Daoguo Yang

435 total citations
47 papers, 329 citations indexed

About

Daoguo Yang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Daoguo Yang has authored 47 papers receiving a total of 329 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 12 papers in Biomedical Engineering and 9 papers in Mechanical Engineering. Recurrent topics in Daoguo Yang's work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and GaN-based semiconductor devices and materials (8 papers). Daoguo Yang is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and GaN-based semiconductor devices and materials (8 papers). Daoguo Yang collaborates with scholars based in China, Netherlands and United States. Daoguo Yang's co-authors include Guoqi Zhang, Miao Cai, Fanfan Niu, Xiaoling Li, Jing Xiao, Xianping Chen, Tian‐Ling Ren, Qiuhua Liang, Dongliang Yan and Ning Yang and has published in prestigious journals such as The Science of The Total Environment, ACS Applied Materials & Interfaces and Chemical Physics Letters.

In The Last Decade

Daoguo Yang

40 papers receiving 316 citations

Peers

Daoguo Yang
Xue Qi Koh Singapore
Feng Ying China
Mária Domonkos Czechia
Xiang Zheng China
Gregor Kapun Slovenia
P.S. Benson United Kingdom
Kaiqi Zhao China
Audrey Allion France
R. Rosmaninho Portugal
Gerhard Rizzo Germany
Xue Qi Koh Singapore
Daoguo Yang
Citations per year, relative to Daoguo Yang Daoguo Yang (= 1×) peers Xue Qi Koh

Countries citing papers authored by Daoguo Yang

Since Specialization
Citations

This map shows the geographic impact of Daoguo Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daoguo Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daoguo Yang more than expected).

Fields of papers citing papers by Daoguo Yang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daoguo Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daoguo Yang. The network helps show where Daoguo Yang may publish in the future.

Co-authorship network of co-authors of Daoguo Yang

This figure shows the co-authorship network connecting the top 25 collaborators of Daoguo Yang. A scholar is included among the top collaborators of Daoguo Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daoguo Yang. Daoguo Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Zhao, Yabo, et al.. (2024). Packaging Evaluations of SiC MOSFETs Based on Cu-Clip Interconnection Architecture. 1–5. 1 indexed citations
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Zhou, Junhao, et al.. (2024). Reliability Analysis and Optimization of Silicon Bridge Interconnect Packaging. 1–5. 1 indexed citations
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Chen, Xindong, et al.. (2022). Research on optical and thermal properties of 3D ceramic substrate LED package. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–5.
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Wang, Xinhai, et al.. (2022). Thermal and stress performance analysis of double-sided cooling power module based on voids in different solder layers. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–4. 1 indexed citations
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Chen, Xindong, et al.. (2022). Suppression of Current Oscillation in SiC Hybrid Power Module. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–4. 1 indexed citations
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Lü, Zhiwei, et al.. (2022). Inactivation of Escherichia coli and Staphylococcus aureus by using a UVC-LED module with a multi-wavelength setting. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–6.
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Qin, Hongbo, Wangyun Li, Jing Xiao, et al.. (2018). Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals. Crystals. 8(11). 428–428. 6 indexed citations
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Li, Xiaoling, et al.. (2018). Evaluation survey of microbial disinfection methods in UV-LED water treatment systems. The Science of The Total Environment. 659. 1415–1427. 113 indexed citations
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Yu, Zhaozhe, Bingbing Tian, Ying Li, et al.. (2018). Lithium Titanate Matrix-Supported Nanocrystalline Silicon Film as an Anode for Lithium-Ion Batteries. ACS Applied Materials & Interfaces. 11(1). 534–540. 32 indexed citations
14.
Liu, Ping, Jing Xiao, & Daoguo Yang. (2017). The waveguide coupler between fiber and slab waveguide. 50. 1117–1120. 1 indexed citations
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Zhou, Zupeng, Yubing Gong, Daoguo Yang, Anke Schmitz, & Helmut Schmitz. (2016). Function modeling of the infrared organ of “Little Ash Beetle” Acanthocnemus nigricans (Coleoptera, Acanthocnemidae). Journal of Bionic Engineering. 13(4). 650–658. 6 indexed citations
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Jiang, Junke, Qiuhua Liang, Ruishen Meng, et al.. (2016). The Influence of Tensile Stress on Polyaniline as Strain Sensor. IEEE Electron Device Letters. 37(12). 1636–1638. 6 indexed citations
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Chen, Yunchao, et al.. (2014). Thermal resistance analysis of high power LED module under power cycling test. 2 indexed citations
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Li, Guoxing, et al.. (2014). Mold flow analysis of molding process for a MEMS fingerprint sensor package. 1 indexed citations
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Yang, Daoguo, et al.. (2011). Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules. 1/5–5/5. 5 indexed citations
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Hou, Fengze, et al.. (2011). Thermal transient analysis of LED array system with in-line pin fin heat sink. 1/5–5/5. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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