Hyun‐Cheol Bae

782 total citations
61 papers, 637 citations indexed

About

Hyun‐Cheol Bae is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Hyun‐Cheol Bae has authored 61 papers receiving a total of 637 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 11 papers in Automotive Engineering. Recurrent topics in Hyun‐Cheol Bae's work include 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (33 papers) and Additive Manufacturing and 3D Printing Technologies (11 papers). Hyun‐Cheol Bae is often cited by papers focused on 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (33 papers) and Additive Manufacturing and 3D Printing Technologies (11 papers). Hyun‐Cheol Bae collaborates with scholars based in South Korea, United States and Italy. Hyun‐Cheol Bae's co-authors include Kwang‐Seong Choi, Yong‐Sung Eom, Keon‐Soo Jang, Joungho Kim, Haksun Lee, Heegon Kim, Jin Ho Lee, D. Jung, Jonghoon J. Kim and Jonghyun Cho and has published in prestigious journals such as Industrial & Engineering Chemistry Research, Applied Surface Science and Journal of Applied Polymer Science.

In The Last Decade

Hyun‐Cheol Bae

58 papers receiving 614 citations

Peers

Hyun‐Cheol Bae

EEE

Xun He China

Yongxiang Su China

Sangil Han France

Haoyu Chen China

Marcel Schmitt Germany

Ranjeet Kumar Sahu India

Jianguo Liang China

Qixiang Jiang Austria

Oana Tutunaru Romania

Xun He China

Hyun‐Cheol Bae

320 ×0.8

EEE

56 ×0.4

174 ×1.4

92 ×0.8

118 ×1.6

Citations per year, relative to Hyun‐Cheol Bae Hyun‐Cheol Bae (= 1×) peers Xun He

Countries citing papers authored by Hyun‐Cheol Bae

Since Specialization

Citations

This map shows the geographic impact of Hyun‐Cheol Bae's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hyun‐Cheol Bae with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hyun‐Cheol Bae more than expected).

Fields of papers citing papers by Hyun‐Cheol Bae

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hyun‐Cheol Bae. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hyun‐Cheol Bae. The network helps show where Hyun‐Cheol Bae may publish in the future.

Co-authorship network of co-authors of Hyun‐Cheol Bae

This figure shows the co-authorship network connecting the top 25 collaborators of Hyun‐Cheol Bae. A scholar is included among the top collaborators of Hyun‐Cheol Bae based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hyun‐Cheol Bae. Hyun‐Cheol Bae is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Bae, Hyun‐Cheol, et al.. (2024). Compact Dual-Band, Dual-Circular Polarized Microstrip Antenna Array for K/Ka-Band Application. IEEE Open Journal of Antennas and Propagation. 6(2). 372–382. 1 indexed citations

Bae, Hyun‐Cheol, et al.. (2023). Ultrasonic Enhancement of Chondrogenesis in Mesenchymal Stem Cells by Bolt-Clamped Langevin Transducers. Micromachines. 14(1). 202–202. 3 indexed citations

Bae, Hyun‐Cheol, et al.. (2022). Effect of the Working Fluid Charge Ratio and Heat Flux on the Temperature Homogenization Characteristics of a Vapor Chamber-Type Heat Spreader. International Journal of Thermophysics. 43(11). 5 indexed citations

Eom, Yong‐Sung, et al.. (2019). Collective laser‐assisted bonding process for 3D TSV integration with NCP. ETRI Journal. 41(3). 396–407. 22 indexed citations

Eom, Yong‐Sung, et al.. (2017). Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test. 1–8. 6 indexed citations

Choi, Kwang‐Seong, et al.. (2016). Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs. 2051–2057. 3 indexed citations

Jung, D., Jonghoon J. Kim, Heegon Kim, et al.. (2016). Modeling and analysis of high-speed through silicon via (TSV) channel and defects. 6 indexed citations

Jung, D., Youngwoo Kim, Jonghoon J. Kim, et al.. (2016). Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 138–152. 47 indexed citations

Bae, Hyun‐Cheol, Yong‐Sung Eom, Kwang‐Seong Choi, Seung Eon Moon, & Jin Ho Lee. (2016). Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate. Journal of Nanoscience and Nanotechnology. 16(12). 12732–12736. 1 indexed citations

10.

Eom, Yong‐Sung, et al.. (2015). Isotropic conductive paste based on epoxy with Ag coated Cu and SAC305 solder. European Microelectronics and Packaging Conference. 2 indexed citations

11.

Bae, Hyun‐Cheol, et al.. (2015). Cost-effective thermoelectric cooler packaging using hybrid Cu paste. European Microelectronics and Packaging Conference. 1 indexed citations

12.

Lee, Haksun, Hyun‐Cheol Bae, Yong‐Sung Eom, et al.. (2015). Characterization of 3D stacked high resistivity Si interposers with polymer TSV liners for 3D RF module. 3. 928–933. 4 indexed citations

13.

Lee, Haksun, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, & Jin Ho Lee. (2014). Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(10). 1729–1738. 15 indexed citations

14.

Jung, D., Heegon Kim, Jonghoon J. Kim, et al.. (2014). Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 1–5. 4 indexed citations

15.

Lee, Haksun, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, & Jin Ho Lee. (2014). Development of low contact resistance interconnection for display applications. 22. 1–5. 4 indexed citations

16.

Bae, Hyun‐Cheol, Haksun Lee, Yong‐Sung Eom, & Kwang‐Seong Choi. (2013). Novel Low-volume solder-on-pad for fine pitch Cu pillar bump. European Microelectronics and Packaging Conference. 1–4. 2 indexed citations

17.

Lee, Haksun, et al.. (2013). Novel interconnection technology for flex-on-glass (FOG) applications. European Microelectronics and Packaging Conference. 1–5. 2 indexed citations

18.

Choi, Kwang‐Seong, et al.. (2013). Novel Bumping Process for Solder on Pad Technology. ETRI Journal. 35(2). 340–343. 20 indexed citations

19.

Bae, Hyun‐Cheol, et al.. (2007). Cost Effective Parallel-branch Spiral Inductor with Enhanced Quality Factor and Resonance Frequency. 87–90. 1 indexed citations

20.

Lee, Sang‐Heung, et al.. (2006). Structure-related Characteristics of SiGe HBT and 2.4 ㎓ Down-conversion Mixer. JSTS Journal of Semiconductor Technology and Science. 6(2). 114–118. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact