Tingyu Lin
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Mechanics of Materials top 10%
- Biomedical Engineering
- Industrial and Manufacturing Engineering top 10%
- Co-authors
- Satish G. KandlikarA.A.O. TayFengze HouLiqiang CaoMeiying SuGuoqi ZhangJun LiBraham Ferreira
- Topics
- Electronic Packaging and Soldering Technologies (16 papers)3D IC and TSV technologies (14 papers)Heat Transfer and Optimization (6 papers)
- Cited by
- Industrial and Manufacturing EngineeringMechanical EngineeringElectrical and Electronic Engineering
- Journals
- SHILAP Revista de lepidopterologíaApplied Thermal EngineeringJournal of Heat Transfer
- Partner nations
- ChinaUnited StatesNetherlands
In The Last Decade
Tingyu Lin
33 papers receiving 558 citations
Peers
Comparison fields: 5 of 62
- Electrical and Electronic Engineering 346
- Mechanical Engineering 232
- Mechanics of Materials 104
- Biomedical Engineering 69
- Industrial and Manufacturing Engineering 62
Countries citing papers authored by Tingyu Lin
This map shows the geographic impact of Tingyu Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tingyu Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tingyu Lin more than expected).
Fields of papers citing papers by Tingyu Lin
This network shows the impact of papers produced by Tingyu Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tingyu Lin. The network helps show where Tingyu Lin may publish in the future.
Co-authorship network of co-authors of Tingyu Lin
This figure shows the co-authorship network connecting the top 25 collaborators of Tingyu Lin. A scholar is included among the top collaborators of Tingyu Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tingyu Lin. Tingyu Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 6 | |
| 3 | 9 | |
| 4 | 5 | |
| 5 | 12 | |
| 6 | 5 | |
| 7 | 0 | |
| 8 | 99 | |
| 9 | 19 | |
| 10 | 30 | |
| 11 | 4 | |
| 12 | 56 | |
| 13 | 1 | |
| 14 | 1 | |
| 15 | 14 | |
| 16 | 2 | |
| 17 | 1 | |
| 18 | 6 | |
| 19 | 37 | |
| 20 | 45 |
About Tingyu Lin
Tingyu Lin is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanical Engineering, having authored 36 papers that have together received 582 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (14 papers) and Heat Transfer and Optimization (6 papers). The work is most often cited by research in Industrial and Manufacturing Engineering (62 citations), Mechanical Engineering (232 citations) and Electrical and Electronic Engineering (346 citations). Tingyu Lin has collaborated with scholars based in China, United States and Netherlands. Frequent co-authors include Satish G. Kandlikar, A.A.O. Tay, Fengze Hou, Liqiang Cao, Meiying Su, Guoqi Zhang, Jun Li, Braham Ferreira, Wenbo Wang and Liqiang Cao. Their work appears in journals such as SHILAP Revista de lepidopterología, Applied Thermal Engineering and Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.