G. Ofner
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- Electronic Packaging and Soldering Technologies 6
- 3D IC and TSV technologies 6
- Electromagnetic Compatibility and Noise Suppression 5
- Advanced MEMS and NEMS Technologies 2
- Electrical and Bioimpedance Tomography 1
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- Advanced Antenna and Metasurface Technologies 1
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- Microfluidic and Bio-sensing Technologies 1
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- Adhesion, Friction, and Surface Interactions 1
- Journals
- Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- GermanySwitzerlandSingapore
In The Last Decade
G. Ofner
8 papers receiving 366 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 379
- Automotive Engineering 27
- Hardware and Architecture 15
- Aerospace Engineering 44
- Industrial and Manufacturing Engineering 16
Countries citing papers authored by G. Ofner
This map shows the geographic impact of G. Ofner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Ofner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Ofner more than expected).
Fields of papers citing papers by G. Ofner
This network shows the impact of papers produced by G. Ofner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Ofner. The network helps show where G. Ofner may publish in the future.
Co-authorship network
The 14 scholars most cited alongside G. Ofner, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 34 | |
| 2 | 2010 | 18 | |
| 3 | 2008 | 184 | |
| 4 | 2008 | 135 | |
| 5 | 2005 | 2 | |
| 6 | 2005 | 1 | |
| 7 | 2002 | 42 | |
| 8 | 1998 | 2 |
About G. Ofner
G. Ofner is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Aerospace Engineering, Biomedical Engineering and Infectious Diseases, having authored 8 papers that have together received 418 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Advanced MEMS and NEMS Technologies (2 papers), Advanced Antenna and Metasurface Technologies (1 paper), Microfluidic and Bio-sensing Technologies (1 paper), Adhesion, Friction, and Surface Interactions (1 paper) and Electrical and Bioimpedance Tomography (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (379 citations), Automotive Engineering (27 citations), Hardware and Architecture (15 citations), Aerospace Engineering (44 citations) and Industrial and Manufacturing Engineering (16 citations). G. Ofner has collaborated with scholars based in Germany, Switzerland and Singapore. Frequent co-authors include Markus Brunnbauer, Ronald Hagen, Tyler Meyer, Till Meyer, K. Pressel, H. Baltes, F. Mayer, A. Hàberli, Manfred Fink and G. Beer. Their work appears in journals such as Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.