Bumhee Bae

572 total citations
44 papers, 448 citations indexed

About

Bumhee Bae is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Media Technology. According to data from OpenAlex, Bumhee Bae has authored 44 papers receiving a total of 448 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Media Technology. Recurrent topics in Bumhee Bae's work include Electromagnetic Compatibility and Noise Suppression (23 papers), Energy Harvesting in Wireless Networks (13 papers) and Wireless Power Transfer Systems (13 papers). Bumhee Bae is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (23 papers), Energy Harvesting in Wireless Networks (13 papers) and Wireless Power Transfer Systems (13 papers). Bumhee Bae collaborates with scholars based in South Korea, United States and Italy. Bumhee Bae's co-authors include Joungho Kim, Jonghoon J. Kim, Sunkyu Kong, Sukjin Kim, D. Jung, Madhavan Swaminathan, Jonghoon Kim, Kyoungchoul Koo, Seungyoung Ahn and Junyong Park and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

In The Last Decade

Bumhee Bae

41 papers receiving 437 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Bumhee Bae South Korea 13 420 69 49 44 41 44 448
Seungtaek Jeong South Korea 12 522 1.2× 93 1.3× 81 1.7× 93 2.1× 45 1.1× 40 577
Yu-Po Wang Taiwan 11 229 0.5× 39 0.6× 37 0.8× 20 0.5× 5 0.1× 76 309
Hong Huang China 12 294 0.7× 25 0.4× 40 0.8× 38 0.9× 21 0.5× 29 372
Arseny Dolgov United States 7 451 1.1× 43 0.6× 121 2.5× 24 0.5× 24 0.6× 9 470
Chunyan Xiao China 11 378 0.9× 117 1.7× 28 0.6× 108 2.5× 14 0.3× 24 487
Jin‐Jia Chen Taiwan 8 275 0.7× 153 2.2× 5 0.1× 164 3.7× 27 0.7× 24 397
C.-P Hung Taiwan 9 321 0.8× 47 0.7× 17 0.3× 25 0.6× 3 0.1× 51 375
C. H. Yu Taiwan 11 212 0.5× 48 0.7× 8 0.2× 20 0.5× 24 0.6× 18 299
Doğay Altınel Türkiye 7 286 0.7× 42 0.6× 61 1.2× 8 0.2× 16 0.4× 12 320

Countries citing papers authored by Bumhee Bae

Since Specialization
Citations

This map shows the geographic impact of Bumhee Bae's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bumhee Bae with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bumhee Bae more than expected).

Fields of papers citing papers by Bumhee Bae

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bumhee Bae. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bumhee Bae. The network helps show where Bumhee Bae may publish in the future.

Co-authorship network of co-authors of Bumhee Bae

This figure shows the co-authorship network connecting the top 25 collaborators of Bumhee Bae. A scholar is included among the top collaborators of Bumhee Bae based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bumhee Bae. Bumhee Bae is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Huang, Wen‐Chang, et al.. (2023). Machine Learning Based PCB/Package Stack-up Optimization for Signal Integrity. 1885–1891. 3 indexed citations
2.
3.
Cho, Jung-Hoon, et al.. (2022). A Proposed On-Die Oscilloscope for Monitoring of Power Noise Waveform Inside IC Due to Transient Stress Events. IEEE Transactions on Electromagnetic Compatibility. 64(2). 429–442.
4.
Kim, Tae-Woong, et al.. (2021). Periodic Ground Structure for C-PHY Signaling in Mobile Applications. JSTS Journal of Semiconductor Technology and Science. 21(5). 311–321. 1 indexed citations
5.
Yan, Xin, Qiaolei Huang, Bumhee Bae, et al.. (2018). SNR Analysis and Optimization in Near-Field Scanning and EMI Applications. IEEE Transactions on Electromagnetic Compatibility. 60(4). 1087–1094. 6 indexed citations
6.
Huang, Qiaolei, Xin Yan, Bumhee Bae, et al.. (2018). MoM-Based Ground Current Reconstruction in RFI Application. IEEE Transactions on Electromagnetic Compatibility. 60(4). 1121–1128. 13 indexed citations
7.
Kim, Jonghoon J., Junyong Park, Shinyoung Park, et al.. (2017). High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(8). 1356–1368. 12 indexed citations
8.
He, Jiayi, Chulsoon Hwang, Jingnan Pan, et al.. (2016). Extracting characteristic impedance of a transmission line referenced to a meshed ground plane. 651–656. 16 indexed citations
9.
Kong, Sunkyu, Bumhee Bae, DongHyun Kim, et al.. (2016). Electromagnetic interference on analog-to-digital converters from high-power wireless power transfer system for automotive charger. 370–373. 1 indexed citations
10.
Park, Junyong, et al.. (2016). Measurement of High-Bandwidth and High-Density Silicone Rubber Socket up to 110GHz. 2481–2486. 4 indexed citations
11.
Bae, Bumhee, et al.. (2015). Modeling and analysis of a conductive rubber contactor for package test. 1–4. 6 indexed citations
12.
13.
Bae, Bumhee, Junyong Park, & Joungho Kim. (2015). Design of active connector for high speed serial link interconnection. 163–165. 2 indexed citations
14.
15.
Kong, Sunkyu, et al.. (2014). Electromagnetic Radiated Emissions from a Wireless Power Transfer System using a Resonant Magnetic Field Coupling. International Symposium on Electromagnetic Compatibility. 406–409. 2 indexed citations
16.
Kim, Jonghoon J., Bumhee Bae, Sukjin Kim, et al.. (2014). Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 1. 1–6. 1 indexed citations
17.
Song, Jinwook, Sukjin Kim, Bumhee Bae, et al.. (2014). Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC. 50. 1–4. 6 indexed citations
18.
Kim, Jonghoon J., Heegon Kim, Sukjin Kim, et al.. (2013). Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 1–4. 4 indexed citations
19.
Bae, Bumhee, Yujeong Shim, Jonghyun Cho, & Joungho Kim. (2011). Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package. 1–4. 2 indexed citations
20.
Bae, Bumhee, Yujeong Shim, Woojin Lee, et al.. (2010). Hybrid modeling and analysis of power supply noise effects on analog-to-digital converter considering hierarchical PDNs. 1–4. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Seungtaek Jeong Breakdown of academic impact, for papers by Yu-Po Wang Breakdown of academic impact, for papers by Hong Huang Breakdown of academic impact, for papers by Arseny Dolgov Breakdown of academic impact, for papers by Chunyan Xiao Breakdown of academic impact, for papers by Jin‐Jia Chen Breakdown of academic impact, for papers by C.-P Hung Breakdown of academic impact, for papers by C. H. Yu Breakdown of academic impact, for papers by Doğay Altınel
Rankless by CCL
2026