Yong‐Sung Eom

1.2k total citations
80 papers, 1.0k citations indexed

About

Yong‐Sung Eom is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Yong‐Sung Eom has authored 80 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 66 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 18 papers in Automotive Engineering. Recurrent topics in Yong‐Sung Eom's work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (48 papers) and Additive Manufacturing and 3D Printing Technologies (18 papers). Yong‐Sung Eom is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (48 papers) and Additive Manufacturing and 3D Printing Technologies (18 papers). Yong‐Sung Eom collaborates with scholars based in South Korea, United States and Switzerland. Yong‐Sung Eom's co-authors include Kwang‐Seong Choi, Hyun‐Cheol Bae, Keon‐Soo Jang, Jong-Tae Moon, Jae‐Do Nam, Véronique Michaud, Jan‐Anders Månson, L. Boogh, Jong‐Min Kim and Haksun Lee and has published in prestigious journals such as ACS Applied Materials & Interfaces, Industrial & Engineering Chemistry Research and Journal of Applied Polymer Science.

In The Last Decade

Yong‐Sung Eom

74 papers receiving 939 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yong‐Sung Eom South Korea 16 581 355 239 233 136 80 1.0k
Keon‐Soo Jang South Korea 18 313 0.5× 274 0.8× 311 1.3× 477 2.0× 95 0.7× 68 1.0k
Vipin Kumar United States 21 196 0.3× 283 0.8× 312 1.3× 416 1.8× 199 1.5× 69 1.2k
Tequila A. L. Harris United States 15 492 0.8× 244 0.7× 265 1.1× 108 0.5× 111 0.8× 68 1.0k
Patrice Melé France 14 222 0.4× 462 1.3× 333 1.4× 523 2.2× 237 1.7× 43 1.3k
Keyu Chen China 17 348 0.6× 302 0.9× 297 1.2× 89 0.4× 140 1.0× 54 994
Sangil Han France 13 244 0.4× 422 1.2× 288 1.2× 51 0.2× 194 1.4× 36 706
Hyun‐Cheol Bae South Korea 13 408 0.7× 127 0.4× 152 0.6× 121 0.5× 76 0.6× 61 637
Daniel J. O’Brien United States 17 194 0.3× 349 1.0× 183 0.8× 220 0.9× 69 0.5× 46 930
Jicai Liang China 16 217 0.4× 324 0.9× 162 0.7× 280 1.2× 89 0.7× 78 959

Countries citing papers authored by Yong‐Sung Eom

Since Specialization
Citations

This map shows the geographic impact of Yong‐Sung Eom's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yong‐Sung Eom with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yong‐Sung Eom more than expected).

Fields of papers citing papers by Yong‐Sung Eom

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yong‐Sung Eom. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yong‐Sung Eom. The network helps show where Yong‐Sung Eom may publish in the future.

Co-authorship network of co-authors of Yong‐Sung Eom

This figure shows the co-authorship network connecting the top 25 collaborators of Yong‐Sung Eom. A scholar is included among the top collaborators of Yong‐Sung Eom based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yong‐Sung Eom. Yong‐Sung Eom is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Eom, Yong‐Sung, et al.. (2025). Suppression of Ag dewetting and sinterability improvement of submicron Ag-coated Cu particles as fillers in sintering paste by surface modification with stearic acid. Transactions of Nonferrous Metals Society of China. 35(6). 2008–2020. 1 indexed citations
2.
3.
Shin, Jung H., Jiho Joo, Gwang‐Mun Choi, et al.. (2024). 91‐2: Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology. SID Symposium Digest of Technical Papers. 55(1). 1278–1281.
4.
Joo, Jiho, et al.. (2023). 30‐5: Late‐News Paper: Development of a highly reliable Mini‐LED display module using simultaneous transfer and bonding (SITRAB) technology. SID Symposium Digest of Technical Papers. 54(1). 433–436. 2 indexed citations
5.
Joo, Jiho, Gwang‐Mun Choi, Ki‐Seok Jang, et al.. (2023). Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process. 1–6. 1 indexed citations
6.
Le, Xuan-Bach D., Jiho Joo, Gwang‐Mun Choi, et al.. (2023). Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding. Micromachines. 14(3). 601–601. 11 indexed citations
7.
8.
Choi, Gwang‐Mun, et al.. (2021). Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining. Polymers. 13(6). 957–957. 9 indexed citations
9.
Choi, Kwang‐Seong, Jiho Joo, Yong‐Sung Eom, et al.. (2021). Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive. 1607–1613. 9 indexed citations
10.
Eom, Yong‐Sung, et al.. (2019). Collective laser‐assisted bonding process for 3D TSV integration with NCP. ETRI Journal. 41(3). 396–407. 22 indexed citations
11.
12.
Choi, Kwang‐Seong, et al.. (2016). Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs. 2051–2057. 3 indexed citations
13.
Eom, Yong‐Sung, et al.. (2015). Isotropic conductive paste based on epoxy with Ag coated Cu and SAC305 solder. European Microelectronics and Packaging Conference. 2 indexed citations
14.
Bae, Hyun‐Cheol, et al.. (2015). Cost-effective thermoelectric cooler packaging using hybrid Cu paste. European Microelectronics and Packaging Conference. 1 indexed citations
15.
Lee, Haksun, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, & Jin Ho Lee. (2014). Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(10). 1729–1738. 15 indexed citations
16.
Bae, Hyun‐Cheol, Haksun Lee, Yong‐Sung Eom, & Kwang‐Seong Choi. (2013). Novel Low-volume solder-on-pad for fine pitch Cu pillar bump. European Microelectronics and Packaging Conference. 1–4. 2 indexed citations
17.
Lee, Haksun, et al.. (2013). Novel interconnection technology for flex-on-glass (FOG) applications. European Microelectronics and Packaging Conference. 1–5. 2 indexed citations
18.
Choi, Kwang‐Seong, et al.. (2013). Novel Bumping Process for Solder on Pad Technology. ETRI Journal. 35(2). 340–343. 20 indexed citations
19.
Yim, Byung-Seung, Jong‐Min Kim, Seong Hyuk Lee, et al.. (2009). Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive). MATERIALS TRANSACTIONS. 50(7). 1684–1689. 7 indexed citations
20.
Eom, Yong‐Sung, et al.. (1999). DYNAMICS OF VOID FORMATION UPON CURING OF EPOXY RESIN. Infoscience (Ecole Polytechnique Fédérale de Lausanne). 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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