gradient | 4 |
| 16 | 1 | |
| 17 | Self-attenuation corrections calculated by LabSOCS Simulations for gamma-spectrometric measurements with HPGe detectors | 3 |
| 18 | 青藏高原东缘高山森林-苔原交错带土壤微生物生物量碳、氮和可培养微生物数量的季节动态 | 3 |
| 19 | Creep Behaviors of DA Casting and Rolling GH4169 Superalloy | 0 |
| 20 | 3 |
About Yang Liu
Yang Liu is a scholar working on General Materials Science, Mechanical Engineering and Electrical and Electronic Engineering, having authored 225 papers that have together received 2.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (112 papers), 3D IC and TSV technologies (85 papers) and Aluminum Alloys Composites Properties (40 papers). The work is most often cited by research in Mechanical Engineering (1.0k citations), Electrical and Electronic Engineering (1.4k citations) and Bioengineering (125 citations). Yang Liu has collaborated with scholars based in China, Netherlands and United States. Frequent co-authors include Fenglian Sun, Yang Jiao, Xiang Wu, Ahmad Umar, Fengyu Qu, Zhenglin Zhang, Hao Zhang, Guoqi Zhang, Huanxin Yuan and Xuemei Li. Their work appears in journals such as SHILAP Revista de lepidopterología, Advanced Functional Materials and Langmuir.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.