David Huitink

1.4k total citations
111 papers, 1.0k citations indexed

About

David Huitink is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, David Huitink has authored 111 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 55 papers in Electrical and Electronic Engineering, 48 papers in Mechanical Engineering and 20 papers in Materials Chemistry. Recurrent topics in David Huitink's work include Electronic Packaging and Soldering Technologies (25 papers), Silicon Carbide Semiconductor Technologies (22 papers) and Heat Transfer and Optimization (18 papers). David Huitink is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), Silicon Carbide Semiconductor Technologies (22 papers) and Heat Transfer and Optimization (18 papers). David Huitink collaborates with scholars based in United States, Japan and India. David Huitink's co-authors include Hong Liang, Fang Luo, Subrata Kundu, Asif Imran Emon, Muhammad Ghufran, Amol Deshpande, Danny J. Lohan, Ke Wang, Zhao Yuan and Lauren Boteler and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Langmuir.

In The Last Decade

David Huitink

96 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David Huitink United States 17 416 378 243 106 85 111 1.0k
Miao Qian China 19 375 0.9× 195 0.5× 317 1.3× 181 1.7× 50 0.6× 75 1.1k
Xia Ji China 20 519 1.2× 247 0.7× 213 0.9× 316 3.0× 150 1.8× 107 1.1k
Christopher S. Roper United States 14 353 0.8× 319 0.8× 255 1.0× 175 1.7× 60 0.7× 36 869
Meng Shi China 16 428 1.0× 206 0.5× 230 0.9× 339 3.2× 30 0.4× 65 1.2k
Jiawei Li China 20 169 0.4× 814 2.2× 317 1.3× 199 1.9× 28 0.3× 115 1.3k
Zhilei Wang Japan 18 269 0.6× 272 0.7× 645 2.7× 82 0.8× 74 0.9× 60 986
Yujun Zhang China 20 127 0.3× 454 1.2× 344 1.4× 191 1.8× 62 0.7× 85 1.2k
Jiaqi Zhang China 15 165 0.4× 481 1.3× 179 0.7× 275 2.6× 99 1.2× 55 1.2k
Qi Tang China 19 356 0.9× 405 1.1× 266 1.1× 77 0.7× 74 0.9× 90 1.0k

Countries citing papers authored by David Huitink

Since Specialization
Citations

This map shows the geographic impact of David Huitink's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Huitink with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Huitink more than expected).

Fields of papers citing papers by David Huitink

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David Huitink. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Huitink. The network helps show where David Huitink may publish in the future.

Co-authorship network of co-authors of David Huitink

This figure shows the co-authorship network connecting the top 25 collaborators of David Huitink. A scholar is included among the top collaborators of David Huitink based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David Huitink. David Huitink is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ghufran, Muhammad & David Huitink. (2025). Advances in encapsulated phase change materials for integration in thermal management applications. Emergent Materials. 8(7). 5355–5386. 3 indexed citations
2.
Huitink, David, et al.. (2024). Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints. Journal of Electronic Packaging. 147(1).
3.
Mazur, Yuriy I., et al.. (2024). Effect of temperature on the stability and performance of III-nitride HEMT magnetic field sensors. Applied Physics Letters. 125(4).
4.
Huitink, David, et al.. (2024). Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics. Journal of Electronic Packaging. 146(4). 1 indexed citations
5.
Harris, John, Yuriy I. Mazur, David Huitink, et al.. (2023). Thermal stability study of gallium nitride based magnetic field sensor. Journal of Applied Physics. 134(14). 5 indexed citations
6.
Huitink, David, et al.. (2023). Variable Area Jet Impingement for High Voltage Power Electronics. 1 indexed citations
7.
Ghufran, Muhammad & David Huitink. (2023). Synthesis of nano-size paraffin/silica-based encapsulated phase change materials of high encapsulation ratio via sol–gel method. Journal of Materials Science. 58(18). 7673–7689. 14 indexed citations
8.
Emon, Asif Imran, John Harris, Mustafeez Ul Hassan, et al.. (2022). Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module. IEEE Transactions on Transportation Electrification. 8(4). 4391–4407. 18 indexed citations
9.
Yuan, Zhao, et al.. (2022). Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter. IEEE Transactions on Power Electronics. 38(1). 538–547. 6 indexed citations
10.
Ghosh, Sujan, et al.. (2021). Effect of Cu nanoparticles on the tribological performance of polydopamine + polytetrafluoroethylene coatings in oil-lubricated condition. Applied Surface Science. 565. 150525–150525. 13 indexed citations
11.
Yuan, Zhao, Yalin Wang, Asif Imran Emon, et al.. (2021). Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications. IEEE Transactions on Power Electronics. 37(6). 6831–6843. 20 indexed citations
12.
Emon, Asif Imran, John Harris, Abdul Basit Mirza, et al.. (2021). Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module. 2313–2317. 8 indexed citations
13.
Huitink, David, et al.. (2020). Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers. IEEE Transactions on Power Electronics. 36(3). 3192–3199. 28 indexed citations
14.
Huitink, David, et al.. (2020). Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance. IEEE Journal of Emerging and Selected Topics in Power Electronics. 9(4). 3904–3915. 12 indexed citations
15.
Huitink, David, et al.. (2020). Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review. Heat Transfer Engineering. 42(12). 967–984. 79 indexed citations
16.
Huitink, David, et al.. (2020). Nanoparticle Enhanced Crystallization of Sorbitol PCMs for Latent Heat and Temperature Control. 690–696. 2 indexed citations
17.
Huitink, David, et al.. (2019). A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1). 256–271. 71 indexed citations
18.
Huitink, David, et al.. (2019). Influence of crystalline polymorphism on the phase change properties of sorbitol-Au nanocomposites. Materials Today Energy. 12. 379–388. 18 indexed citations
19.
Huitink, David, et al.. (2018). Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability. IEEE Transactions on Device and Materials Reliability. 18(3). 412–421. 16 indexed citations
20.
Huitink, David. (2011). Mechanochemical Fabrication and Characterization of Novel Low-dimensional Materials. Journal of Gastroenterology and Hepatology. 14(4). 397–9. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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