Flora Somidin

432 total citations
33 papers, 354 citations indexed

About

Flora Somidin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Flora Somidin has authored 33 papers receiving a total of 354 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Flora Somidin's work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (17 papers) and Advanced Welding Techniques Analysis (9 papers). Flora Somidin is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (17 papers) and Advanced Welding Techniques Analysis (9 papers). Flora Somidin collaborates with scholars based in Malaysia, Australia and Japan. Flora Somidin's co-authors include Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Kazuhiro Nogita, Syo Matsumura, Zainal Arifin Ahmad, Xuan Quy Tran, Stuart D. McDonald, Hussin Kamarudin, Wenhui Yang and Tomokazu Yamamoto and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and The Journal of Physical Chemistry Letters.

In The Last Decade

Flora Somidin

31 papers receiving 351 citations

Peers

Flora Somidin

EEE

GMS

Wangyun Li China

Hiroaki Tatsumi Japan

Chi-Yang Yu Taiwan

Zhong Sheng China

T. Shoji Japan

Polina Snugovsky Canada

Zhixian Min China

Hsin-Yi Chuang Taiwan

G.Y. Li China

Z.F. Zhang China

Wangyun Li China

Flora Somidin

250 ×0.8

EEE

190 ×0.7

67 ×1.2

15 ×0.4

7 ×0.3

GMS

Citations per year, relative to Flora Somidin Flora Somidin (= 1×) peers Wangyun Li

Countries citing papers authored by Flora Somidin

Since Specialization

Citations

This map shows the geographic impact of Flora Somidin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Flora Somidin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Flora Somidin more than expected).

Fields of papers citing papers by Flora Somidin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Flora Somidin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Flora Somidin. The network helps show where Flora Somidin may publish in the future.

Co-authorship network of co-authors of Flora Somidin

This figure shows the co-authorship network connecting the top 25 collaborators of Flora Somidin. A scholar is included among the top collaborators of Flora Somidin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Flora Somidin. Flora Somidin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Nogita, Kazuhiro, Xin Fu Tan, Stuart D. McDonald, et al.. (2025). In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. Materials. 18(16). 3925–3925.

Salleh, Mohd Arif Anuar Mohd, et al.. (2023). The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint. Materials Science and Engineering A. 882. 145457–145457. 10 indexed citations

Salleh, Mohd Arif Anuar Mohd, et al.. (2023). Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows. Journal of Materials Research and Technology. 26. 8670–8687. 6 indexed citations

Salleh, Mohd Arif Anuar Mohd, et al.. (2022). Mixed Assembly of Lead-free Solder Joint: A Short Review. Journal of Physics Conference Series. 2169(1). 12039–12039. 2 indexed citations

Somidin, Flora, et al.. (2022). Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints. Journal of Physics Conference Series. 2169(1). 12032–12032. 1 indexed citations

Somidin, Flora, et al.. (2022). Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste. Journal of Physics Conference Series. 2169(1). 12010–12010. 1 indexed citations

Tan, Xin Fu, et al.. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters. 291. 129520–129520. 4 indexed citations

Somidin, Flora, Stuart D. McDonald, Xiaozhou Ye, et al.. (2020). Reducing Cracking in Solder Joint Interfacial Cu6Sn5 with Modified Reflow Profile. 13(0). E19–4. 3 indexed citations

Yang, Wenhui, Xuan Quy Tran, Tomokazu Yamamoto, et al.. (2020). Atomic locations of minor dopants and their roles in the stabilization ofη−Cu6Sn5. Physical Review Materials. 4(6). 10 indexed citations

10.

Somidin, Flora, Takaaki Toriyama, Stuart D. McDonald, et al.. (2019). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia. 9. 100530–100530. 8 indexed citations

11.

Somidin, Flora, Stuart D. McDonald, Dong Qu, et al.. (2019). Inhibition of cracking in Cu₆Sn₅ intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 223–228. 1 indexed citations

12.

Somidin, Flora, Xuan Quy Tran, Stuart D. McDonald, et al.. (2018). Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint. Materials. 11(11). 2229–2229. 12 indexed citations

13.

Yang, Wenhui, Tomokazu Yamamoto, Kohei Aso, et al.. (2018). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia. 158. 1–5. 32 indexed citations

14.

Somidin, Flora, et al.. (2015). Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si3N4/Cu Solder Joints. Advanced materials research. 1107. 577–581. 1 indexed citations

15.

Somidin, Flora, et al.. (2015). The Microstructure Evolutions of Sn-0.7Cu Solder Using Microwave-Assisted Sintering Method at Various Exposure Times. Advanced materials research. 1107. 582–586. 1 indexed citations

16.

Somidin, Flora, et al.. (2014). Hybrid Microwave-Assisted Rapid Sintering Process for Fabrication of Sn-0.7Cu+1.0wt.%Si3N4 Composite Solder. Materials science forum. 803. 305–309. 1 indexed citations

17.

Salleh, Mohd Arif Anuar Mohd, Mohd Mustafa Al Bakri Abdullah, Flora Somidin, & Hussin Kamarudin. (2013). Recent Development of Novel Lead-Free Composite Solders Using Microwave-Assisted Sintering Powder Metallurgy Route. International Review of Mechanical Engineering (IREME). 7(1). 53–59. 4 indexed citations

18.

Salleh, Mohd Arif Anuar Mohd, Mohd Mustafa Al Bakri Abdullah, Flora Somidin, et al.. (2013). A Comparative Study of Solder Properties of Sn-0.7Cu Lead-free Solder Fabricated Via the Powder Metallurgy and Casting Methods. Queensland's institutional digital repository (The University of Queensland). 64(7). 725–728. 11 indexed citations

19.

Salleh, Mohd Arif Anuar Mohd, et al.. (2013). Effects of Recycled-Aluminum Additions on the Mechanical Properties of Sn-0.7Cu/Cu-Substrate Lead-Free Solder Joints. Advanced materials research. 795. 446–450. 3 indexed citations

20.

Salleh, Mohd Arif Anuar Mohd, et al.. (2012). The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder. Advanced materials research. 622-623. 195–199. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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