Ran He

802 total citations
31 papers, 619 citations indexed

About

Ran He is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Control and Systems Engineering. According to data from OpenAlex, Ran He has authored 31 papers receiving a total of 619 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 8 papers in Automotive Engineering and 6 papers in Control and Systems Engineering. Recurrent topics in Ran He's work include 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (8 papers). Ran He is often cited by papers focused on 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (8 papers). Ran He collaborates with scholars based in Japan, China and Chile. Ran He's co-authors include Tadatomo Suga, Xiaoqiang Guo, Fengwen Mu, Masahisa Fujino, Akira Yamauchi, Josep M. Guerrero, Zhigang Lu, Xiaofeng Sun, Christian A. Rojas and Xiaoyu Jia and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Industrial Electronics and IEEE Transactions on Power Electronics.

In The Last Decade

Ran He

29 papers receiving 600 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ran He Japan 11 570 190 88 83 62 31 619
Pierre‐Olivier Jeannin France 17 729 1.3× 57 0.3× 18 0.2× 107 1.3× 66 1.1× 40 836
Bejoy N. Pushpakaran United States 11 622 1.1× 68 0.4× 21 0.2× 158 1.9× 326 5.3× 21 810
Nando Kaminski Germany 17 976 1.7× 37 0.2× 17 0.2× 85 1.0× 184 3.0× 77 1.0k
Fengtao Yang China 11 396 0.7× 31 0.2× 102 1.2× 187 2.3× 37 0.6× 54 585
Hulong Zeng China 16 570 1.0× 66 0.3× 25 0.3× 194 2.3× 76 1.2× 41 750
Uday Mhaskar India 9 351 0.6× 85 0.4× 15 0.2× 30 0.4× 110 1.8× 13 424
Jimin Oh South Korea 16 582 1.0× 37 0.2× 10 0.1× 100 1.2× 41 0.7× 47 719
C. W. Tipton United States 14 797 1.4× 70 0.4× 11 0.1× 230 2.8× 22 0.4× 34 968
Yuan-Ting Lin Taiwan 12 219 0.4× 27 0.1× 28 0.3× 269 3.2× 196 3.2× 30 534
Damian Urciuoli United States 16 485 0.9× 45 0.2× 17 0.2× 63 0.8× 27 0.4× 43 599

Countries citing papers authored by Ran He

Since Specialization
Citations

This map shows the geographic impact of Ran He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ran He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ran He more than expected).

Fields of papers citing papers by Ran He

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ran He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ran He. The network helps show where Ran He may publish in the future.

Co-authorship network of co-authors of Ran He

This figure shows the co-authorship network connecting the top 25 collaborators of Ran He. A scholar is included among the top collaborators of Ran He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ran He. Ran He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
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Guo, Xiaoqiang, et al.. (2018). Transformerless Z-Source Four-Leg PV Inverter With Leakage Current Reduction. IEEE Transactions on Power Electronics. 34(5). 4343–4352. 50 indexed citations
3.
Mu, Fengwen, Yinghui Wang, Ran He, & Tadatomo Suga. (2018). Direct wafer bonding of GaN-SiC for high power GaN-on-SiC devices. Materialia. 3. 12–14. 27 indexed citations
4.
He, Ran, Akira Yamauchi, & Tadatomo Suga. (2018). Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C. Japanese Journal of Applied Physics. 57(2S1). 02BD03–02BD03. 21 indexed citations
5.
Guo, Xiaoqiang, Jiale Zhou, Ran He, Xiaoyu Jia, & Christian A. Rojas. (2017). Leakage Current Attenuation of a Three-Phase Cascaded Inverter for Transformerless Grid-Connected PV Systems. IEEE Transactions on Industrial Electronics. 65(1). 676–686. 86 indexed citations
6.
Guo, Xiaoqiang, et al.. (2017). Modeling and Modulation of NNPC Four-Level Inverter for Solar Photovoltaic Power Plant. International Journal of Photoenergy. 2017. 1–8. 2 indexed citations
7.
He, Ran, Akira Yamauchi, & Tadatomo Suga. (2017). Novel sequential plasma activation method for direct glass bonding. 22–22. 2 indexed citations
8.
He, Ran, et al.. (2017). Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C. Applied Surface Science. 414. 163–170. 20 indexed citations
9.
Guo, Xiaoqiang, Ran He, & Mehdi Narimani. (2016). Modeling and Analysis of New Multilevel Inverter for Solar Photovoltaic Power Plant. International Journal of Photoenergy. 2016. 1–8. 7 indexed citations
10.
He, Ran, Masahisa Fujino, Tadatomo Suga, & Akira Yamauchi. (2016). Combined surface activation bonding for Cu/SiO<inf>2</inf> hybrid bonding for 3D integration. 884–888. 3 indexed citations
11.
He, Ran, Masahisa Fujino, Akira Yamauchi, & Tadatomo Suga. (2016). Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding. ECS Meeting Abstracts. MA2016-02(32). 2082–2082.
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He, Ran, Masahisa Fujino, Akira Yamauchi, & Tadatomo Suga. (2016). Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding. ECS Transactions. 75(9). 117–128. 13 indexed citations
14.
He, Ran, Masahisa Fujino, Akira Yamauchi, & Tadatomo Suga. (2015). Novel hydrophilic SiO2wafer bonding using combined surface-activated bonding technique. Japanese Journal of Applied Physics. 54(3). 30218–30218. 9 indexed citations
15.
He, Ran, Masahisa Fujino, Akira Yamauchi, & Tadatomo Suga. (2015). Combined Surface-Activated Bonding Technique for Low-Temperature Cu/SiO2 Hybrid Bonding. ECS Transactions. 69(6). 79–88. 5 indexed citations
16.
Xiaoqiang, Guo, Ran He, Xiaoyu Jia, & Christian A. Rojas. (2015). Leakage current reduction of transformerless three-phase cascaded multilevel PV inverter. 1110–1114. 5 indexed citations
17.
He, Ran, Masahisa Fujino, Akira Yamauchi, & Tadatomo Suga. (2014). Combined Surface-Activated Bonding (SAB) Technologies for New Approach to Low Temperature Wafer Bonding. ECS Transactions. 64(5). 83–93. 2 indexed citations
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Wang, Huijuan, et al.. (2012). A study of electrical character of 3D high-density junction capacitor for SiP. 2. 1600–1603. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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