Karel Dušek
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Mechanics of Materials top 10%
- Materials Chemistry
- Biomedical Engineering
- Co-authors
- David BušekBalázs IllésPetr VeselýOlivér KrammerA. RudajevováAttila GéczyAgata SkwarekPavel Mach
- Topics
- Electronic Packaging and Soldering Technologies (87 papers)3D IC and TSV technologies (35 papers)Metallurgical and Alloy Processes (16 papers)
In The Last Decade
Karel Dušek
105 papers receiving 742 citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 592
- Mechanical Engineering 344
- Mechanics of Materials 96
- Materials Chemistry 95
- Biomedical Engineering 76
Countries citing papers authored by Karel Dušek
This map shows the geographic impact of Karel Dušek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Karel Dušek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Karel Dušek more than expected).
Fields of papers citing papers by Karel Dušek
This network shows the impact of papers produced by Karel Dušek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Karel Dušek. The network helps show where Karel Dušek may publish in the future.
Co-authorship network of co-authors of Karel Dušek
This figure shows the co-authorship network connecting the top 25 collaborators of Karel Dušek. A scholar is included among the top collaborators of Karel Dušek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Karel Dušek. Karel Dušek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 2 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 2 | |
| 6 | 15 | |
| 7 | 1 | |
| 8 | 0 | |
| 9 | 1 | |
| 10 | 1 | |
| 11 | 2 | |
| 12 | 5 | |
| 13 | 3 | |
| 14 | 5 | |
| 15 | 10 | |
| 16 | 14 | |
| 17 | 1 | |
| 18 | 6 | |
| 19 | 5 | |
| 20 | 0 |
About Karel Dušek
Karel Dušek is a scholar working on General Materials Science, Electrical and Electronic Engineering and Mechanical Engineering, having authored 113 papers that have together received 760 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (87 papers), 3D IC and TSV technologies (35 papers) and Metallurgical and Alloy Processes (16 papers). The work is most often cited by research in General Materials Science (61 citations), Electrical and Electronic Engineering (592 citations) and Mechanical Engineering (344 citations). Karel Dušek has collaborated with scholars based in Czechia, Hungary and Poland. Frequent co-authors include David Bušek, Balázs Illés, Petr Veselý, Olivér Krammer, A. Rudajevová, Attila Géczy, Agata Skwarek, Pavel Mach, Tamás Hurtony and J. Starý. Their work appears in journals such as International Journal of Heat and Mass Transfer, Journal of Chromatography A and Sensors.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.