Guicui Fu

624 total citations
82 papers, 456 citations indexed

About

Guicui Fu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Guicui Fu has authored 82 papers receiving a total of 456 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. Recurrent topics in Guicui Fu's work include Electronic Packaging and Soldering Technologies (24 papers), Silicon Carbide Semiconductor Technologies (21 papers) and 3D IC and TSV technologies (10 papers). Guicui Fu is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), Silicon Carbide Semiconductor Technologies (21 papers) and 3D IC and TSV technologies (10 papers). Guicui Fu collaborates with scholars based in China, United Kingdom and Denmark. Guicui Fu's co-authors include Bo Wan, Peng Xue, Yutai Su, Dong Zhang, Changqing Liu, Canyu Liu, Katsuaki Suganuma, Enrico Zio, Chuantong Chen and Weifang Zhang and has published in prestigious journals such as IEEE Transactions on Power Electronics, IEEE Access and Computer Methods in Applied Mechanics and Engineering.

In The Last Decade

Guicui Fu

78 papers receiving 441 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Guicui Fu China 10 286 171 72 42 39 82 456
Zhenhua Wen China 10 123 0.4× 114 0.7× 33 0.5× 25 0.6× 113 2.9× 37 361
Ryan Lowe United States 11 202 0.7× 54 0.3× 76 1.1× 22 0.5× 90 2.3× 35 355
Mahera Musallam United Kingdom 13 680 2.4× 96 0.6× 33 0.5× 28 0.7× 166 4.3× 24 783
P. Jacob Switzerland 8 730 2.6× 105 0.6× 27 0.4× 26 0.6× 56 1.4× 24 795
Ke Pan United States 15 331 1.2× 116 0.7× 94 1.3× 23 0.5× 7 0.2× 43 461
Zhen Lu China 10 62 0.2× 515 3.0× 66 0.9× 79 1.9× 53 1.4× 37 726
Shanshui Yang China 11 346 1.2× 33 0.2× 15 0.2× 47 1.1× 193 4.9× 54 439
Wilson Cesar Sant’Ana Brazil 12 307 1.1× 100 0.6× 48 0.7× 62 1.5× 228 5.8× 50 409
Jianbiao Pan United States 13 249 0.9× 109 0.6× 65 0.9× 16 0.4× 10 0.3× 37 367

Countries citing papers authored by Guicui Fu

Since Specialization
Citations

This map shows the geographic impact of Guicui Fu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guicui Fu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guicui Fu more than expected).

Fields of papers citing papers by Guicui Fu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Guicui Fu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guicui Fu. The network helps show where Guicui Fu may publish in the future.

Co-authorship network of co-authors of Guicui Fu

This figure shows the co-authorship network connecting the top 25 collaborators of Guicui Fu. A scholar is included among the top collaborators of Guicui Fu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guicui Fu. Guicui Fu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fu, Guicui, et al.. (2025). Uniform design for the multi-layer space radiation shielding optimization. The European Physical Journal Plus. 140(8).
2.
Wan, Bo, et al.. (2023). Impact Analysis of Microscopic Defect Types on the Macroscopic Crack Propagation in Sintered Silver Nanoparticles. Computer Modeling in Engineering & Sciences. 139(1). 441–458. 3 indexed citations
3.
Wan, Bo, et al.. (2023). A reliability assessment methodology of system-in-package based virtual qualification. Microelectronics Reliability. 150. 115212–115212. 2 indexed citations
4.
5.
Su, Yutai, Guicui Fu, Changqing Liu, et al.. (2021). Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores. Computer Methods in Applied Mechanics and Engineering. 378. 113729–113729. 47 indexed citations
6.
Wan, Bo, et al.. (2021). Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales. IEEE Access. 9. 106270–106282. 13 indexed citations
7.
Fu, Guicui, et al.. (2020). Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature. Applied Sciences. 10(6). 1951–1951. 5 indexed citations
8.
Guo, Wendi, et al.. (2019). Storage PoF model of electromagnetic relays based on electrical contact theory. Microelectronics Reliability. 100-101. 113381–113381. 5 indexed citations
9.
10.
Fu, Guicui, et al.. (2019). Wear-out evolution analysis of multiple-bond-wires power modules based on thermo-electro-mechanical FEM simulation. Microelectronics Reliability. 100-101. 113472–113472. 7 indexed citations
11.
Fu, Guicui, et al.. (2018). Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition. Journal of Electronic Packaging. 141(1). 1 indexed citations
12.
13.
Zhang, Weifang, et al.. (2017). Quantitative Analysis of Weld-Pore Size and Depth and Effect on Fatigue Life of Ti-6Al-2Zr-1Mo-1V Alloy Weldments. Metals. 7(10). 417–417. 7 indexed citations
14.
Xue, Peng, Guicui Fu, & Dong Zhang. (2016). Physics‐based compact model for the EMCON p–i–n diode using MATLAB and Simulink. IET Power Electronics. 9(12). 2416–2424. 2 indexed citations
15.
Cheng, Yu & Guicui Fu. (2015). A physics-based electro-thermal model for FS IGBT. 1 indexed citations
16.
Fu, Guicui. (2011). Study on Electronic-test Failure Analysis Technology of Electromagnetic Relay. Low Voltage Apparatus. 2 indexed citations
17.
Fu, Guicui, et al.. (2011). Improved analysis method of risk priority number. Beijing Hangkong Hangtian Daxue xuebao. 37(11). 1395. 4 indexed citations
18.
Fu, Guicui. (2006). Study of Compact Thermal Models for Electronic Packages. Dianzi qijian. 2 indexed citations
19.
Fang, Zhiqiang, et al.. (2003). Application research on thermal analysis software of electronic systems. Beijing Hangkong Hangtian Daxue xuebao. 29(8). 737. 2 indexed citations
20.
Fu, Guicui. (2003). Analysis of Geometric Factors on Effect Upon the Capability of Heat Sink of Power Component. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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