Kun-Han Tsai
Impact in
- Hardware and Architecture top 0.5%
- VLSI and Analog Circuit Testing
-
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
- Radiation Effects in Electronics
- Low-power high-performance VLSI design
- VLSI and FPGA Design Techniques
- Advancements in Photolithography Techniques
Papers in
-
- Integrated Circuits and Semiconductor Failure Analysis 65
- 3D IC and TSV technologies 19
- VLSI and FPGA Design Techniques 9
- Low-power high-performance VLSI design 9
- Radiation Effects in Electronics 9
- Advancements in Photolithography Techniques 7
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- VLSI and Analog Circuit Testing 62
- Co-authors
- J. Rajski (16 shared papers)Wu-Tung Cheng (39 shared papers)Malgorzata Marek-Sadowska (15 shared papers)N. Tamarapalli (4 shared papers)Janusz Rajski (10 shared papers)Shi‐Yu Huang (23 shared papers)Mark Kassab (7 shared papers)Zhiyuan Wang (4 shared papers)
- Journals
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (15 papers)IEEE Design and Test (2 papers)Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015 (1 paper)Proceedings - International Symposium for Testing and Failure Analysis (1 paper)Proceedings - ACM IEEE Design Automation Conference (2 papers)
- Partner nations
- United StatesHungaryTaiwan
In The Last Decade
Kun-Han Tsai
75 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 25
- Hardware and Architecture 1.2k
- Electrical and Electronic Engineering 1.3k
- Software 60
- Control and Systems Engineering 203
- Industrial and Manufacturing Engineering 13
Countries citing papers authored by Kun-Han Tsai
This map shows the geographic impact of Kun-Han Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kun-Han Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kun-Han Tsai more than expected).
Fields of papers citing papers by Kun-Han Tsai
This network shows the impact of papers produced by Kun-Han Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kun-Han Tsai. The network helps show where Kun-Han Tsai may publish in the future.
Co-authors
The 25 scholars most cited alongside Kun-Han Tsai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 76 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 322 | |
| 2 | 2004 | 127 | |
| 3 | 2006 | 108 | |
| 4 | 2004 | 54 | |
| 5 | 2013 | 53 | |
| 6 | 2005 | 52 | |
| 7 | 2012 | 49 | |
| 8 | 2006 | 39 | |
| 9 | 2013 | 38 | |
| 10 | 2004 | 35 | |
| 11 | 2008 | 32 | |
| 12 | 2000 | 32 | |
| 13 | 2010 | 28 | |
| 14 | 2005 | 24 | |
| 15 | 1997 | 24 | |
| 16 | 2002 | 23 | |
| 17 | 2009 | 22 | |
| 18 | 2013 | 19 | |
| 19 | 2014 | 16 | |
| 20 | 2013 | 16 |
About Kun-Han Tsai
Kun-Han Tsai is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Control and Systems Engineering, Biomedical Engineering and Computer Networks and Communications, having authored 76 papers that have together received 1.4k indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (65 papers), VLSI and Analog Circuit Testing (62 papers), 3D IC and TSV technologies (19 papers), Engineering and Test Systems (13 papers), VLSI and FPGA Design Techniques (9 papers), Low-power high-performance VLSI design (9 papers), Radiation Effects in Electronics (9 papers) and Advancements in Photolithography Techniques (7 papers). The work is most often cited by research in Hardware and Architecture (1.2k citations), Electrical and Electronic Engineering (1.3k citations), Software (60 citations), Control and Systems Engineering (203 citations) and Industrial and Manufacturing Engineering (13 citations). Kun-Han Tsai has collaborated with scholars based in United States, Hungary and Taiwan. Frequent co-authors include J. Rajski, Wu-Tung Cheng, Malgorzata Marek-Sadowska, N. Tamarapalli, Janusz Rajski, Shi‐Yu Huang, Mark Kassab, Zhiyuan Wang, Jun Qian and Andre Hertwig. Their work appears in journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Design and Test, Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015, Proceedings - International Symposium for Testing and Failure Analysis and Proceedings - ACM IEEE Design Automation Conference.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.