Tingyu Lin

821 total citations
36 papers, 582 citations indexed

About

Tingyu Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Tingyu Lin has authored 36 papers receiving a total of 582 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 4 papers in Automotive Engineering. Recurrent topics in Tingyu Lin's work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (14 papers) and Heat Transfer and Optimization (6 papers). Tingyu Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (14 papers) and Heat Transfer and Optimization (6 papers). Tingyu Lin collaborates with scholars based in China, United States and Netherlands. Tingyu Lin's co-authors include Satish G. Kandlikar, A.A.O. Tay, Fengze Hou, Liqiang Cao, Meiying Su, Guoqi Zhang, Wenbo Wang, Jun Li, Braham Ferreira and Liqiang Cao and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Thermal Engineering and Journal of Heat Transfer.

In The Last Decade

Tingyu Lin

33 papers receiving 558 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tingyu Lin China 13 346 232 104 69 62 36 582
R. Venkatraman India 14 251 0.7× 258 1.1× 83 0.8× 52 0.8× 61 1.0× 65 600
Xin Tong China 12 160 0.5× 350 1.5× 75 0.7× 90 1.3× 177 2.9× 61 527
Nitin Ambhore India 10 202 0.6× 348 1.5× 39 0.4× 137 2.0× 114 1.8× 51 461
D.F. Baldwin United States 12 469 1.4× 200 0.9× 77 0.7× 81 1.2× 285 4.6× 86 870
Xianhai Yang China 15 203 0.6× 367 1.6× 92 0.9× 205 3.0× 41 0.7× 61 486
Cihan Özel Türkiye 10 180 0.5× 331 1.4× 85 0.8× 102 1.5× 35 0.6× 28 447
Dominique Chamoret France 11 75 0.2× 124 0.5× 61 0.6× 74 1.1× 59 1.0× 35 418
T. Reinikainen United States 17 441 1.3× 259 1.1× 155 1.5× 23 0.3× 12 0.2× 38 618
N. Venkaiah India 15 198 0.6× 523 2.3× 87 0.8× 170 2.5× 93 1.5× 36 624
Shu-Han Juang Taiwan 5 171 0.5× 597 2.6× 86 0.8× 47 0.7× 108 1.7× 8 716

Countries citing papers authored by Tingyu Lin

Since Specialization
Citations

This map shows the geographic impact of Tingyu Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tingyu Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tingyu Lin more than expected).

Fields of papers citing papers by Tingyu Lin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tingyu Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tingyu Lin. The network helps show where Tingyu Lin may publish in the future.

Co-authorship network of co-authors of Tingyu Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Tingyu Lin. A scholar is included among the top collaborators of Tingyu Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tingyu Lin. Tingyu Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chou, Jui‐Sheng, et al.. (2025). Advanced risk management strategies for safety enhancement in temporary building construction works. Journal of Safety Research. 95. 545–568.
2.
3.
Lin, Tingyu, et al.. (2024). SSGCRTN: a space-specific graph convolutional recurrent transformer network for traffic prediction. Applied Intelligence. 54(22). 11978–11994. 9 indexed citations
4.
Chai, Xudong, et al.. (2022). Intelligent Manufacturing Enabled by Information and Communication Technology in Industrial Environment. SHILAP Revista de lepidopterología. 24(2). 75–75. 5 indexed citations
5.
Ping, Xubin, et al.. (2022). A Survey of Output Feedback Robust MPC for Linear Parameter Varying Systems. IEEE/CAA Journal of Automatica Sinica. 9(10). 1717–1751. 12 indexed citations
6.
7.
Hou, Fengze, Wenbo Wang, Liqiang Cao, et al.. (2019). Review of Packaging Schemes for Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1). 223–238. 99 indexed citations
8.
Hou, Fengze, et al.. (2019). Characterization of PCB Embedded Package Materials for SiC MOSFETs. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(6). 1054–1061. 19 indexed citations
9.
Hou, Fengze, Wenbo Wang, Hengyun Zhang, et al.. (2019). Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages. Applied Thermal Engineering. 163. 114338–114338. 26 indexed citations
10.
Su, Meiying, Liqiang Cao, Tingyu Lin, et al.. (2018). Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process. Microelectronics Reliability. 83. 29–38. 30 indexed citations
11.
Zhang, Hengyun, Shen Xu, Hao Chen, & Tingyu Lin. (2017). Thermal analysis and characterization of electronic packages with alternative lid coatings. 342–347. 4 indexed citations
12.
Liu, Yan, et al.. (2017). Solder joint reliability analysis of wafer level CSP. 135–138. 1 indexed citations
13.
Hou, Fengze, et al.. (2017). Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(10). 1721–1728. 56 indexed citations
14.
Sui, Yang, Hengyun Zhang, Peichao Li, & Tingyu Lin. (2017). Design analysis of minichannel heat sink with indented fins under impingement flow condition. 336–341. 1 indexed citations
15.
Lin, Tingyu, Fengze Hou, Haiyan Liu, et al.. (2016). Warpage simulation and experiment for panel level fan-out package. 14 indexed citations
16.
17.
Lin, Tingyu & Satish G. Kandlikar. (2013). Heat Transfer Investigation of Air Flow in Microtubes—Part II: Scale and Axial Conduction Effects. Journal of Heat Transfer. 135(3). 317041–317046. 6 indexed citations
18.
Lin, Tingyu & Satish G. Kandlikar. (2013). Heat Transfer Investigation of Air Flow in Microtubes—Part I: Effects of Heat Loss, Viscous Heating, and Axial Conduction. Journal of Heat Transfer. 135(3). 6 indexed citations
19.
Lin, Tingyu & Satish G. Kandlikar. (2012). An Experimental Investigation of Structured Roughness Effect on Heat Transfer During Single-Phase Liquid Flow at Microscale. Journal of Heat Transfer. 134(10). 37 indexed citations
20.
Lin, Tingyu & Satish G. Kandlikar. (2011). A Theoretical Model for Axial Heat Conduction Effects During Single-Phase Flow in Microchannels. Journal of Heat Transfer. 134(2). 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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