Sandeep Shantaram
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Mechanics of Materials top 10%
- Aerospace Engineering
- Civil and Structural Engineering
- Co-authors
- Pradeep LallJeff SuhlingDhananjay PanchagadeDeepti IyengarRanjit PandherVikas YadavPrashant GuptaDavid Locker
- Topics
- Electronic Packaging and Soldering Technologies (27 papers)Integrated Circuits and Semiconductor Failure Analysis (11 papers)High-Velocity Impact and Material Behavior (7 papers)
- Journals
- IEEE Transactions on Components and Packaging TechnologiesJournal of Electronic PackagingStrain
- Partner nations
- United StatesGermanyNetherlands
In The Last Decade
Sandeep Shantaram
27 papers receiving 460 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 423
- Mechanical Engineering 159
- Mechanics of Materials 138
- Aerospace Engineering 68
- Civil and Structural Engineering 66
Countries citing papers authored by Sandeep Shantaram
This map shows the geographic impact of Sandeep Shantaram's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sandeep Shantaram with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sandeep Shantaram more than expected).
Fields of papers citing papers by Sandeep Shantaram
This network shows the impact of papers produced by Sandeep Shantaram. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sandeep Shantaram. The network helps show where Sandeep Shantaram may publish in the future.
Co-authorship network of co-authors of Sandeep Shantaram
This figure shows the co-authorship network connecting the top 25 collaborators of Sandeep Shantaram. A scholar is included among the top collaborators of Sandeep Shantaram based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sandeep Shantaram. Sandeep Shantaram is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 3 | |
| 4 | 1 | |
| 5 | 4 | |
| 6 | 1 | |
| 7 | 16 | |
| 8 | 6 | |
| 9 | 20 | |
| 10 | 28 | |
| 11 | 7 | |
| 12 | 17 | |
| 13 | 4 | |
| 14 | 0 | |
| 15 | 25 | |
| 16 | 2 | |
| 17 | 6 | |
| 18 | 1 | |
| 19 | 30 | |
| 20 | 45 |
About Sandeep Shantaram
Sandeep Shantaram is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 29 papers that have together received 465 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (27 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers) and High-Velocity Impact and Material Behavior (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (423 citations), Mechanics of Materials (138 citations) and Mechanical Engineering (159 citations). Sandeep Shantaram has collaborated with scholars based in United States, Germany and Netherlands. Frequent co-authors include Pradeep Lall, Jeff Suhling, Dhananjay Panchagade, Deepti Iyengar, Ranjit Pandher, Vikas Yadav, Prashant Gupta, David Locker, Di Zhang and Di Zhang. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging and Strain.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.