M. Murugesan

1.3k citations

121 papers · 1.0k · h-index 17

Impact in

Electrical and Electronic Engineering top 5%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies

Papers in

Electrical and Electronic Engineering 109
- 3D IC and TSV technologies 98
- Electronic Packaging and Soldering Technologies 57
- Semiconductor materials and devices 20
Biomedical Engineering 35
- Nanofabrication and Lithography Techniques 21
- Advanced Surface Polishing Techniques 12

Co-authors: Takafumi Fukushima (112 shared papers)Mitsumasa Koyanagi (100 shared papers)Tetsu Tanaka (80 shared papers)J. C. Bea (43 shared papers)Hisashi Kino (27 shared papers)Yuki Ohara (19 shared papers)Kangwook Lee (20 shared papers)Eiji Iwata (6 shared papers)
Journals: Japanese Journal of Applied Physics (8 papers)IEEE Transactions on Electron Devices (7 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Applied Physics Letters (1 paper)IEEE Transactions on Semiconductor Manufacturing (1 paper)
Partner nations: Japan Thailand United States

In The Last Decade

M. Murugesan

112 papers receiving 995 citations

Peers

Countries citing papers authored by M. Murugesan

Since Specialization

Citations

This map shows the geographic impact of M. Murugesan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Murugesan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Murugesan more than expected).

Fields of papers citing papers by M. Murugesan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Murugesan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Murugesan. The network helps show where M. Murugesan may publish in the future.

Co-authors

The 25 scholars most cited alongside M. Murugesan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with M. Murugesan Line = papers co-authored together M. Murugesan links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 121 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias M. Murugesan, Hisashi Kino, Hiroshi Nohira, J. Bea, Akihiro Horibe, Fumiaki Yamada, Chuichi Miyazaki, Hiroshi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2010	69
2	New heterogeneous multi-chip module integration technology using self-assembly method Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama, M. Murugesan, K. Sato, Wonbeen Jeong, Yuki Ohara, Akihiro Noriki, Shigenori Kanno, Yoshiyuki Kaiho, Hisashi Kino, Kikuo Makita, R. Kobayashi, Chun Yin, Kiyoshi Inamura, K.-W. Lee, J. C. Bea, Tetsu Tanaka, Mitsumasa Koyanagi	2008	44
3	Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film IEEE Transactions on Electron Devices ·Takafumi Fukushima, J. C. Bea, Hisashi Kino, C. Nagai, M. Murugesan, H. Hashiguchi, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2014	41
4	Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation IEEE Transactions on Electron Devices ·Takafumi Fukushima, Eiji Iwata, Yuki Ohara, M. Murugesan, J. C. Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2012	40
5	Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding M. Murugesan, J. Bea, Hisashi Kino, Yuki Ohara, Takuto Kojima, Akihiro Noriki, K.W. Lee, K. Kiyoyama, Takafumi Fukushima, Hiroshi Nohira, Takashi Hattori, E. Ikenaga, Tetsu Tanaka, Mitsumasa Koyanagi	2009	37
6	10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kangwook Lee, M. Murugesan, J. C. Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2009	37
7	Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing IEEE Transactions on Components Packaging and Manufacturing Technology ·Takafumi Fukushima, Eiji Iwata, Yuki Ohara, M. Murugesan, J. C. Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2011	35
8	High density 3D LSI technology using W/Cu hybrid TSVs M. Murugesan, Hisashi Kino, A. Hashiguchi, Chuichi Miyazaki, H. Shimamoto, Hiroshi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2011	34
9	Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·Toshiaki Shirasaka, Tadashi Okuda, Tomoaki Shibata, Satoshi Yoneda, Daisaku Matsukawa, M. Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima	2022	25
10	Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems IEEE Transactions on Electron Devices ·Kangwook Lee, Yuki Ohara, K. Kiyoyama, Jicheol Bea, M. Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2013	24
11	Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration Micromachines ·Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, M. Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2011	23
12	Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration Micromachines ·Takafumi Fukushima, H. Hashiguchi, Hiroshi Yonekura, Hisashi Kino, M. Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2016	23
13	New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding Takafumi Fukushima, H. Hashiguchi, J. C. Bea, Yuki Ohara, M. Murugesan, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2012	23
14	Magnetic properties of nano-crystalline Fe-Cr alloys prepared by mechanical alloying IEEE Transactions on Magnetics ·M. Murugesan, Hisashi Kuwano	1999	22
15	Minimizing the local deformation induced around Cu-TSVs and CuSn/InAu-microbumps in high-density 3D-LSIs M. Murugesan, Hiroshi Kobayashi, H. Shimamoto, Fumiaki Yamada, Takafumi Fukushima, J. C. Bea, K. W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2012	21
16	Cu-SiO₂ Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·M. Murugesan, K. Mori, M. Sawa, Eli D. Sone, Mitsumasa Koyanagi, Takafumi Fukushima	2022	19
17	Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV IEEE Electron Device Letters ·Kangwook Lee, Hao Wang, Jicheol Bea, M. Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi	2013	18
18	Control of Porosity and Composition in Large-Area YBCO Films to Achieve Micrometer Thickness and High<tex>$J_rm c$</tex>on Sapphire Substrates IEEE Transactions on Applied Superconductivity ·Katherine Develos-Bagarinao, H. Yamasaki, Jia-Cai Nie, M. Murugesan, H. Obara, Y. Nakagawa	2005	15
19	Microcrack-free epitaxy of thick YBa2Cu3O7−δ films on vicinal r-cut sapphire buffered with CeO2 Applied Physics Letters ·Jia-Cai Nie, H. Yamasaki, Y. Nakagawa, Katherine Develos-Bagarinao, M. Murugesan, H. Obara, Yasunori Mawatari	2005	15
20	Investigation of Local Bending Stress Effect on Complementary Metal–Oxide–Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration Japanese Journal of Applied Physics ·Hisashi Kino, Ji Choel Bea, M. Murugesan, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka	2013	14

About M. Murugesan

M. Murugesan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 121 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (98 papers), Electronic Packaging and Soldering Technologies (57 papers), Nanofabrication and Lithography Techniques (21 papers), Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (18 papers), Additive Manufacturing and 3D Printing Technologies (18 papers), Modular Robots and Swarm Intelligence (14 papers) and Advanced Surface Polishing Techniques (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (914 citations), Automotive Engineering (164 citations), Electronic, Optical and Magnetic Materials (114 citations), Biomedical Engineering (252 citations) and Mechanical Engineering (203 citations). M. Murugesan has collaborated with scholars based in Japan, Thailand and United States. Frequent co-authors include Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka, J. C. Bea, Hisashi Kino, Yuki Ohara, Kangwook Lee, Eiji Iwata, Hiroshi Kobayashi and Fumiaki Yamada. Their work appears in journals such as Japanese Journal of Applied Physics, IEEE Transactions on Electron Devices, IEEE Transactions on Components Packaging and Manufacturing Technology, Applied Physics Letters and IEEE Transactions on Semiconductor Manufacturing.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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M. Murugesan

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