Daisuke Wakuda
Impact in
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- Electronic Packaging and Soldering Technologies
- Nanomaterials and Printing Technologies
- 3D IC and TSV technologies
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- Gold and Silver Nanoparticles Synthesis and Applications
- Copper Interconnects and Reliability
Papers in
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- Nanomaterials and Printing Technologies 11
- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 1
- Electrohydrodynamics and Fluid Dynamics 1
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- nanoparticles nucleation surface interactions 10
- Co-authors
- Katsuaki Suganuma (13 shared papers)Masaya Nogi (2 shared papers)S. Sakamoto (1 shared paper)Noriko Kagami (1 shared paper)Keun‐Soo Kim (5 shared papers)Ki‐Hyun Kim (1 shared paper)Changjae Kim (1 shared paper)
- Journals
- IEEE Transactions on Components and Packaging Technologies (2 papers)Scripta Materialia (1 paper)Microelectronics Reliability (1 paper)Applied Physics Letters (1 paper)Chemical Physics Letters (1 paper)
- Partner nations
- Japan
In The Last Decade
Daisuke Wakuda
13 papers receiving 544 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 473
- Electronic, Optical and Magnetic Materials 95
- Mechanical Engineering 190
- Biomedical Engineering 148
- Automotive Engineering 35
Countries citing papers authored by Daisuke Wakuda
This map shows the geographic impact of Daisuke Wakuda's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daisuke Wakuda with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daisuke Wakuda more than expected).
Fields of papers citing papers by Daisuke Wakuda
This network shows the impact of papers produced by Daisuke Wakuda. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daisuke Wakuda. The network helps show where Daisuke Wakuda may publish in the future.
Co-authors
The 7 scholars most cited alongside Daisuke Wakuda, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 232 | |
| 2 | 2007 | 106 | |
| 3 | 2008 | 72 | |
| 4 | 2009 | 50 | |
| 5 | 2009 | 40 | |
| 6 | 2011 | 26 | |
| 7 | 2007 | 10 | |
| 8 | 2008 | 9 | |
| 9 | 2010 | 8 | |
| 10 | 2007 | 3 | |
| 11 | 2009 | 1 | |
| 12 | Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding | 2009 | 1 |
| 13 | 2008 | 1 |
About Daisuke Wakuda
Daisuke Wakuda is a scholar working on Electrical and Electronic Engineering, Atmospheric Science, Polymers and Plastics, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 13 papers that have together received 559 indexed citations. Recurring topics across this work include Nanomaterials and Printing Technologies (11 papers), Electronic Packaging and Soldering Technologies (10 papers), nanoparticles nucleation surface interactions (10 papers), 3D IC and TSV technologies (1 paper), Electrohydrodynamics and Fluid Dynamics (1 paper), Copper Interconnects and Reliability (1 paper), Conducting polymers and applications (1 paper) and Advanced Thermoelectric Materials and Devices (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (473 citations), Electronic, Optical and Magnetic Materials (95 citations), Mechanical Engineering (190 citations), Biomedical Engineering (148 citations) and Automotive Engineering (35 citations). Daisuke Wakuda has collaborated with scholars based in Japan. Frequent co-authors include Katsuaki Suganuma, Masaya Nogi, S. Sakamoto, Noriko Kagami, Keun‐Soo Kim, Ki‐Hyun Kim and Changjae Kim. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Scripta Materialia, Microelectronics Reliability, Applied Physics Letters and Chemical Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.