G. Ofner

527 total citations
8 papers, 418 citations indexed

About

G. Ofner is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Aerospace Engineering. According to data from OpenAlex, G. Ofner has authored 8 papers receiving a total of 418 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 1 paper in Mechanics of Materials and 1 paper in Aerospace Engineering. Recurrent topics in G. Ofner's work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). G. Ofner is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). G. Ofner collaborates with scholars based in Germany, Switzerland and Singapore. G. Ofner's co-authors include Markus Brunnbauer, Ronald Hagen, Tyler Meyer, Till Meyer, K. Pressel, H. Baltes, F. Mayer, A. Hàberli, Manfred Fink and G. Beer and has published in prestigious journals such as Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.

In The Last Decade

G. Ofner

8 papers receiving 366 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G. Ofner Germany 5 379 66 44 36 27 8 418
Ronald Hagen Netherlands 5 316 0.8× 44 0.7× 34 0.8× 23 0.6× 24 0.9× 9 358
Chong Ser Choong Singapore 10 340 0.9× 64 1.0× 12 0.3× 36 1.0× 25 0.9× 47 375
F. Dupont Belgium 9 151 0.4× 62 0.9× 20 0.5× 44 1.2× 14 0.5× 33 248
Bahareh Banijamali United States 9 295 0.8× 70 1.1× 10 0.2× 11 0.3× 35 1.3× 15 314
Chunghyun Ryu South Korea 8 384 1.0× 23 0.3× 30 0.7× 5 0.1× 40 1.5× 25 435
Kyoungchoul Koo South Korea 13 361 1.0× 31 0.5× 81 1.8× 23 0.6× 15 0.6× 37 374
Giorgio Pietrini Canada 9 378 1.0× 49 0.7× 23 0.5× 107 3.0× 65 2.4× 37 454
Srinivasa Rao Vempati Singapore 9 251 0.7× 108 1.6× 8 0.2× 86 2.4× 53 2.0× 30 330
Kei Murayama Japan 12 252 0.7× 64 1.0× 75 1.7× 54 1.5× 40 1.5× 47 387

Countries citing papers authored by G. Ofner

Since Specialization
Citations

This map shows the geographic impact of G. Ofner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Ofner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Ofner more than expected).

Fields of papers citing papers by G. Ofner

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Ofner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Ofner. The network helps show where G. Ofner may publish in the future.

Co-authorship network of co-authors of G. Ofner

This figure shows the co-authorship network connecting the top 25 collaborators of G. Ofner. A scholar is included among the top collaborators of G. Ofner based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Ofner. G. Ofner is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

8 of 8 papers shown
1.
Pressel, K., G. Beer, Tyler Meyer, et al.. (2010). Embedded wafer level ball grid array (eWLB) technology for system integration. 1–4. 34 indexed citations
2.
Meyer, Tyler, et al.. (2010). System integration with eWLB. 1–9. 18 indexed citations
3.
Meyer, Tyler, et al.. (2008). Embedded Wafer Level Ball Grid Array (eWLB). 994–998. 184 indexed citations
4.
Brunnbauer, Markus, et al.. (2008). Embedded Wafer Level Ball Grid Array (eWLB). 1–6. 135 indexed citations
5.
Pohl, Jens G., et al.. (2005). Package optimization of a stacked die flip chip based test package. 590–594. 2 indexed citations
6.
7.
Mayer, F., et al.. (2002). Single-chip CMOS anemometer. 42 indexed citations
8.
Ofner, G., et al.. (1998). <title>Flip-chip packaging for smart MEMS</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3328. 183–193. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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