R.D. Malucci
Impact in
- Mechanics of Materials top 2%
- Mechanical stress and fatigue analysis
- Adhesion, Friction, and Surface Interactions
- Metal and Thin Film Mechanics
- Mechanical Engineering top 5%
- Electrical Contact Performance and Analysis
Papers in
-
- Electrical Contact Performance and Analysis 51
-
- Mechanical stress and fatigue analysis 21
- Adhesion, Friction, and Surface Interactions 16
- Metal and Thin Film Mechanics 9
- Co-authors
- George T. Flowers (10 shared papers)Michael J. Bozack (10 shared papers)B.I. Rickett (8 shared papers)Fei Xie (6 shared papers)Fei Xie (1 shared paper)Fei Xie (2 shared papers)Prince Jain (4 shared papers)Hai Xin (2 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (8 papers)Physical Review Letters (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (2 papers)
- Partner nations
- United States
In The Last Decade
R.D. Malucci
51 papers receiving 640 citations
Peers
Comparison fields: 5 of 32
- Mechanics of Materials 532
- Mechanical Engineering 715
- Electrical and Electronic Engineering 291
- Electronic, Optical and Magnetic Materials 85
- Control and Systems Engineering 72
Countries citing papers authored by R.D. Malucci
This map shows the geographic impact of R.D. Malucci's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R.D. Malucci with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R.D. Malucci more than expected).
Fields of papers citing papers by R.D. Malucci
This network shows the impact of papers produced by R.D. Malucci. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R.D. Malucci. The network helps show where R.D. Malucci may publish in the future.
Co-authors
The 14 scholars most cited alongside R.D. Malucci, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 60 | |
| 2 | 1992 | 52 | |
| 3 | 2001 | 42 | |
| 4 | 2002 | 39 | |
| 5 | 2002 | 37 | |
| 6 | 1999 | 36 | |
| 7 | 2002 | 36 | |
| 8 | 2005 | 36 | |
| 9 | 2003 | 25 | |
| 10 | 2005 | 24 | |
| 11 | 2001 | 21 | |
| 12 | 2009 | 21 | |
| 13 | 2004 | 21 | |
| 14 | 2006 | 20 | |
| 15 | 2009 | 20 | |
| 16 | 2003 | 19 | |
| 17 | 2006 | 18 | |
| 18 | 2013 | 17 | |
| 19 | 2004 | 17 | |
| 20 | 1999 | 15 |
About R.D. Malucci
R.D. Malucci is a scholar working on Mechanical Engineering, Mechanics of Materials, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Nuclear and High Energy Physics, having authored 60 papers that have together received 793 indexed citations. Recurring topics across this work include Electrical Contact Performance and Analysis (51 papers), Mechanical stress and fatigue analysis (21 papers), Adhesion, Friction, and Surface Interactions (16 papers), Electronic Packaging and Soldering Technologies (10 papers), Metal and Thin Film Mechanics (9 papers), Semiconductor materials and devices (9 papers), Semiconductor materials and interfaces (8 papers) and Particle physics theoretical and experimental studies (7 papers). The work is most often cited by research in Mechanics of Materials (532 citations), Mechanical Engineering (715 citations), Electrical and Electronic Engineering (291 citations), Electronic, Optical and Magnetic Materials (85 citations) and Control and Systems Engineering (72 citations). R.D. Malucci has collaborated with scholars based in United States. Frequent co-authors include George T. Flowers, Michael J. Bozack, B.I. Rickett, Fei Xie, Fei Xie, Fei Xie, Prince Jain, Hai Xin, Santosh Angadi and Robert L. Jackson. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Physical Review Letters, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and IEEE Transactions on Components Hybrids and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.