Bassem Mouawad

709 total citations
36 papers, 554 citations indexed

About

Bassem Mouawad is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Bassem Mouawad has authored 36 papers receiving a total of 554 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 4 papers in Materials Chemistry. Recurrent topics in Bassem Mouawad's work include Silicon Carbide Semiconductor Technologies (24 papers), Electromagnetic Compatibility and Noise Suppression (19 papers) and Advanced DC-DC Converters (13 papers). Bassem Mouawad is often cited by papers focused on Silicon Carbide Semiconductor Technologies (24 papers), Electromagnetic Compatibility and Noise Suppression (19 papers) and Advanced DC-DC Converters (13 papers). Bassem Mouawad collaborates with scholars based in United Kingdom, France and United States. Bassem Mouawad's co-authors include C. Mark Johnson, Christina DiMarino, Damien Fabrègue, Dushan Boroyevich, Rolando Burgos, Jianfeng Li, Christopher Hutchinson, Alberto Castellazzi, Guo‐Quan Lu and Michel Perez and has published in prestigious journals such as IEEE Transactions on Power Electronics, Scripta Materialia and Metallurgical and Materials Transactions A.

In The Last Decade

Bassem Mouawad

35 papers receiving 539 citations

Peers

Bassem Mouawad
Bruce Geil United States
Michael D. Glover United States
Boon Long Lau Singapore
C. Liu United Kingdom
P. Türkes Germany
M. Thoben Germany
Bruce Geil United States
Bassem Mouawad
Citations per year, relative to Bassem Mouawad Bassem Mouawad (= 1×) peers Bruce Geil

Countries citing papers authored by Bassem Mouawad

Since Specialization
Citations

This map shows the geographic impact of Bassem Mouawad's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bassem Mouawad with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bassem Mouawad more than expected).

Fields of papers citing papers by Bassem Mouawad

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bassem Mouawad. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bassem Mouawad. The network helps show where Bassem Mouawad may publish in the future.

Co-authorship network of co-authors of Bassem Mouawad

This figure shows the co-authorship network connecting the top 25 collaborators of Bassem Mouawad. A scholar is included among the top collaborators of Bassem Mouawad based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bassem Mouawad. Bassem Mouawad is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Agyakwa, Pearl, Stuart Robertson, Bassem Mouawad, et al.. (2024). Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling. Journal of Electronic Materials. 53(3). 1374–1398. 7 indexed citations
2.
Mouawad, Bassem, et al.. (2023). Packaging for fast switching power electronics. Repository@Nottingham (University of Nottingham). 2. 1–6.
3.
Mouawad, Bassem, et al.. (2020). Heterogeneous Integration of Magnetic Component Windings on Ceramic Substrates. IEEE Journal of Emerging and Selected Topics in Power Electronics. 9(4). 3867–3876. 5 indexed citations
4.
Mouawad, Bassem, Li Yang, Pearl Agyakwa, Martin Corfield, & C. Mark Johnson. (2020). Packaging degradation studies of High Temperature SiC MOSFET discrete packages. 90–93. 9 indexed citations
5.
DiMarino, Christina, Bassem Mouawad, C. Mark Johnson, Dushan Boroyevich, & Rolando Burgos. (2019). 10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field. IEEE Transactions on Power Electronics. 35(6). 6050–6060. 104 indexed citations
6.
Mouawad, Bassem, et al.. (2019). 3D structure design of magnetic ferrite cores using gelcasting and pressure-less sintering process. AIP Advances. 9(3). 4 indexed citations
7.
DiMarino, Christina, Bassem Mouawad, C. Mark Johnson, et al.. (2019). Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1). 381–394. 65 indexed citations
8.
Mouawad, Bassem, et al.. (2019). A novel manufacturing technique for integrating magnetic components windings on power module substrates. Repository@Nottingham (University of Nottingham). P.1–P.8. 3 indexed citations
9.
DiMarino, Christina, Bassem Mouawad, Ke Li, et al.. (2018). A Wire-bond-less 10 kV SiC MOSFET Power Module with Reduced Common-mode Noise and Electric Field. Repository@Nottingham (University of Nottingham). 1–7. 14 indexed citations
10.
DiMarino, Christina, C. Mark Johnson, Bassem Mouawad, et al.. (2018). Fabrication and Characterization of a High-Power-Density, Planar 10 kV SiC MOSFET Power Module. 1–6. 8 indexed citations
11.
Mouawad, Bassem, Jordi Espina, Jianfeng Li, Lee Empringham, & C. Mark Johnson. (2018). Novel Silicon Carbide Integrated Power Module for EV application. 17 indexed citations
12.
Mouawad, Bassem, Jianfeng Li, Alberto Castellazzi, & C. Mark Johnson. (2018). On the reliability of stacked metallized ceramic substrates under thermal cycling. 1–6. 6 indexed citations
13.
DiMarino, Christina, C. Mark Johnson, Bassem Mouawad, et al.. (2017). Design of a novel, high-density, high-speed 10 kV SiC MOSFET module. 4003–4010. 21 indexed citations
14.
Mouawad, Bassem, et al.. (2017). 3.3 kV SiC JBS diode configurable rectifier module. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). P.1–P.9. 3 indexed citations
15.
Mouawad, Bassem, et al.. (2016). Low inductance 2.5kV packaging technology for SiC switches. Nottingham ePrints (University of Nottingham). 10 indexed citations
16.
Mouawad, Bassem, Jianfeng Li, Alberto Castellazzi, & C. Mark Johnson. (2016). Reliable Integration of a high performance multi-chip half-bridge SiC power module. 1–6. 1 indexed citations
17.
Mouawad, Bassem, Xavier Boulnat, Damien Fabrègue, Michel Perez, & Y. de Carlan. (2015). Tailoring the microstructure and the mechanical properties of ultrafine grained high strength ferritic steels by powder metallurgy. Journal of Nuclear Materials. 465. 54–62. 44 indexed citations
18.
Mouawad, Bassem, Cyril Buttay, Laurent Dupont, et al.. (2014). Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(1). 143–150. 18 indexed citations
19.
Mouawad, Bassem, Damien Fabrègue, Michel Perez, et al.. (2014). Sintering of ferritic and austenitic nanopowders using Spark Plasma Sintering. Metallurgical Research & Technology. 111(5). 305–310. 3 indexed citations
20.
Mouawad, Bassem, Maher Soueidan, Damien Fabrègue, et al.. (2011). Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process. Advanced materials research. 324. 177–180. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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