Tamás Hurtony

522 total citations
43 papers, 411 citations indexed

About

Tamás Hurtony is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Tamás Hurtony has authored 43 papers receiving a total of 411 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 6 papers in Aerospace Engineering. Recurrent topics in Tamás Hurtony's work include Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (10 papers). Tamás Hurtony is often cited by papers focused on Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (10 papers). Tamás Hurtony collaborates with scholars based in Hungary, Poland and Czechia. Tamás Hurtony's co-authors include Balázs Illés, Agata Skwarek, Olivér Krammer, Bálint Medgyes, Attila Bonyár, Karel Dušek, David Bušek, Gábor Harsányi, Attila Géczy and Krzysztof Górecki and has published in prestigious journals such as Corrosion Science, Journal of Alloys and Compounds and Surface and Coatings Technology.

In The Last Decade

Tamás Hurtony

41 papers receiving 408 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Tamás Hurtony Hungary	13	363	243	50	39	35	43	411
G.Y. Li Singapore	8	298 0.8×	261 1.1×	71 1.4×	28 0.7×	36 1.0×	12	352
Jong‐Kai Lin United States	12	381 1.0×	187 0.8×	33 0.7×	16 0.4×	36 1.0×	33	394
P.L. Tu Hong Kong	10	510 1.4×	358 1.5×	66 1.3×	19 0.5×	47 1.3×	18	537
Kuo-Chuan Liu United States	11	333 0.9×	214 0.9×	52 1.0×	22 0.6×	19 0.5×	24	352
Yi-Wun Wang Taiwan	14	684 1.9×	535 2.2×	82 1.6×	58 1.5×	24 0.7×	35	750
J. K. Lin United States	6	606 1.7×	428 1.8×	115 2.3×	30 0.8×	29 0.8×	8	616
C.J. Hang China	8	280 0.8×	223 0.9×	69 1.4×	55 1.4×	49 1.4×	9	381
Zhixian Min China	14	440 1.2×	439 1.8×	102 2.0×	113 2.9×	23 0.7×	29	554

Countries citing papers authored by Tamás Hurtony

Since Specialization

Citations

This map shows the geographic impact of Tamás Hurtony's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tamás Hurtony with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tamás Hurtony more than expected).

Fields of papers citing papers by Tamás Hurtony

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tamás Hurtony. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tamás Hurtony. The network helps show where Tamás Hurtony may publish in the future.

Co-authorship network of co-authors of Tamás Hurtony

This figure shows the co-authorship network connecting the top 25 collaborators of Tamás Hurtony. A scholar is included among the top collaborators of Tamás Hurtony based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tamás Hurtony. Tamás Hurtony is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Skwarek, Agata, Tamás Hurtony, Olivér Krammer, et al.. (2025). Risk of transition to lead-free in the space sector: Sn whisker growth in thermal vacuum conditions from submicron Sn layer. Materials & Design. 250. 113637–113637. 2 indexed citations

Hurtony, Tamás, et al.. (2024). Board Level Underfill – Moisture Related Voids. 1–6. 1 indexed citations

Hurtony, Tamás, et al.. (2023). Board Level Underfill – the Influence of Flux. 1–4. 2 indexed citations

Illés, Balázs, et al.. (2022). Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy. Journal of Materials Research and Technology. 20. 4231–4240. 28 indexed citations

Skwarek, Agata, et al.. (2022). Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints. Journal of Materials Research and Technology. 22. 403–412. 25 indexed citations

Skwarek, Agata, Balázs Illés, Tamás Hurtony, David Bušek, & Karel Dušek. (2020). Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb. Materials. 13(4). 968–968. 1 indexed citations

Skwarek, Agata, Przemysław Ptak, Krzysztof Górecki, Tamás Hurtony, & Balázs Illés. (2020). Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies. Materials. 13(7). 1563–1563. 25 indexed citations

Illés, Balázs, Tamás Hurtony, Olivér Krammer, et al.. (2020). Whisker Development from SAC0307-Mn07 Solder Alloy. 1–5. 1 indexed citations

Gál, László, et al.. (2019). Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering. 154 155. 1–6. 1 indexed citations

10.

Illés, Balázs, et al.. (2019). Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy. 1–5. 1 indexed citations

11.

Skwarek, Agata, Balázs Illés, Tamás Hurtony, et al.. (2018). Reliability studies of InnoLot and SnBi joints soldered on DBC substrate. Soldering and Surface Mount Technology. 30(4). 205–212. 10 indexed citations

12.

Illés, Balázs, Agata Skwarek, J. Ratajczak, et al.. (2017). Whisker growth from vacuum evaporated submicron Sn thin films. Surface and Coatings Technology. 311. 216–222. 13 indexed citations

13.

Hurtony, Tamás, et al.. (2016). Characterization of the microstructure of tin-silver lead free solder. Journal of Alloys and Compounds. 672. 13–19. 18 indexed citations

14.

Hurtony, Tamás, et al.. (2015). Electrochemical Impedance Spectroscopy as a Prospective Tool for the Characterization of the Intermetallic Microstructure of Lead Free Solder. Materials science forum. 812. 333–338. 3 indexed citations

15.

Hurtony, Tamás, et al.. (2012). Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM. Microelectronics Reliability. 52(6). 1138–1142. 29 indexed citations

16.

Bonyár, Attila, Tamás Hurtony, & Szabolcs Dávid. (2012). Investigation of the oxidation process at the copper-solder interface with atomic force microscopy. 2 indexed citations

17.

Bonyár, Attila, Tamás Hurtony, & Gábor Harsányi. (2012). Selective electrochemical etching for the investigation of solder joint microstructures. 89–94. 7 indexed citations

18.

Hurtony, Tamás, et al.. (2010). Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating. Micro and Nanosystems. 2(3). 178–184. 6 indexed citations

19.

Hurtony, Tamás, et al.. (2009). Optimization of flip-chip laser soldering for low temperature stability substrate. 1–6. 1 indexed citations

20.

Hurtony, Tamás. (2008). Simulation and modeling of laser ablation. 10. 452–457. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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