Tamás Hurtony

522 citations
43 papers · 411 indexed · h-index 13
Topics
Electronic Packaging and Soldering Technologies (38 papers)3D IC and TSV technologies (15 papers)Advanced Welding Techniques Analysis (10 papers)
Partner nations
HungaryPolandCzechia

In The Last Decade

Tamás Hurtony

41 papers receiving 408 citations

Peers

Tamás Hurtony
Comparison fields: 5 of 47
  • Electrical and Electronic Engineering 363
  • Mechanical Engineering 243
  • Aerospace Engineering 50
  • Materials Chemistry 39
  • Mechanics of Materials 35
Replace Jong‐Kai Lin with:
Jong‐Kai Lin United States
Yi-Wun Wang Taiwan
G.Y. Li Singapore
J. K. Lin United States
Tama Fouzder Bangladesh
Kuo-Chuan Liu United States
Zhixian Min China
P.L. Tu Hong Kong
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Citations per field
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Citations per year

Countries citing papers authored by Tamás Hurtony

Since Specialization
Citations

This map shows the geographic impact of Tamás Hurtony's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tamás Hurtony with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tamás Hurtony more than expected).

Fields of papers citing papers by Tamás Hurtony

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tamás Hurtony. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tamás Hurtony. The network helps show where Tamás Hurtony may publish in the future.

Co-authorship network of co-authors of Tamás Hurtony

This figure shows the co-authorship network connecting the top 25 collaborators of Tamás Hurtony. A scholar is included among the top collaborators of Tamás Hurtony based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tamás Hurtony. Tamás Hurtony is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
#WorkIndexed citations
1 2
2 1
3 2
4 20
5 28
6 1
7 1
8 25
9 1
10 1
11 10
12 1
13 3
14 36
15 29
16 7
17 6
18 2
19
Optimization of flip-chip laser soldering for low temperature stability substrate
1
20 1

About Tamás Hurtony

Tamás Hurtony is a scholar working on General Materials Science, Electrical and Electronic Engineering and Mechanical Engineering, having authored 43 papers that have together received 411 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (10 papers). The work is most often cited by research in General Materials Science (24 citations), Mechanical Engineering (243 citations) and Electrical and Electronic Engineering (363 citations). Tamás Hurtony has collaborated with scholars based in Hungary, Poland and Czechia. Frequent co-authors include Balázs Illés, Agata Skwarek, Olivér Krammer, Bálint Medgyes, Attila Bonyár, David Bušek, Karel Dušek, Gábor Harsányi, Attila Géczy and Przemysław Ptak. Their work appears in journals such as Corrosion Science, Journal of Alloys and Compounds and Surface and Coatings Technology.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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