Junyong Park
Impact in
- Automotive Engineering top 5%
- Advanced Battery Technologies Research
-
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Advancements in Battery Materials
- Advanced Battery Materials and Technologies
- Wireless Power Transfer Systems
- Energy Harvesting in Wireless Networks
- Electronic Packaging and Soldering Technologies
Papers in
-
- 3D IC and TSV technologies 28
- Electromagnetic Compatibility and Noise Suppression 24
- Electronic Packaging and Soldering Technologies 13
- Advancements in PLL and VCO Technologies 9
- Integrated Circuits and Semiconductor Failure Analysis 6
- Semiconductor materials and devices 6
-
- VLSI and Analog Circuit Testing 10
- Co-authors
- Robert G. Landers (6 shared papers)Joungho Kim (45 shared papers)Jie Li (3 shared papers)Nima Lotfi (3 shared papers)Youngwoo Kim (22 shared papers)Kyungjun Cho (20 shared papers)Seongsoo Lee (9 shared papers)Subin Kim (14 shared papers)
- Journals
- IEEE Transactions on Electromagnetic Compatibility (10 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (9 papers)IEEE Access (3 papers)Journal of Rheology (2 papers)Journal of Advanced Joining Processes (1 paper)
- Partner nations
- South KoreaUnited StatesChina
In The Last Decade
Junyong Park
67 papers receiving 989 citations
Peers
Comparison fields: 5 of 84
- Automotive Engineering 278
- Electrical and Electronic Engineering 820
- Hardware and Architecture 55
- Aerospace Engineering 147
- Instrumentation 11
Countries citing papers authored by Junyong Park
This map shows the geographic impact of Junyong Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Junyong Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Junyong Park more than expected).
Fields of papers citing papers by Junyong Park
This network shows the impact of papers produced by Junyong Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Junyong Park. The network helps show where Junyong Park may publish in the future.
Co-authors
The 25 scholars most cited alongside Junyong Park, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 75 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 118 | |
| 2 | 2017 | 95 | |
| 3 | 2020 | 92 | |
| 4 | 2020 | 60 | |
| 5 | 2006 | 52 | |
| 6 | 2018 | 48 | |
| 7 | 2017 | 35 | |
| 8 | 2018 | 32 | |
| 9 | 2012 | 32 | |
| 10 | 2021 | 28 | |
| 11 | 2018 | 27 | |
| 12 | 2018 | 22 | |
| 13 | 2019 | 22 | |
| 14 | 2017 | 20 | |
| 15 | 2018 | 17 | |
| 16 | 2017 | 17 | |
| 17 | 2019 | 16 | |
| 18 | 2021 | 16 | |
| 19 | 2022 | 15 | |
| 20 | 2019 | 14 |
About Junyong Park
Junyong Park is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Biomedical Engineering, Automotive Engineering and Aerospace Engineering, having authored 75 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (28 papers), Electromagnetic Compatibility and Noise Suppression (24 papers), Electronic Packaging and Soldering Technologies (13 papers), VLSI and Analog Circuit Testing (10 papers), Advancements in PLL and VCO Technologies (9 papers), Advanced Battery Technologies Research (6 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers) and Semiconductor materials and devices (6 papers). The work is most often cited by research in Automotive Engineering (278 citations), Electrical and Electronic Engineering (820 citations), Hardware and Architecture (55 citations), Aerospace Engineering (147 citations) and Instrumentation (11 citations). Junyong Park has collaborated with scholars based in South Korea, United States and China. Frequent co-authors include Robert G. Landers, Joungho Kim, Jie Li, Nima Lotfi, Youngwoo Kim, Kyungjun Cho, Seongsoo Lee, Subin Kim, Hyunwook Park and Gapyeol Park. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Access, Journal of Rheology and Journal of Advanced Joining Processes.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.