B. Kempf
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Materials Chemistry
- Aerospace Engineering
- General Materials Science top 5%
- Co-authors
- Markus RettenmayrJef VleugelsLudo FroyenKim VanmeenselF. HeringhausSiegfried SchmauderJ. HaußeltUlrich Klotz
- Topics
- Electronic Packaging and Soldering Technologies (8 papers)Electrical Contact Performance and Analysis (5 papers)Advanced materials and composites (4 papers)
In The Last Decade
B. Kempf
18 papers receiving 342 citations
Peers
Comparison fields: 5 of 24
- Mechanical Engineering 303
- Electrical and Electronic Engineering 167
- Materials Chemistry 84
- Aerospace Engineering 56
- General Materials Science 36
Countries citing papers authored by B. Kempf
This map shows the geographic impact of B. Kempf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Kempf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Kempf more than expected).
Fields of papers citing papers by B. Kempf
This network shows the impact of papers produced by B. Kempf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Kempf. The network helps show where B. Kempf may publish in the future.
Co-authorship network of co-authors of B. Kempf
This figure shows the co-authorship network connecting the top 25 collaborators of B. Kempf. A scholar is included among the top collaborators of B. Kempf based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B. Kempf. B. Kempf is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 34 | |
| 2 | 33 | |
| 3 | 24 | |
| 4 | 67 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 18 | |
| 8 | 6 | |
| 9 | 13 | |
| 10 | 51 | |
| 11 | 85 | |
| 12 | 1 | |
| 13 | 2 | |
| 14 | 1 | |
| 15 | 0 | |
| 16 | 9 | |
| 17 | 0 | |
| 18 | 6 | |
| 19 | 2 | |
| 20 | Damage mechanism in high temperature fatigue of alloy 800 H | 1 |
About B. Kempf
B. Kempf is a scholar working on Orthodontics, General Materials Science and Ceramics and Composites, having authored 20 papers that have together received 355 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), Electrical Contact Performance and Analysis (5 papers) and Advanced materials and composites (4 papers). The work is most often cited by research in General Materials Science (36 citations), Mechanical Engineering (303 citations) and Ceramics and Composites (26 citations). B. Kempf has collaborated with scholars based in Germany and Belgium. Frequent co-authors include Markus Rettenmayr, Jef Vleugels, Ludo Froyen, Kim Vanmeensel, F. Heringhaus, Siegfried Schmauder, J. Haußelt, Ulrich Klotz, V. Gerold and J. Beuers. Their work appears in journals such as Acta Materialia, Journal of Alloys and Compounds and Journal of Materials Processing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.