M. C. Shine

412 total citations
9 papers, 274 citations indexed

About

M. C. Shine is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, M. C. Shine has authored 9 papers receiving a total of 274 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 4 papers in Materials Chemistry. Recurrent topics in M. C. Shine's work include Electronic Packaging and Soldering Technologies (6 papers), Aluminum Alloys Composites Properties (4 papers) and Copper Interconnects and Reliability (3 papers). M. C. Shine is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Aluminum Alloys Composites Properties (4 papers) and Copper Interconnects and Reliability (3 papers). M. C. Shine collaborates with scholars based in United States and Germany. M. C. Shine's co-authors include F. M. d’Heurle, Z. Mei, J. W. Morris, N. G. Ainslie, A. Gangulee, D. Grivas, S. R. Herd and R.K. MacCrone and has published in prestigious journals such as Applied Physics Letters, IBM Journal of Research and Development and Solid-State Electronics.

In The Last Decade

M. C. Shine

9 papers receiving 258 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. C. Shine United States 8 239 137 94 56 49 9 274
C. Y. Liu United States 7 355 1.5× 151 1.1× 178 1.9× 27 0.5× 35 0.7× 10 398
H. Balkan United States 9 526 2.2× 229 1.7× 205 2.2× 23 0.4× 35 0.7× 15 545
Brook Chao United States 7 431 1.8× 203 1.5× 171 1.8× 16 0.3× 48 1.0× 12 453
King-Ning Tu United States 4 307 1.3× 136 1.0× 107 1.1× 19 0.3× 32 0.7× 6 338
B. Agarwala United States 9 305 1.3× 31 0.2× 251 2.7× 63 1.1× 16 0.3× 15 334
M. Li Singapore 9 535 2.2× 404 2.9× 61 0.6× 21 0.4× 57 1.2× 10 557
Masakatsu Hinai Russia 9 34 0.1× 244 1.8× 208 2.2× 71 1.3× 57 1.2× 74 342
S. Haque United States 9 292 1.2× 54 0.4× 23 0.2× 14 0.3× 43 0.9× 25 332
Polina Snugovsky Canada 12 344 1.4× 212 1.5× 21 0.2× 30 0.5× 88 1.8× 30 372
M. Callahan United States 11 110 0.5× 116 0.8× 101 1.1× 59 1.1× 23 0.5× 21 350

Countries citing papers authored by M. C. Shine

Since Specialization
Citations

This map shows the geographic impact of M. C. Shine's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. C. Shine with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. C. Shine more than expected).

Fields of papers citing papers by M. C. Shine

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. C. Shine. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. C. Shine. The network helps show where M. C. Shine may publish in the future.

Co-authorship network of co-authors of M. C. Shine

This figure shows the co-authorship network connecting the top 25 collaborators of M. C. Shine. A scholar is included among the top collaborators of M. C. Shine based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. C. Shine. M. C. Shine is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

9 of 9 papers shown
1.
Mei, Z., et al.. (1991). Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints. Journal of Electronic Materials. 20(10). 599–608. 67 indexed citations
2.
Mei, Z., J. W. Morris, & M. C. Shine. (1991). Superplastic Creep of Eutectic Tin-Lead Solder Joints. Journal of Electronic Packaging. 113(2). 109–114. 18 indexed citations
3.
Mei, Z., D. Grivas, M. C. Shine, & J. W. Morris. (1990). Superplastic creep of eutectic tinlead solder joints. Journal of Electronic Materials. 19(11). 1273–1280. 34 indexed citations
4.
Shine, M. C., et al.. (1985). Investigation of Solder Fatigue Acceleration Factors. IEEE Transactions on Components Hybrids and Manufacturing Technology. 8(2). 275–282. 29 indexed citations
5.
Shine, M. C.. (1975). A simplified technique for measuring fast surface states. Solid-State Electronics. 18(12). 1135–1140. 3 indexed citations
6.
Shine, M. C. & S. R. Herd. (1972). Effect of Direct Current on Precipitation in Quenched Al + 4% Cu Thin Films. Applied Physics Letters. 20(6). 217–219. 17 indexed citations
7.
d’Heurle, F. M., N. G. Ainslie, A. Gangulee, & M. C. Shine. (1972). Activation Energy for Electromigration Failure in Aluminum Films Containing Copper. Journal of Vacuum Science and Technology. 9(1). 289–293. 61 indexed citations
8.
Shine, M. C. & F. M. d’Heurle. (1971). Activation Energy for Electromigration in Aluminum Films Alloyed with Copper. IBM Journal of Research and Development. 15(5). 378–383. 36 indexed citations
9.
Shine, M. C. & R.K. MacCrone. (1968). ac Dielectric Investigations of the Gyulai-Hartly Effect: Enhanced Conductivity in Alkali Halides following Plastic Deformation. Physical Review. 176(3). 1076–1088. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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