T. Dishongh

528 total citations
19 papers, 320 citations indexed

About

T. Dishongh is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Civil and Structural Engineering. According to data from OpenAlex, T. Dishongh has authored 19 papers receiving a total of 320 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 3 papers in Civil and Structural Engineering. Recurrent topics in T. Dishongh's work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Mechanical stress and fatigue analysis (3 papers). T. Dishongh is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Mechanical stress and fatigue analysis (3 papers). T. Dishongh collaborates with scholars based in United States and Ireland. T. Dishongh's co-authors include Cemal Basaran, Yuliang Zhao, Michael J. McGrath, Alexander N. Cartwright, A.H. Titus, J.L. Prince, P. Anderson, Donald W. DeYoung, C. S. Desai and John A. Szivek and has published in prestigious journals such as Journal of Applied Physics, Journal of Biomedical Materials Research and Mechanics of Materials.

In The Last Decade

T. Dishongh

19 papers receiving 298 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T. Dishongh United States	10	208	83	82	41	41	19	320
Oliver J. McCarthy Ireland	9	68 0.3×	116 1.4×	124 1.5×	35 0.9×	50 1.2×	18	316
Ke Pan United States	15	331 1.6×	116 1.4×	94 1.1×	4 0.1×	45 1.1×	43	461
Chuang Zhang China	12	204 1.0×	143 1.7×	111 1.4×	7 0.2×	22 0.5×	65	416
Jun Xiao China	8	136 0.7×	132 1.6×	27 0.3×	38 0.9×	35 0.9×	55	306
Tony Horseman United Kingdom	9	217 1.0×	27 0.3×	48 0.6×	16 0.4×	141 3.4×	22	399
Peng Dong China	11	102 0.5×	218 2.6×	57 0.7×	32 0.8×	18 0.4×	45	384

Countries citing papers authored by T. Dishongh

Since Specialization

Citations

This map shows the geographic impact of T. Dishongh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Dishongh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Dishongh more than expected).

Fields of papers citing papers by T. Dishongh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Dishongh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Dishongh. The network helps show where T. Dishongh may publish in the future.

Co-authorship network of co-authors of T. Dishongh

This figure shows the co-authorship network connecting the top 25 collaborators of T. Dishongh. A scholar is included among the top collaborators of T. Dishongh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Dishongh. T. Dishongh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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19 of 19 papers shown

McCluskey, Patrick, et al.. (2017). Electronic Packaging: Materials and Their Properties. 23 indexed citations

Dishongh, T. & Michael J. McGrath. (2009). Wireless Sensor Networks for Healthcare Applications. 48 indexed citations

Kelly, Damien P., Seán McLoone, & T. Dishongh. (2008). Experimental evaluation of a single access point bluetooth localisation system. 254–259. 1 indexed citations

Hossain, Md. Mahbub, et al.. (2006). Reliability of stack packaging varying the die stacking architectures for flash memory applications. 222–229. 4 indexed citations

Hossain, Md. Mahbub, et al.. (2006). Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices. 1088–1096. 3 indexed citations

Agonafer, Dereje, et al.. (2006). Thermal Management of Die Stacking Architecture That Includes Memory and Logic Processor. TSpace (University of Toronto). 21. 1963–1968. 11 indexed citations

Akhter, Rahena, et al.. (2006). Design for Stackability of Flash Memory Devices Based on Thermal Optimization. 2. 9.C.1–1. 6 indexed citations

Titus, A.H., et al.. (2004). Innovative Circuit Board Level Routing Designs for BGA Packages. IEEE Transactions on Advanced Packaging. 27(4). 630–639. 27 indexed citations

Zhao, Yuliang, et al.. (2002). Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling. 15. 174–180. 10 indexed citations

10.

Dishongh, T., et al.. (2002). Flow network modeling for improving flow distribution of microelectronics burn-in oven. 78–81. 5 indexed citations

11.

Dishongh, T., et al.. (2002). Impact of temperature cycle profile on fatigue life of solder joints. IEEE Transactions on Advanced Packaging. 25(3). 433–438. 13 indexed citations

12.

Zhao, Yuliang, et al.. (2002). Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation. 349–355. 8 indexed citations

13.

Zhao, Yuliang, et al.. (2000). Thermomechanical behavior of micron scale solder joints under dynamic loads. Mechanics of Materials. 32(3). 161–173. 74 indexed citations

14.

Zhao, Yuliang, et al.. (1999). Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation. Journal of the Mechanical Behavior of Materials. 10(3). 135–146. 29 indexed citations

15.

Desai, C. S., Cemal Basaran, T. Dishongh, & J.L. Prince. (1998). Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 21(1). 87–97. 20 indexed citations

16.

Desai, Chandra S., et al.. (1998). Disturbed state constitutive model for thermomechanical behavior of dislocated silicon with impurities. Journal of Applied Physics. 84(11). 5977–5984. 8 indexed citations

17.

Dasgupta, Abhijit, et al.. (1997). Perspectives to understand risks in the electronic industry. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(4). 542–547. 8 indexed citations

18.

Dishongh, T.. (1996). Disturbed state concept of materials and interfaces with applications in electronic packaging. UA Campus Repository (The University of Arizona). 2 indexed citations

19.

Szivek, John A., P. Anderson, T. Dishongh, & Donald W. DeYoung. (1996). Evaluation of factors affecting bonding rate of calcium phosphate ceramic coatings forin vivo strain gauge attachment. Journal of Biomedical Materials Research. 33(3). 121–132. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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