M. Murugesan

1.3k total citations
121 papers, 1.0k citations indexed

About

M. Murugesan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, M. Murugesan has authored 121 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 109 papers in Electrical and Electronic Engineering, 35 papers in Biomedical Engineering and 18 papers in Automotive Engineering. Recurrent topics in M. Murugesan's work include 3D IC and TSV technologies (98 papers), Electronic Packaging and Soldering Technologies (57 papers) and Nanofabrication and Lithography Techniques (21 papers). M. Murugesan is often cited by papers focused on 3D IC and TSV technologies (98 papers), Electronic Packaging and Soldering Technologies (57 papers) and Nanofabrication and Lithography Techniques (21 papers). M. Murugesan collaborates with scholars based in Japan, United States and Canada. M. Murugesan's co-authors include Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka, J. C. Bea, Hisashi Kino, Yuki Ohara, Kangwook Lee, Eiji Iwata, Hiroshi Kobayashi and Fumiaki Yamada and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

M. Murugesan

112 papers receiving 995 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Murugesan Japan 17 914 252 203 164 114 121 1.0k
E. Sprogis United States 18 1.7k 1.8× 246 1.0× 91 0.4× 267 1.6× 152 1.3× 31 1.7k
Kripesh Vaidyanathan Singapore 13 611 0.7× 162 0.6× 123 0.6× 135 0.8× 56 0.5× 33 718
M.M.R. Howlader Japan 19 844 0.9× 293 1.2× 65 0.3× 97 0.6× 140 1.2× 31 999
V. Kripesh Singapore 23 1.6k 1.7× 272 1.1× 388 1.9× 234 1.4× 178 1.6× 104 1.7k
S. L. Burkett United States 20 688 0.8× 180 0.7× 183 0.9× 77 0.5× 207 1.8× 74 1.0k
Viorel Drăgoi Austria 13 630 0.7× 179 0.7× 52 0.3× 104 0.6× 64 0.6× 107 707
Takayuki Ohba Japan 17 999 1.1× 290 1.2× 104 0.5× 100 0.6× 338 3.0× 115 1.2k
Markus Wimplinger Austria 11 806 0.9× 270 1.1× 52 0.3× 106 0.6× 57 0.5× 75 895
Joeri De Vos Belgium 17 797 0.9× 176 0.7× 75 0.4× 107 0.7× 109 1.0× 98 861
Brandon Passmore United States 16 845 0.9× 95 0.4× 74 0.4× 180 1.1× 89 0.8× 48 962

Countries citing papers authored by M. Murugesan

Since Specialization
Citations

This map shows the geographic impact of M. Murugesan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Murugesan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Murugesan more than expected).

Fields of papers citing papers by M. Murugesan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Murugesan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Murugesan. The network helps show where M. Murugesan may publish in the future.

Co-authorship network of co-authors of M. Murugesan

This figure shows the co-authorship network connecting the top 25 collaborators of M. Murugesan. A scholar is included among the top collaborators of M. Murugesan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Murugesan. M. Murugesan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Murugesan, M., et al.. (2025). Ozone-Ethylene Radical Activation of SiCN/Cu without Water Rinsing for Hybrid Bonding. 1948–1951. 1 indexed citations
2.
Sone, Eli D., et al.. (2023). Physical Properties of Large Cu Grain and Application to Cu-SiO2 Hybrid Bonding. 43–44. 1 indexed citations
3.
Murugesan, M., et al.. (2022). Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 317–323. 25 indexed citations
4.
Murugesan, M., et al.. (2022). Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 56. 1138–1143. 1 indexed citations
5.
Murugesan, M., et al.. (2021). Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics. Japanese Journal of Applied Physics. 60(SB). SBBC02–SBBC02. 2 indexed citations
6.
Murugesan, M., Akihisa Takeuchi, Takafumi Fukushima, & Mitsumasa Koyanagi. (2019). X-ray computed tomography studies on directed self-assembly formed vertical nanocylinders containing metals for 3D LSI applications—characterization technique-dependent reliability issues. Japanese Journal of Applied Physics. 58(SB). SBBC05–SBBC05. 3 indexed citations
7.
Fukushima, Takafumi, et al.. (2018). High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(1). 181–188. 7 indexed citations
8.
9.
Fukushima, Takafumi, M. Murugesan, Hiroyuki Hashimoto, et al.. (2016). New concept of TSV formation methodology using Directed Self-Assembly (DSA). 1–4. 3 indexed citations
10.
Murugesan, M., Takafumi Fukushima, J. C. Bea, et al.. (2016). Back-via 3D integration technologies by temporary bonding with thermoplastic adhesives and visible-laser debonding. 265–269. 1 indexed citations
11.
Suzuki, Taku, Takafumi Fukushima, J. C. Bea, et al.. (2015). Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration. 1. 342–347. 8 indexed citations
12.
Fukushima, Takafumi, J. C. Bea, Hisashi Kino, et al.. (2014). Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film. IEEE Transactions on Electron Devices. 61(2). 533–539. 41 indexed citations
13.
Kino, Hisashi, et al.. (2013). Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI. 10. 360–365. 10 indexed citations
14.
Lee, Kyung-Woo, Yuki Ohara, K. Kiyoyama, et al.. (2012). Characterization of chip-level hetero-integration technology for high-speed, highly parallel 3D-stacked image processing system. 33.2.1–33.2.4. 12 indexed citations
15.
Murugesan, M., et al.. (2012). W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 110. 1–4. 4 indexed citations
16.
Murugesan, M., Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, & Mitsumasa Koyanagi. (2012). Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking. Journal of Electronic Materials. 41(4). 720–729. 12 indexed citations
17.
Tanaka, Tetsu, et al.. (2011). 3D LSI technology and reliability issues. Symposium on VLSI Technology. 184–185. 2 indexed citations
18.
Murugesan, M., Takafumi Fukushima, Tetsu Tanaka, & Mitsumasa Koyanagi. (2011). Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps. IEICE Technical Report; IEICE Tech. Rep.. 110(408). 43–47. 2 indexed citations
19.
20.
Kiyoyama, K., Akihiro Noriki, M. Murugesan, et al.. (2009). Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films. Japanese Journal of Applied Physics. 48(4S). 04C157–04C157. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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