Alan Huffman

1.1k total citations
68 papers, 514 citations indexed

About

Alan Huffman is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Alan Huffman has authored 68 papers receiving a total of 514 indexed citations (citations by other indexed papers that have themselves been cited), including 45 papers in Electrical and Electronic Engineering, 7 papers in Automotive Engineering and 7 papers in Biomedical Engineering. Recurrent topics in Alan Huffman's work include 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (29 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). Alan Huffman is often cited by papers focused on 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (29 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). Alan Huffman collaborates with scholars based in United States, Germany and Singapore. Alan Huffman's co-authors include Matthew Lueck, D. Temple, John Lannon, Christopher W. Gregory, John M. Lannon, Aric Shorey, Chris Gregory, Jason D. Reed, Dean Malta and Christopher A. Bower and has published in prestigious journals such as IEEE Transactions on Electron Devices, Annals of Emergency Medicine and Journal of Electronic Materials.

In The Last Decade

Alan Huffman

62 papers receiving 470 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Alan Huffman United States 13 390 79 58 52 50 68 514
Lan Kim South Korea 10 207 0.5× 43 0.5× 5 0.1× 8 0.2× 24 0.5× 17 378
Jaber Derakhshandeh Belgium 15 497 1.3× 141 1.8× 33 0.6× 52 1.0× 91 608
D. Tucker United States 12 235 0.6× 139 1.8× 15 0.3× 59 1.1× 17 575
Fang‐Lin Chao Taiwan 16 686 1.8× 123 1.6× 51 0.9× 27 0.5× 76 841
Matthew Lueck United States 15 566 1.5× 131 1.7× 65 1.1× 56 1.1× 52 604
Vincent Larrey France 10 250 0.6× 85 1.1× 32 0.6× 54 1.0× 51 330
Jeffery C. C. Lo Hong Kong 10 261 0.7× 83 1.1× 31 0.5× 39 0.8× 98 412
S. Kadomura Japan 11 499 1.3× 79 1.0× 24 0.4× 170 3.3× 43 542
N. Bagrets Germany 14 178 0.5× 311 3.9× 27 0.5× 95 1.8× 34 503

Countries citing papers authored by Alan Huffman

Since Specialization
Citations

This map shows the geographic impact of Alan Huffman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Alan Huffman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Alan Huffman more than expected).

Fields of papers citing papers by Alan Huffman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Alan Huffman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Alan Huffman. The network helps show where Alan Huffman may publish in the future.

Co-authorship network of co-authors of Alan Huffman

This figure shows the co-authorship network connecting the top 25 collaborators of Alan Huffman. A scholar is included among the top collaborators of Alan Huffman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Alan Huffman. Alan Huffman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Allgair, John A., et al.. (2025). Development of Si-Interposers for 3D Heterogeneous Integration. 38(1). 8–13.
2.
3.
Huffman, Alan. (2019). Climate Change and the Emergency Department. Annals of Emergency Medicine. 73(5). A19–A22. 3 indexed citations
4.
Huffman, Alan. (2017). Emergency Physician Arrest Raises Questions About Female Genital Mutilation in United States. Annals of Emergency Medicine. 70(4). A20–A22. 2 indexed citations
5.
Malta, Dean, Erik Vick, Matthew Lueck, et al.. (2016). TSV-Last, Heterogeneous 3D Integration of a SiGe BiCMOS Beamformer and Patch Antenna for a W-Band Phased array Radar. 1457–1464. 12 indexed citations
6.
Lueck, Matthew, John Lannon, Chris Gregory, et al.. (2014). Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9100. 910009–910009. 3 indexed citations
7.
Lannon, John, et al.. (2013). Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(1). 153–157. 10 indexed citations
8.
Diver, William, Alan Huffman, & Joseph Davis. (2012). Language: Communication and Human Behavior: The Linguistic Essays of William Diver. BRILL eBooks. 16 indexed citations
9.
Brand, Sebastian, Matthias Petzold, Jason D. Reed, et al.. (2011). High resolution acoustical imaging of high-density-interconnects for 3D-integration. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 37–42. 3 indexed citations
10.
Huffman, Alan, et al.. (2010). Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1726–1742. 1 indexed citations
11.
Huffman, Alan, et al.. (2010). Manufacturability and reliability study of ALX polymers for WLP applications. 1794–1797. 1 indexed citations
12.
Huffman, Alan, John Lannon, Matthew Lueck, Christopher W. Gregory, & D. Temple. (2009). Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration. Journal of Instrumentation. 4(3). P03006–P03006. 36 indexed citations
13.
Huffman, Alan. (2009). Sultana : surviving Civil War, prison, and the worst maritime disaster in American history. Medical Entomology and Zoology.
14.
Huffman, Alan, et al.. (2009). Application and evaluation of AL-X polymer dielectric for flip chip and wafer level package bumping. 1682–1689. 1 indexed citations
15.
Huffman, Alan, Matthew Lueck, Christopher A. Bower, & D. Temple. (2007). Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump Bonds. 1589–1596. 21 indexed citations
16.
Grego, Sonia, et al.. (2006). Novel optical-waveguide sensing platform based on input grating coupler. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6123. 61230D–61230D. 3 indexed citations
17.
Lannon, John, et al.. (2004). MIRAGE: developments in IRSP system development, RIIC design, emitter fabrication, and performance. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5408. 173–173. 4 indexed citations
18.
Huffman, Alan. (2001). The linguistics of William Diver and the Columbia school. WORD. 52(1). 29–68. 21 indexed citations
19.
Huffman, Alan. (1997). The Categories of Grammar. Studies in language companion series. 11 indexed citations
20.
Huffman, Alan. (1983). ‘Government of the dative’ in French. Lingua. 60(4). 283–309. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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