Michele Calabretta

603 total citations
65 papers, 326 citations indexed

About

Michele Calabretta is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Michele Calabretta has authored 65 papers receiving a total of 326 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in Michele Calabretta's work include Silicon Carbide Semiconductor Technologies (33 papers), Electronic Packaging and Soldering Technologies (22 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Michele Calabretta is often cited by papers focused on Silicon Carbide Semiconductor Technologies (33 papers), Electronic Packaging and Soldering Technologies (22 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Michele Calabretta collaborates with scholars based in Italy, Czechia and Switzerland. Michele Calabretta's co-authors include Alessandro Sitta, Gaetano Sequenzia, Salvatore Massimo Oliveri, Angelo Messina, Giuseppe D’Arrigo, Giuseppe Mirone, S. Russo, Vincenzo Vinciguerra, Marco Mauceri and Danilo Crippa and has published in prestigious journals such as IEEE Access, Surface and Coatings Technology and Materials & Design.

In The Last Decade

Michele Calabretta

53 papers receiving 312 citations

Peers

Countries citing papers authored by Michele Calabretta

Since Specialization

Citations

This map shows the geographic impact of Michele Calabretta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michele Calabretta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michele Calabretta more than expected).

Fields of papers citing papers by Michele Calabretta

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michele Calabretta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michele Calabretta. The network helps show where Michele Calabretta may publish in the future.

Co-authorship network of co-authors of Michele Calabretta

This figure shows the co-authorship network connecting the top 25 collaborators of Michele Calabretta. A scholar is included among the top collaborators of Michele Calabretta based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michele Calabretta. Michele Calabretta is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	Reliability assessment of SiC power MOSFETs in dynamic reverse bias test	Microelectronics Reliability	Alessandro Sitta, Michele Calabretta et al.	0
2	Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy	Applied Sciences	Angelo Messina, Alessandro Sitta et al.	1
3	Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field		Francesco Rundo, Michele Calabretta et al.	0
4	TIMs for transfer molded power modules: Characterization, reliability, and modeling	Microelectronics Reliability	Alessandro Sitta, Michele Calabretta et al.	2
5	Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules	IEEE Transactions on Intelligent Vehicles	Carmelo Pino, Alessandro Sitta et al.	3
6	Warpage modeling for semiconductor power module manufacturing flow improvement	Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture	Michele Calabretta, Alessandro Sitta et al.	2
7	A novel integrated approach to optimize copper wire bonding processes and manufacturing	International Journal on Interactive Design and Manufacturing (IJIDeM)	Michele Calabretta, Alessandro Sitta	3
8	Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method	Electronics	Francesco Alonge, Alessandro Busacca et al.	7
9	Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis	Engineering Fracture Mechanics	Michele Calabretta, Alessandro Sitta et al.	8
10	Paving the way toward the world's first 200mm SiC pilot line	Materials Science in Semiconductor Processing	Xueping Xu, Hui Wang et al.	30
11	Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling	Applied Sciences	Michele Calabretta, Alessandro Sitta et al.	22
12	Structural characterization of semiconductor multi-layer pad	Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science	Michele Calabretta, Alessandro Sitta et al.	2
13	Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter	Applied Sciences	Alessandro Sitta, Michele Calabretta et al.	4
14	Study of the Thermomechanical Strain Induced by Current Pulses in SiC-Based Power MOSFET	IEEE Electron Device Letters	Claudia Triolo, Francesca Garescì et al.	8
15	Warpage Behavior on Silicon Semiconductor Device: The Impact of Thick Copper Metallization	Applied Sciences	Michele Calabretta, Alessandro Sitta et al.	8
16	Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling	IEEE Access	Michele Calabretta, Alessandro Sitta et al.	16
17	Experimental characterization and modeling of power module warpage during assembly process	International Journal on Interactive Design and Manufacturing (IJIDeM)	Michele Calabretta, Alessandro Sitta et al.	3
18	An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization	International Journal on Interactive Design and Manufacturing (IJIDeM)	Michele Calabretta, Alessandro Sitta et al.	3
19	Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates	IEEE Transactions on Device and Materials Reliability	Giuseppe Mirone, Alessandro Sitta et al.	22
20	Thermal Analysis Approach for Predicting Power Device Lifetime	IEEE Transactions on Device and Materials Reliability	S. Russo, Alessandro Sitta et al.	15

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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