J.N. Sweet

905 total citations
40 papers, 523 citations indexed

About

J.N. Sweet is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, J.N. Sweet has authored 40 papers receiving a total of 523 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 9 papers in Materials Chemistry and 8 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in J.N. Sweet's work include Semiconductor materials and devices (11 papers), Electronic Packaging and Soldering Technologies (10 papers) and 3D IC and TSV technologies (7 papers). J.N. Sweet is often cited by papers focused on Semiconductor materials and devices (11 papers), Electronic Packaging and Soldering Technologies (10 papers) and 3D IC and TSV technologies (7 papers). J.N. Sweet collaborates with scholars based in United States and Germany. J.N. Sweet's co-authors include M. Moss, E.P. Roth, D.W. Peterson, J. C. Granahan, Gene I. Rochlin, Paul K. Hansma, M. B. Chamberlain, R. B. Pettit, J. A. Borders and John A. Emerson and has published in prestigious journals such as Journal of Applied Physics, IEEE Journal of Solid-State Circuits and Thin Solid Films.

In The Last Decade

J.N. Sweet

36 papers receiving 483 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J.N. Sweet United States	12	175	110	77	75	70	40	523
Zihao Yuan China	14	207 1.2×	161 1.5×	92 1.2×	24 0.3×	41 0.6×	44	498
G.W. Donohoe United States	12	140 0.8×	31 0.3×	31 0.4×	33 0.4×	19 0.3×	54	418
J. Banqueri Spain	15	628 3.6×	36 0.3×	66 0.9×	14 0.2×	22 0.3×	42	855
Qingbang Han China	12	167 1.0×	60 0.5×	89 1.2×	12 0.2×	35 0.5×	64	487
Juan Meléndez Spain	15	227 1.3×	181 1.6×	136 1.8×	7 0.1×	8 0.1×	76	686
W.B. Kuhn United States	16	932 5.3×	54 0.5×	52 0.7×	13 0.2×	31 0.4×	70	1.1k
Ding Chen China	10	123 0.7×	127 1.2×	116 1.5×	7 0.1×	27 0.4×	69	369
Pierre Ferré United Kingdom	10	160 0.9×	29 0.3×	25 0.3×	3 0.0×	92 1.3×	20	468
Chen Taiwan	11	365 2.1×	32 0.3×	75 1.0×	20 0.3×	39 0.6×	149	512

Countries citing papers authored by J.N. Sweet

Since Specialization

Citations

This map shows the geographic impact of J.N. Sweet's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.N. Sweet with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.N. Sweet more than expected).

Fields of papers citing papers by J.N. Sweet

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.N. Sweet. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.N. Sweet. The network helps show where J.N. Sweet may publish in the future.

Co-authorship network of co-authors of J.N. Sweet

This figure shows the co-authorship network connecting the top 25 collaborators of J.N. Sweet. A scholar is included among the top collaborators of J.N. Sweet based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.N. Sweet. J.N. Sweet is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Chang, Y. A., J.N. Sweet, Arvind Ganesan, et al.. (2025). Enabling Informed Decisions on Pyrolysis: A Key to Turn the Tide on Plastics Recycling. ACS Sustainable Chemistry & Engineering. 13(23). 8496–8507. 4 indexed citations

Sweet, J.N.. (2008). Dominant component suppression with applications to spectral analysis. 6966. 1–7. 2 indexed citations

Sweet, J.N. & D.W. Peterson. (2005). High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip. 90–97. 2 indexed citations

Peterson, D.W., et al.. (2005). Demonstration of a High Heat Removal Cvd Diamond Substrate Edge-Cooled Multichip Module. 624–630. 1 indexed citations

Peterson, D.W., et al.. (2003). Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle. University of North Texas Digital Library (University of North Texas). 1241–1248. 21 indexed citations

Draper, B.L., et al.. (2003). Multichip module enables for high reliability applications. 102–105.

Sweet, J.N., et al.. (2002). Evaluation of chip passivation and coatings using special purpose assembly test chips and porous silicon moisture detectors. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). a21 a23. 731–737. 3 indexed citations

Ulrich, Richard K., W. D. Brown, Simon S. Ang, et al.. (2002). PECVD silicon and nitride postbond films for protecting bondpads, bonds and bondwires from corrosion failure. 22. 738–744. 4 indexed citations

Granahan, J. C. & J.N. Sweet. (2002). An evaluation of atmospheric correction techniques using the spectral similarity scale. 5. 2022–2024. 40 indexed citations

10.

Sweet, J.N.. (2002). Assembly test chips and circuits for detecting and measuring mechanical damage in packaged ICs. 30–36. 1 indexed citations

11.

Sweet, J.N., et al.. (2002). Thermal resistance measurements and finite element calculations for ceramic hermetic packages. 5. 10–16. 2 indexed citations

12.

Benson, David A., et al.. (2002). IC chip stress during plastic package molding. 1326–1331. 5 indexed citations

13.

Sweet, J.N., et al.. (2001). <title>Hyperspectral analysis toolset</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4169. 396–407. 7 indexed citations

14.

Ackland, B., S.J. Daubert, A. Kalavade, et al.. (2000). A single-chip, 1.6-billion, 16-b MAC/s multiprocessor DSP. IEEE Journal of Solid-State Circuits. 35(3). 412–424. 83 indexed citations

15.

Sweet, J.N., et al.. (1999). Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle=. 1(1). 1 indexed citations

16.

Kelly, Michael J., T.R. Guilinger, D.W. Peterson, Melanie R. Tuck, & J.N. Sweet. (1991). Oxidized Porous Silicon Moisture Sensors for Evaluation of Microelectronic Packaging. MRS Proceedings. 225. 3 indexed citations

17.

Sweet, J.N., et al.. (1991). Short and long loop manufacturing feedback using a multisensor assembly test chip. IEEE Transactions on Components Hybrids and Manufacturing Technology. 14(3). 529–535. 15 indexed citations

18.

Sweet, J.N., R. B. Pettit, & M. B. Chamberlain. (1984). Optical modeling and aging characteristics of thermally stable black chrome solar selective coatings. Solar Energy Materials. 10(3-4). 251–286. 25 indexed citations

19.

Pike, G. E. & J.N. Sweet. (1975). Electrical characteristics of metal/Si-Ge contacts. Journal of Applied Physics. 46(11). 4904–4920.

20.

Hansma, Paul K., Gene I. Rochlin, & J.N. Sweet. (1971). Externally Shunted Josephson Junctions: Generalized Weak Links. Physical review. B, Solid state. 4(9). 3003–3014. 26 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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