Jonathan Reid

1.2k total citations
37 papers, 958 citations indexed

About

Jonathan Reid is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Jonathan Reid has authored 37 papers receiving a total of 958 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 15 papers in Electronic, Optical and Magnetic Materials and 15 papers in Materials Chemistry. Recurrent topics in Jonathan Reid's work include Electrodeposition and Electroless Coatings (20 papers), Copper Interconnects and Reliability (15 papers) and Corrosion Behavior and Inhibition (9 papers). Jonathan Reid is often cited by papers focused on Electrodeposition and Electroless Coatings (20 papers), Copper Interconnects and Reliability (15 papers) and Corrosion Behavior and Inhibition (9 papers). Jonathan Reid collaborates with scholars based in United States and United Kingdom. Jonathan Reid's co-authors include Richard P. Buck, Alan C. West, S.T. Mayer, Joseph E. Hummer, B.R. Scharifker, Laurence M. Peter, William H. Lawrence, Petr Vanýsek, Owen R. Melroy and Tighe A. Spurlin and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Applied Polymer Science and Japanese Journal of Applied Physics.

In The Last Decade

Jonathan Reid

33 papers receiving 885 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jonathan Reid United States 16 594 339 273 201 130 37 958
Zhenhui Ma China 19 196 0.3× 439 1.3× 31 0.1× 522 2.6× 37 0.3× 53 1.2k
Shi‐Chern Yen Taiwan 14 682 1.1× 275 0.8× 87 0.3× 244 1.2× 14 0.1× 39 975
Guokun Liu China 16 379 0.6× 242 0.7× 86 0.3× 100 0.5× 14 0.1× 34 776
William Tiedemann United States 13 1.3k 2.3× 138 0.4× 95 0.3× 128 0.6× 51 0.4× 27 1.6k
Bala S. Haran United States 17 944 1.6× 231 0.7× 35 0.1× 275 1.4× 27 0.2× 25 1.2k
Lianping Wu United States 15 445 0.7× 647 1.9× 60 0.2× 98 0.5× 10 0.1× 23 1.3k
Zhiyu Mao China 18 711 1.2× 136 0.4× 18 0.1× 270 1.3× 31 0.2× 50 917
Z. Stoynov Bulgaria 20 529 0.9× 504 1.5× 170 0.6× 133 0.7× 32 0.2× 52 1.0k
Zhou Chang China 14 289 0.5× 241 0.7× 8 0.0× 37 0.2× 28 0.2× 43 584

Countries citing papers authored by Jonathan Reid

Since Specialization
Citations

This map shows the geographic impact of Jonathan Reid's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jonathan Reid with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jonathan Reid more than expected).

Fields of papers citing papers by Jonathan Reid

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jonathan Reid. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jonathan Reid. The network helps show where Jonathan Reid may publish in the future.

Co-authorship network of co-authors of Jonathan Reid

This figure shows the co-authorship network connecting the top 25 collaborators of Jonathan Reid. A scholar is included among the top collaborators of Jonathan Reid based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jonathan Reid. Jonathan Reid is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Schroeder, Bastian J., Paul Ryus, Sarah Brown, et al.. (2024). Guide for Intersection Control Evaluation. Transportation Research Board eBooks.
2.
Rigsby, Matthew A., et al.. (2022). Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte. Journal of The Electrochemical Society. 169(8). 82508–82508. 2 indexed citations
3.
Rigsby, Matthew A., et al.. (2018). The Critical Role of pH Gradient Formation in Driving Superconformal Cobalt Deposition. Journal of The Electrochemical Society. 166(1). D3167–D3174. 31 indexed citations
4.
Zhou, Jian, et al.. (2015). Low Cu electrolyte for advanced damascene plating. 7. 1–4.
5.
Reid, Jonathan, et al.. (2014). Median U-Turn Informational Guide. 8 indexed citations
6.
Reid, Jonathan, et al.. (2014). Median u-turn intersection : informational guide.. 4 indexed citations
7.
Akolkar, Rohan, et al.. (2011). Direct seed electroplating of copper on ruthenium liners. 1–3. 5 indexed citations
8.
Reid, Jonathan. (2010). Electrodeposition of Cu in TSV Structures. ECS Meeting Abstracts. MA2010-02(32). 1992–1992. 1 indexed citations
9.
Reid, Jonathan & Jian Zhou. (2007). Impact of Leveler Molecular Weight and Concentration on Damascene Copper Electroplating. ECS Transactions. 2(6). 77–92. 20 indexed citations
10.
Webb, Eric G., et al.. (2007). Leveling Characteristics of Wide Features. ECS Meeting Abstracts. MA2007-02(25). 1298–1298. 1 indexed citations
11.
12.
Reid, Jonathan. (2001). Copper Electrodeposition: Principles and Recent Progress. Japanese Journal of Applied Physics. 40(4S). 2650–2650. 124 indexed citations
13.
West, Alan C., S.T. Mayer, & Jonathan Reid. (2001). A Superfilling Model that Predicts Bump Formation. Electrochemical and Solid-State Letters. 4(7). C50–C50. 201 indexed citations
14.
Reid, Jonathan. (2000). USING QUADRANT ROADWAYS TO IMPROVE ARTERIAL INTERSECTION OPERATIONS. ITE journal. 70(6). 10 indexed citations
15.
Reid, Jonathan & Joseph E. Hummer. (1999). Analyzing System Travel Time in Arterial Corridors with Unconventional Designs Using Microscopic Simulation. Transportation Research Record Journal of the Transportation Research Board. 1678(1). 208–215. 42 indexed citations
16.
Reid, Jonathan, et al.. (1987). Effects of polyethylene glycol on the electrochemical characteristics of copper cathodes in an acid copper medium. 74(1). 66–70. 57 indexed citations
17.
Reid, Jonathan, et al.. (1987). Impedance Behavior of a Sulfuric Acid‐Cupric Sulfate/Copper Cathode Interface. Journal of The Electrochemical Society. 134(6). 1389–1394. 38 indexed citations
18.
Vanýsek, Petr, et al.. (1984). Properties of the Interface Between Two Immiscible Electrolytes in the Presence of Proteins. Journal of The Electrochemical Society. 131(8). 1788–1791. 37 indexed citations
19.
Reid, Jonathan, Petr Vanýsek, & Richard P. Buck. (1984). Potential dependence of capacitance at a liquid/liquid interface. Journal of Electroanalytical Chemistry. 170(1-2). 109–125. 12 indexed citations
20.
Peter, Laurence M., Jonathan Reid, & B.R. Scharifker. (1981). Electrochemical adsorption and phase formation on mercury in sulphide ion solutions. Journal of Electroanalytical Chemistry. 119(1). 73–91. 63 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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