Michele Calabretta

603 total citations
65 papers, 326 citations indexed

About

Michele Calabretta is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Michele Calabretta has authored 65 papers receiving a total of 326 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in Michele Calabretta's work include Silicon Carbide Semiconductor Technologies (33 papers), Electronic Packaging and Soldering Technologies (22 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Michele Calabretta is often cited by papers focused on Silicon Carbide Semiconductor Technologies (33 papers), Electronic Packaging and Soldering Technologies (22 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Michele Calabretta collaborates with scholars based in Italy, Czechia and Switzerland. Michele Calabretta's co-authors include Alessandro Sitta, Gaetano Sequenzia, Salvatore Massimo Oliveri, Angelo Messina, Giuseppe D’Arrigo, Giuseppe Mirone, S. Russo, Vincenzo Vinciguerra, Marco Mauceri and Danilo Crippa and has published in prestigious journals such as IEEE Access, Surface and Coatings Technology and Materials & Design.

In The Last Decade

Michele Calabretta

53 papers receiving 312 citations

Peers

Michele Calabretta

EEE

Alessandro Sitta Italy

Joshua Major United States

Borong Hu United Kingdom

Asier Matallana Spain

Haksun Lee South Korea

Nicolas Heuck Germany

Michael D. Glover United States

Erping Deng China

Bassem Mouawad United Kingdom

Asger Bjørn Jørgensen Denmark

Alessandro Sitta Italy

Michele Calabretta

185 ×0.7

EEE

69 ×0.7

24 ×0.8

23 ×0.8

20 ×0.7

Citations per year, relative to Michele Calabretta Michele Calabretta (= 1×) peers Alessandro Sitta

Countries citing papers authored by Michele Calabretta

Since Specialization

Citations

This map shows the geographic impact of Michele Calabretta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michele Calabretta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michele Calabretta more than expected).

Fields of papers citing papers by Michele Calabretta

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michele Calabretta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michele Calabretta. The network helps show where Michele Calabretta may publish in the future.

Co-authorship network of co-authors of Michele Calabretta

This figure shows the co-authorship network connecting the top 25 collaborators of Michele Calabretta. A scholar is included among the top collaborators of Michele Calabretta based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michele Calabretta. Michele Calabretta is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sitta, Alessandro, et al.. (2025). Reliability assessment of SiC power MOSFETs in dynamic reverse bias test. Microelectronics Reliability. 171. 115770–115770.

Messina, Angelo, et al.. (2024). Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy. Applied Sciences. 14(10). 4230–4230. 1 indexed citations

Rundo, Francesco, et al.. (2024). Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field. 18–23.

Sitta, Alessandro, et al.. (2023). TIMs for transfer molded power modules: Characterization, reliability, and modeling. Microelectronics Reliability. 148. 115162–115162. 2 indexed citations

Pino, Carmelo, Alessandro Sitta, Angelo Messina, et al.. (2023). Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules. IEEE Transactions on Intelligent Vehicles. 8(12). 4734–4753. 3 indexed citations

Calabretta, Michele, Alessandro Sitta, Francesco Rundo, & Gaetano Sequenzia. (2023). Warpage modeling for semiconductor power module manufacturing flow improvement. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture. 238(4). 538–548. 2 indexed citations

Calabretta, Michele & Alessandro Sitta. (2022). A novel integrated approach to optimize copper wire bonding processes and manufacturing. International Journal on Interactive Design and Manufacturing (IJIDeM). 16(1). 371–379. 3 indexed citations

Alonge, Francesco, Alessandro Busacca, Michele Calabretta, et al.. (2022). Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method. Electronics. 11(15). 2336–2336. 7 indexed citations

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2022). Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis. Engineering Fracture Mechanics. 266. 108339–108339. 8 indexed citations

10.

Xu, Xueping, Hui Wang, Ilya Zwieback, et al.. (2021). Paving the way toward the world's first 200mm SiC pilot line. Materials Science in Semiconductor Processing. 135. 106088–106088. 30 indexed citations

11.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling. Applied Sciences. 11(15). 7012–7012. 22 indexed citations

12.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Structural characterization of semiconductor multi-layer pad. Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science. 235(24). 7734–7742. 2 indexed citations

13.

Sitta, Alessandro, et al.. (2021). Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter. Applied Sciences. 11(18). 8302–8302. 4 indexed citations

14.

Triolo, Claudia, Francesca Garescì, S. Russo, et al.. (2021). Study of the Thermomechanical Strain Induced by Current Pulses in SiC-Based Power MOSFET. IEEE Electron Device Letters. 42(7). 1089–1092. 8 indexed citations

15.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Warpage Behavior on Silicon Semiconductor Device: The Impact of Thick Copper Metallization. Applied Sciences. 11(11). 5140–5140. 8 indexed citations

16.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling. IEEE Access. 9. 76307–76314. 16 indexed citations

17.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2020). Experimental characterization and modeling of power module warpage during assembly process. International Journal on Interactive Design and Manufacturing (IJIDeM). 15(1). 113–115. 3 indexed citations

18.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2020). An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization. International Journal on Interactive Design and Manufacturing (IJIDeM). 15(1). 117–119. 3 indexed citations

19.

Mirone, Giuseppe, Alessandro Sitta, Giuseppe D’Arrigo, & Michele Calabretta. (2019). Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates. IEEE Transactions on Device and Materials Reliability. 19(3). 537–542. 22 indexed citations

20.

Russo, S., et al.. (2019). Thermal Analysis Approach for Predicting Power Device Lifetime. IEEE Transactions on Device and Materials Reliability. 19(1). 159–163. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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