Daisuke Wakuda

711 total citations
13 papers, 558 citations indexed

About

Daisuke Wakuda is a scholar working on Electrical and Electronic Engineering, Atmospheric Science and Polymers and Plastics. According to data from OpenAlex, Daisuke Wakuda has authored 13 papers receiving a total of 558 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 10 papers in Atmospheric Science and 1 paper in Polymers and Plastics. Recurrent topics in Daisuke Wakuda's work include Nanomaterials and Printing Technologies (11 papers), Electronic Packaging and Soldering Technologies (10 papers) and nanoparticles nucleation surface interactions (10 papers). Daisuke Wakuda is often cited by papers focused on Nanomaterials and Printing Technologies (11 papers), Electronic Packaging and Soldering Technologies (10 papers) and nanoparticles nucleation surface interactions (10 papers). Daisuke Wakuda collaborates with scholars based in Japan. Daisuke Wakuda's co-authors include Katsuaki Suganuma, Masaya Nogi, S. Sakamoto, Noriko Kagami, Keun‐Soo Kim, Ki‐Hyun Kim and Changjae Kim and has published in prestigious journals such as Applied Physics Letters, Chemical Physics Letters and Scripta Materialia.

In The Last Decade

Daisuke Wakuda

13 papers receiving 542 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Daisuke Wakuda Japan 9 473 189 148 95 72 13 558
Eiichi Ide Japan 13 964 2.0× 598 3.2× 94 0.6× 80 0.8× 125 1.7× 24 1.0k
Dong-Hee Yeon South Korea 15 368 0.8× 136 0.7× 89 0.6× 159 1.7× 290 4.0× 22 613
Vemal Raja Manikam Malaysia 7 433 0.9× 225 1.2× 41 0.3× 54 0.6× 82 1.1× 12 508
Zou Guisheng China 5 168 0.4× 250 1.3× 60 0.4× 47 0.5× 92 1.3× 13 401
Yi-Sa Huang Taiwan 8 670 1.4× 276 1.5× 42 0.3× 366 3.9× 282 3.9× 8 848
Yongjun Huo China 12 274 0.6× 123 0.7× 62 0.4× 51 0.5× 100 1.4× 43 351
Hsiang‐Yao Hsiao Taiwan 9 736 1.6× 379 2.0× 40 0.3× 298 3.1× 234 3.3× 10 888
L.A. Bendersky United States 6 272 0.6× 194 1.0× 36 0.2× 90 0.9× 110 1.5× 6 418
W. Zhang Belgium 8 276 0.6× 60 0.3× 68 0.5× 104 1.1× 61 0.8× 14 354
Alessandro Pugliara France 11 101 0.2× 76 0.4× 131 0.9× 72 0.8× 177 2.5× 28 381

Countries citing papers authored by Daisuke Wakuda

Since Specialization
Citations

This map shows the geographic impact of Daisuke Wakuda's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daisuke Wakuda with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daisuke Wakuda more than expected).

Fields of papers citing papers by Daisuke Wakuda

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daisuke Wakuda. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daisuke Wakuda. The network helps show where Daisuke Wakuda may publish in the future.

Co-authorship network of co-authors of Daisuke Wakuda

This figure shows the co-authorship network connecting the top 25 collaborators of Daisuke Wakuda. A scholar is included among the top collaborators of Daisuke Wakuda based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daisuke Wakuda. Daisuke Wakuda is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
Wakuda, Daisuke & Katsuaki Suganuma. (2011). Stretchable fine fiber with high conductivity fabricated by injection forming. Applied Physics Letters. 98(7). 26 indexed citations
2.
Suganuma, Katsuaki, et al.. (2011). Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectronics Reliability. 52(2). 375–380. 231 indexed citations
3.
Suganuma, Katsuaki, et al.. (2010). Low-Temperature Wiring with Ag Nanoinks [Nanopackaging. IEEE Nanotechnology Magazine. 4(3). 20–23. 8 indexed citations
4.
Wakuda, Daisuke, Keun‐Soo Kim, & Katsuaki Suganuma. (2009). Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding. 412–415. 1 indexed citations
5.
Wakuda, Daisuke, Keun‐Soo Kim, & Katsuaki Suganuma. (2009). Room-Temperature Sintering Process of Ag Nanoparticle Paste. IEEE Transactions on Components and Packaging Technologies. 32(3). 627–632. 50 indexed citations
6.
Wakuda, Daisuke, Keun‐Soo Kim, & Katsuaki Suganuma. (2009). Properties of Ag nanoparticle paste for room temperature bonding. 44. 1557–1562. 1 indexed citations
7.
Wakuda, Daisuke, Keun‐Soo Kim, & Katsuaki Suganuma. (2009). Ag Nanoparticle Paste Synthesis for Room Temperature Bonding. IEEE Transactions on Components and Packaging Technologies. 33(2). 437–442. 40 indexed citations
8.
Wakuda, Daisuke, Ki‐Hyun Kim, & Katsuaki Suganuma. (2008). Room temperature sintering of Ag nanoparticles by drying solvent. Scripta Materialia. 59(6). 649–652. 72 indexed citations
9.
Wakuda, Daisuke, et al.. (2008). Room temperature sintering of ag nano-scale particles with drying of the solvent. 44. 1–6. 1 indexed citations
10.
Wakuda, Daisuke, Changjae Kim, Keun‐Soo Kim, & Katsuaki Suganuma. (2008). Room temperature sintering mechanism of Ag nanoparticle paste. 909–914. 9 indexed citations
11.
Wakuda, Daisuke, et al.. (2007). Novel method for room temperature sintering of Ag nanoparticle paste in air. Chemical Physics Letters. 441(4-6). 305–308. 106 indexed citations
12.
Suganuma, Katsuaki, et al.. (2007). Ink-jet Printing of Nano Materials and Processes for Electronics Applications. 1–4. 10 indexed citations
13.
Wakuda, Daisuke, et al.. (2007). Novel Room Temperature Wiring Process of Ag Nanoparticle Paste. 110–113. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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