Olivér Krammer

1.2k total citations
112 papers, 904 citations indexed

About

Olivér Krammer is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Olivér Krammer has authored 112 papers receiving a total of 904 indexed citations (citations by other indexed papers that have themselves been cited), including 90 papers in Electrical and Electronic Engineering, 59 papers in Mechanical Engineering and 20 papers in Mechanics of Materials. Recurrent topics in Olivér Krammer's work include Electronic Packaging and Soldering Technologies (85 papers), 3D IC and TSV technologies (42 papers) and Advanced Welding Techniques Analysis (15 papers). Olivér Krammer is often cited by papers focused on Electronic Packaging and Soldering Technologies (85 papers), 3D IC and TSV technologies (42 papers) and Advanced Welding Techniques Analysis (15 papers). Olivér Krammer collaborates with scholars based in Hungary, Czechia and Poland. Olivér Krammer's co-authors include Balázs Illés, Karel Dušek, Attila Géczy, David Bušek, Péter Martinek, László Jakab, Tamás Hurtony, Bálint Medgyes, Gábor Harsányi and Barbara Horváth and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, International Journal of Heat and Mass Transfer and Corrosion Science.

In The Last Decade

Olivér Krammer

102 papers receiving 881 citations

Peers

Olivér Krammer
Hua Lu United Kingdom
D.C. Whalley United Kingdom
Reza Ghaffarian United States
Emeka H. Amalu United Kingdom
Wei Dai China
Olivér Krammer
Citations per year, relative to Olivér Krammer Olivér Krammer (= 1×) peers Attila Géczy

Countries citing papers authored by Olivér Krammer

Since Specialization
Citations

This map shows the geographic impact of Olivér Krammer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Olivér Krammer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Olivér Krammer more than expected).

Fields of papers citing papers by Olivér Krammer

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Olivér Krammer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Olivér Krammer. The network helps show where Olivér Krammer may publish in the future.

Co-authorship network of co-authors of Olivér Krammer

This figure shows the co-authorship network connecting the top 25 collaborators of Olivér Krammer. A scholar is included among the top collaborators of Olivér Krammer based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Olivér Krammer. Olivér Krammer is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Skwarek, Agata, Tamás Hurtony, Olivér Krammer, et al.. (2025). Risk of transition to lead-free in the space sector: Sn whisker growth in thermal vacuum conditions from submicron Sn layer. Materials & Design. 250. 113637–113637. 2 indexed citations
2.
Géczy, Attila, Olivér Krammer, Balázs Illés, et al.. (2025). Influence of Fe-nanoparticle doped flux on electromigration effects in SAC305 solder joints. Journal of Materials Research and Technology. 38. 5866–5877.
5.
Krammer, Olivér, et al.. (2024). Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. 262–265. 1 indexed citations
9.
Krammer, Olivér, et al.. (2023). Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors. Sensors. 23(10). 4879–4879. 19 indexed citations
12.
Krammer, Olivér, et al.. (2021). Transient Numerical Modelling of the Pin-in-Paste Technology. Applied Sciences. 11(10). 4670–4670. 4 indexed citations
13.
Martinek, Péter & Olivér Krammer. (2019). Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology. Computers & Industrial Engineering. 136. 187–194. 28 indexed citations
14.
Illés, Balázs, et al.. (2019). Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy. 1–5. 1 indexed citations
15.
Illés, Balázs, Attila Géczy, Olivér Krammer, Karel Dušek, & David Bušek. (2018). Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering. International Journal of Heat and Mass Transfer. 125. 202–209. 8 indexed citations
16.
Dušek, Karel, et al.. (2017). Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect). Journal of Materials Processing Technology. 251. 20–25. 10 indexed citations
18.
Krammer, Olivér, et al.. (2013). Investigating micro-alloyed solder joints with electrochemical etching. 154. 161–166.
19.
Jakab, László, et al.. (2008). X-ray imaging in pin-in-paste technology. 52(1-2). 21–21.
20.
Illés, Balázs, et al.. (2007). 3D Investigations of the Internal Convection Coefficient and Homogeneity in Reflow Ovens. 150. 320–325. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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