David Bušek

843 total citations
82 papers, 614 citations indexed

About

David Bušek is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, David Bušek has authored 82 papers receiving a total of 614 indexed citations (citations by other indexed papers that have themselves been cited), including 71 papers in Electrical and Electronic Engineering, 40 papers in Mechanical Engineering and 15 papers in Mechanics of Materials. Recurrent topics in David Bušek's work include Electronic Packaging and Soldering Technologies (71 papers), 3D IC and TSV technologies (24 papers) and Advanced Welding Techniques Analysis (12 papers). David Bušek is often cited by papers focused on Electronic Packaging and Soldering Technologies (71 papers), 3D IC and TSV technologies (24 papers) and Advanced Welding Techniques Analysis (12 papers). David Bušek collaborates with scholars based in Czechia, Hungary and Poland. David Bušek's co-authors include Karel Dušek, Balázs Illés, Attila Géczy, Olivér Krammer, Agata Skwarek, Pavel Mach, Petr Veselý, Tamás Hurtony, J. Starý and Bálint Medgyes and has published in prestigious journals such as SHILAP Revista de lepidopterología, International Journal of Heat and Mass Transfer and Sensors.

In The Last Decade

David Bušek

79 papers receiving 604 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David Bušek Czechia 14 490 301 97 68 66 82 614
Karel Dušek Czechia 15 592 1.2× 344 1.1× 96 1.0× 76 1.1× 95 1.4× 113 760
Valery Rudnev Russia 5 203 0.4× 629 2.1× 147 1.5× 61 0.9× 151 2.3× 19 795
Raymond L. Cook 2 188 0.4× 595 2.0× 141 1.5× 59 0.9× 142 2.2× 2 752
Raj Bhatti United Kingdom 11 335 0.7× 379 1.3× 100 1.0× 80 1.2× 262 4.0× 33 692
Yiyu Qian China 15 446 0.9× 627 2.1× 75 0.8× 23 0.3× 133 2.0× 41 827
F. Patrick McCluskey United States 15 531 1.1× 590 2.0× 50 0.5× 54 0.8× 139 2.1× 60 968
Don Loveless 4 189 0.4× 608 2.0× 145 1.5× 60 0.9× 148 2.2× 5 767
Martin Corfield United Kingdom 13 334 0.7× 467 1.6× 66 0.7× 78 1.1× 74 1.1× 35 783
Paul G. Harris United Kingdom 11 267 0.5× 157 0.5× 88 0.9× 57 0.8× 64 1.0× 21 444
Yufen Gu China 16 104 0.2× 406 1.3× 73 0.8× 44 0.6× 168 2.5× 36 600

Countries citing papers authored by David Bušek

Since Specialization
Citations

This map shows the geographic impact of David Bušek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Bušek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Bušek more than expected).

Fields of papers citing papers by David Bušek

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David Bušek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Bušek. The network helps show where David Bušek may publish in the future.

Co-authorship network of co-authors of David Bušek

This figure shows the co-authorship network connecting the top 25 collaborators of David Bušek. A scholar is included among the top collaborators of David Bušek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David Bušek. David Bušek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Illés, Balázs, et al.. (2025). Vapour phase reflow soldering with vertical assembly stacking to improve productivity. Results in Engineering. 25. 104414–104414. 2 indexed citations
2.
3.
Géczy, Attila, et al.. (2023). Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic. Materials. 16(3). 903–903. 5 indexed citations
4.
Illés, Balázs, et al.. (2022). Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy. Journal of Materials Research and Technology. 20. 4231–4240. 28 indexed citations
5.
Bušek, David, et al.. (2021). Comparison of Gold-Plated PCB Finishes after Thermal Stress. 1–5. 1 indexed citations
6.
Skwarek, Agata, Balázs Illés, Tamás Hurtony, David Bušek, & Karel Dušek. (2020). Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb. Materials. 13(4). 968–968. 1 indexed citations
7.
Dušek, Karel, et al.. (2020). Analysis of a failure in a molded package caused by electrochemical migration. Engineering Failure Analysis. 121. 105128–105128. 7 indexed citations
8.
Bušek, David, et al.. (2019). Modelling of temperature distribution along PCB thickness in different substrates during reflow. Circuit World. 46(2). 85–92. 12 indexed citations
9.
Géczy, Attila, András Á. Sipos, András Kiss, et al.. (2019). Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs. Circuit World. 45(1). 37–44. 11 indexed citations
10.
Illés, Balázs, Attila Géczy, Olivér Krammer, Karel Dušek, & David Bušek. (2018). Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering. International Journal of Heat and Mass Transfer. 125. 202–209. 8 indexed citations
11.
Bušek, David, et al.. (2017). VISUALIZATION OF MEMS STRUCTURES FOR EDUCATION OF AUTOMOBILE MICROSYSTEMS. SHILAP Revista de lepidopterología. 17(3). 17–21. 1 indexed citations
12.
Dušek, Karel, et al.. (2017). Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect). Journal of Materials Processing Technology. 251. 20–25. 10 indexed citations
13.
Skwarek, Agata, et al.. (2017). Identification and characterization of ß→α-Sn transition in SnCu1 bulk alloy inoculated with InSb. Journal of Materials Science Materials in Electronics. 28(21). 16329–16335. 7 indexed citations
14.
Bušek, David, et al.. (2017). Wetting balance test — Comparison of solder alloys wetting. 1–5. 1 indexed citations
15.
Bušek, David, Jan Vávra, & Karel Dušek. (2016). Whisker growth and its dependence on substrate type and applied stress. 263–266. 3 indexed citations
16.
17.
Bušek, David, et al.. (2015). Determination of BGA solder joint detachment cause - warpage effect. 306–309. 2 indexed citations
18.
Bušek, David & Pavel Mach. (2012). Study of glass transition temperature of electrically conductive adhesives. 143–146. 3 indexed citations
19.
Bušek, David, et al.. (2011). Radio-frequency solder film surface resistance measurement. International Conference on Applied Electronics. 1–4. 1 indexed citations
20.
Bušek, David & Pavel Mach. (2008). Electrical connection network within an electrically conductive adhesive. Cvut DSpace (Czech Technical University). 184–188. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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