Alan Huffman

1.1k citations

68 papers · 514 indexed · h-index 13

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
Language and Linguistics top 10%
- Syntax, Semantics, Linguistic Variation

Papers in ⓘ

Electrical and Electronic Engineering 45
- 3D IC and TSV technologies 34
- Electronic Packaging and Soldering Technologies 29
- CCD and CMOS Imaging Sensors 4
Automotive Engineering 7
- Additive Manufacturing and 3D Printing Technologies 7

Co-authors: Matthew Lueck (24 shared papers)D. Temple (21 shared papers)John Lannon (16 shared papers)Christopher W. Gregory (10 shared papers)Aric Shorey (2 shared papers)John M. Lannon (7 shared papers)Chris Gregory (9 shared papers)Jason D. Reed (7 shared papers)
Journals: Annals of Emergency Medicine (10 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Advanced Packaging (1 paper)Lingua (1 paper)IEEE Transactions on Electron Devices (1 paper)
Partner nations: United States Germany Singapore

In The Last Decade

Alan Huffman

62 papers receiving 470 citations

Peers

Countries citing papers authored by Alan Huffman

Since Specialization

Citations

This map shows the geographic impact of Alan Huffman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Alan Huffman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Alan Huffman more than expected).

Fields of papers citing papers by Alan Huffman

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Alan Huffman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Alan Huffman. The network helps show where Alan Huffman may publish in the future.

Co-authors

The 25 scholars most cited alongside Alan Huffman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Alan Huffman Line = papers co-authored together Alan Huffman links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 68 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration Journal of Instrumentation ·Alan Huffman, John Lannon, Matthew Lueck, Christopher W. Gregory, D. Temple	2009	36
2	Advancements in fabrication of glass interposers Aric Shorey, Philippe Cochet, Alan Huffman, John Keech, Matt Lueck, Scott Pollard, Klaus Ruhmer	2014	33
3	High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits IEEE Transactions on Electron Devices ·Matthew Lueck, Jason D. Reed, Christopher W. Gregory, Alan Huffman, John M. Lannon, D. Temple	2012	28
4	High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration Jason D. Reed, Matthew Lueck, Chris Gregory, Alan Huffman, John M. Lannon, D. Temple	2010	27
5	Through glass vias (TGV) and aspects of reliability Matthew Lueck, Alan Huffman, Aric Shorey	2015	25
6	Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump Bonds Alan Huffman, Matthew Lueck, Christopher A. Bower, D. Temple	2007	21
7	The linguistics of William Diver and the Columbia school WORD ·Alan Huffman	2001	21
8	High density Cu-Cu interconnect bonding for 3-D integration John Lannon, Christopher W. Gregory, Matthew Lueck, Alan Huffman, D. Temple	2009	20
9	Language: Communication and Human Behavior: The Linguistic Essays of William Diver BRILL eBooks ·William Diver, Alan Huffman, Joseph Davis	2012	16
10	Fabrication of TSV-based silicon interposers Dean Malta, Erik Vick, Scott Goodwin, Christopher W. Gregory, Matthew Lueck, Alan Huffman, D. Temple	2010	16
11	Large format resistive array (LFRA) infrared scene projector (IRSP) performance and production status Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Jim Oleson, Jay James, Joe LaVeigne, Kevin Sparkman, Greg Matis, Steve McHugh, John Lannon, Scott Goodwin, Alan Huffman, Steve Solomon	2007	15
12	Nanoimprint lithography fabrication of waveguide-integrated optical gratings with inexpensive stamps Microelectronic Engineering ·Sonia Grego, Alan Huffman, Matthew Lueck, Brian R. Stoner, John Lannon	2009	15
13	Fine-pitch wafer bumping and assembly for high density detector systems 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515) ·Alan Huffman, Richard LaBennett, S. Bonafede, Chad Statler	2005	13
14	TSV-Last, Heterogeneous 3D Integration of a SiGe BiCMOS Beamformer and Patch Antenna for a W-Band Phased array Radar Dean Malta, Erik Vick, Matthew Lueck, Alan Huffman, Sharon Woodruff, Parrish Ralston, Jeffrey Hartman, N. Bushyager, Günter Ebner, Stuart Quade, Adam Young, Christopher Hillman, Jonathan Hacker	2016	12
15	Bonding for 3-D Integration of Heterogeneous Technologies and Materials ECS Transactions ·D. Temple, Dean Malta, John M. Lannon, Matthew Lueck, Alan Huffman, Christopher W. Gregory, J. E. Robinson, P. R. Coffman, T. B. Welch, M. R. Skokan	2008	12
16	The Categories of Grammar Studies in language companion series ·Alan Huffman	1997	11
17	The categories of grammar : French lui and le Americanae (AECID Library) ·Alan Huffman	1997	11
18	Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization IEEE Transactions on Components Packaging and Manufacturing Technology ·John Lannon, Allan Hilton, Alan Huffman, Marianne Butler, Dean Malta, Chris Gregory, D. Temple	2013	10
19	3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes Daniel Duffy, Chris Gregory, C.D. Breach, Alan Huffman	2014	10
20	Issues with fine pitch bumping and assembly S. Nangalia, P. Deane, S. Bonfede, Alan Huffman, C. Statler, C. Lizzul Rinne	2002	9

About Alan Huffman

Alan Huffman is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, General Health Professions and Aerospace Engineering, having authored 68 papers that have together received 514 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (29 papers), Additive Manufacturing and 3D Printing Technologies (7 papers), Historical Linguistics and Language Studies (5 papers), Nanofabrication and Lithography Techniques (5 papers), Calibration and Measurement Techniques (4 papers), Infrared Target Detection Methodologies (4 papers) and CCD and CMOS Imaging Sensors (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (390 citations), Language and Linguistics (50 citations), Automotive Engineering (58 citations), Linguistics and Language (18 citations) and Electronic, Optical and Magnetic Materials (52 citations). Alan Huffman has collaborated with scholars based in United States, Germany and Singapore. Frequent co-authors include Matthew Lueck, D. Temple, John Lannon, Christopher W. Gregory, Aric Shorey, John M. Lannon, Chris Gregory, Jason D. Reed, Dean Malta and Christopher A. Bower. Their work appears in journals such as Annals of Emergency Medicine, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, Lingua and IEEE Transactions on Electron Devices.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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