Kong Boon Yeap

610 total citations
38 papers, 394 citations indexed

About

Kong Boon Yeap is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Kong Boon Yeap has authored 38 papers receiving a total of 394 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 18 papers in Electronic, Optical and Magnetic Materials and 16 papers in Mechanics of Materials. Recurrent topics in Kong Boon Yeap's work include Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (17 papers) and Metal and Thin Film Mechanics (16 papers). Kong Boon Yeap is often cited by papers focused on Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (17 papers) and Metal and Thin Film Mechanics (16 papers). Kong Boon Yeap collaborates with scholars based in United States, Singapore and Germany. Kong Boon Yeap's co-authors include Kaiyang Zeng, Ehrenfried Zschech, Dongzhi Chi, Jing Zhu, Patrick Justison, Edoardo Bemporad, Jonathan P.-H. Belnoue, Marco Sebastiani, Alexander M. Korsunsky and Xu Song and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Materials Science and Engineering A.

In The Last Decade

Kong Boon Yeap

35 papers receiving 386 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kong Boon Yeap United States 13 241 120 113 103 90 38 394
Zhenghao Gan Singapore 12 195 0.8× 126 1.1× 97 0.9× 50 0.5× 47 0.5× 35 345
L. Libralesso France 11 253 1.0× 157 1.3× 62 0.5× 90 0.9× 56 0.6× 19 450
Jie-Hua Zhao United States 7 263 1.1× 140 1.2× 106 0.9× 89 0.9× 84 0.9× 8 426
W. Robl Germany 11 172 0.7× 159 1.3× 111 1.0× 77 0.7× 35 0.4× 26 345
Hyungsik Chung South Korea 10 100 0.4× 48 0.4× 67 0.6× 142 1.4× 90 1.0× 36 352
Yi‐Wen Cheng United States 7 172 0.7× 111 0.9× 83 0.7× 80 0.8× 71 0.8× 16 302
Gan Feng China 14 519 2.2× 59 0.5× 110 1.0× 44 0.4× 53 0.6× 49 648
Yue Qiao China 12 126 0.5× 41 0.3× 114 1.0× 84 0.8× 171 1.9× 14 502
Chia-Ling Lu Taiwan 7 482 2.0× 90 0.8× 228 2.0× 232 2.3× 35 0.4× 8 587
P. H. Yih United States 12 306 1.3× 50 0.4× 98 0.9× 194 1.9× 67 0.7× 17 550

Countries citing papers authored by Kong Boon Yeap

Since Specialization
Citations

This map shows the geographic impact of Kong Boon Yeap's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kong Boon Yeap with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kong Boon Yeap more than expected).

Fields of papers citing papers by Kong Boon Yeap

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kong Boon Yeap. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kong Boon Yeap. The network helps show where Kong Boon Yeap may publish in the future.

Co-authorship network of co-authors of Kong Boon Yeap

This figure shows the co-authorship network connecting the top 25 collaborators of Kong Boon Yeap. A scholar is included among the top collaborators of Kong Boon Yeap based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kong Boon Yeap. Kong Boon Yeap is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Xu, Yueming, et al.. (2018). Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. Microelectronics Reliability. 91. 232–242. 3 indexed citations
2.
Witt, C., Kong Boon Yeap, A. Leśniewska, et al.. (2018). Testing The Limits of TaN Barrier Scaling. 54–56. 31 indexed citations
3.
Shen, Tian, Kong Boon Yeap, C. Christiansen, & Patrick Justison. (2017). Field acceleration factor extraction in MOL and BEOL TDDB. DG–2.1. 5 indexed citations
4.
Kannan, Sukeshwar, C.S. Premachandran, Daniel M. Smith, et al.. (2017). Impact of TSV process on 14nm FEOL and BEOL reliability. 4A–2.1. 6 indexed citations
5.
Yeap, Kong Boon, et al.. (2016). Method to Determine the Root Cause of Low- $\kappa$ SiCOH Dielectric Failure Distributions. IEEE Electron Device Letters. 38(1). 119–122. 1 indexed citations
6.
Premachandran, C.S., Sukeshwar Kannan, Rakesh Ranjan, et al.. (2016). Impact of 3D Via Middle TSV Process on 20nm Wafer Level FEOL and BEOL Reliability. 1593–1598. 6 indexed citations
7.
Yeap, Kong Boon, et al.. (2016). A Realistic Method for Time-Dependent Dielectric Breakdown Reliability Analysis for Advanced Technology Node. IEEE Transactions on Electron Devices. 63(2). 755–759. 12 indexed citations
8.
Kopycinska‐Müller, Malgorzata, et al.. (2015). Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy. Ultramicroscopy. 162. 82–90. 12 indexed citations
9.
Liao, Zhongquan, Martin Gall, Kong Boon Yeap, et al.. (2015). <em>In Situ</em> Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices. Journal of Visualized Experiments. e52447–e52447. 1 indexed citations
10.
Shen, Tian, et al.. (2015). An investigation of dielectric thickness scaling on BEOL TDDB. 3A.2.1–3A.2.6.
11.
Selvam, Ammaiyappan, et al.. (2015). An investigation of process dependence of porous IMD TDDB. PI.1.1–PI.1.4.
12.
Yeap, Kong Boon, et al.. (2015). Impact of electrode surface modulation on time-dependent dielectric breakdown. 2A.1.1–2A.1.5. 1 indexed citations
13.
Gall, Martin, Kong Boon Yeap, & Ehrenfried Zschech. (2014). Advanced concepts for TDDB reliability in conjunction with 3D stress. AIP conference proceedings. 79–88. 5 indexed citations
14.
Yeap, Kong Boon, Martin Gall, Zhongquan Liao, et al.. (2014). In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms. Journal of Applied Physics. 115(12). 14 indexed citations
15.
Yeap, Kong Boon, Malgorzata Kopycinska‐Müller, Ude Hangen, et al.. (2012). Nanometer deformation of elastically anisotropic materials studied by nanoindentation. The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics. 92(25-27). 3142–3157. 7 indexed citations
16.
Lloyd, J. R., Kong Boon Yeap, Ehrenfried Zschech, et al.. (2011). Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias. Journal of Applied Physics. 110(5). 31 indexed citations
17.
Chen, Lei, et al.. (2011). Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system—Computational simulation and experimental studies. Journal of materials research/Pratt's guide to venture capital sources. 26(19). 2511–2523. 5 indexed citations
18.
Zhu, Jing, Kong Boon Yeap, Kaiyang Zeng, & Li Lü. (2010). Nanomechanical characterization of sputtered RuO2 thin film on silicon substrate for solid state electronic devices. Thin Solid Films. 519(6). 1914–1922. 18 indexed citations
19.
Yeap, Kong Boon, Kaiyang Zeng, & Dongzhi Chi. (2007). Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies. Acta Materialia. 56(5). 977–984. 21 indexed citations
20.
Yeap, Kong Boon, Kaiyang Zeng, Haiyan Jiang, Luming Shen, & Dongzhi Chi. (2007). Determining interfacial properties of submicron low-k films on Si substrate by using wedge indentation technique. Journal of Applied Physics. 101(12). 26 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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