Dekui Mu

1.6k total citations · 1 hit paper
49 papers, 1.3k citations indexed

About

Dekui Mu is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Dekui Mu has authored 49 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Mechanical Engineering, 21 papers in Electrical and Electronic Engineering and 18 papers in Materials Chemistry. Recurrent topics in Dekui Mu's work include Electronic Packaging and Soldering Technologies (19 papers), Advanced materials and composites (16 papers) and Diamond and Carbon-based Materials Research (13 papers). Dekui Mu is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), Advanced materials and composites (16 papers) and Diamond and Carbon-based Materials Research (13 papers). Dekui Mu collaborates with scholars based in China, Australia and Japan. Dekui Mu's co-authors include Han Huang, Kazuhiro Nogita, Xuliang Li, Stuart D. McDonald, Yueqin Wu, Brian R. Lawn, J. Read, Yafeng Yang, Xipeng Xu and Hui Huang and has published in prestigious journals such as Advanced Functional Materials, Materials Science and Engineering A and Applied Surface Science.

In The Last Decade

Dekui Mu

49 papers receiving 1.3k citations

Hit Papers

Science and art of ductile grinding of brittle solids 2020 2026 2022 2024 2020 50 100 150 200
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Science and art of ductile grinding of brittle solids
    2020 228 citations Han Huang, Xuliang Li et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dekui Mu China 22 960 625 439 384 246 49 1.3k
Zhaopeng Hao China 19 1.0k 1.1× 372 0.6× 499 1.1× 352 0.9× 300 1.2× 83 1.2k
Jianyun Shen China 20 984 1.0× 254 0.4× 326 0.7× 412 1.1× 154 0.6× 55 1.2k
YiHang Fan China 17 815 0.8× 306 0.5× 376 0.9× 286 0.7× 256 1.0× 71 943
Binbin Meng China 18 843 0.9× 361 0.6× 1.2k 2.7× 564 1.5× 503 2.0× 31 1.5k
Xinchun Lu China 22 488 0.5× 401 0.6× 477 1.1× 520 1.4× 400 1.6× 60 1.1k
Chi-Feng Lin Taiwan 15 805 0.8× 142 0.2× 226 0.5× 845 2.2× 460 1.9× 26 1.3k
M. Finot United States 9 422 0.4× 167 0.3× 136 0.3× 242 0.6× 539 2.2× 25 953
Yuxiu Hu China 8 545 0.6× 215 0.3× 623 1.4× 232 0.6× 212 0.9× 16 827
R. Ebner Austria 21 929 1.0× 138 0.2× 122 0.3× 858 2.2× 797 3.2× 93 1.4k
C. Braham France 22 1.2k 1.3× 130 0.2× 198 0.5× 686 1.8× 449 1.8× 53 1.5k

Countries citing papers authored by Dekui Mu

Since Specialization
Citations

This map shows the geographic impact of Dekui Mu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dekui Mu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dekui Mu more than expected).

Fields of papers citing papers by Dekui Mu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dekui Mu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dekui Mu. The network helps show where Dekui Mu may publish in the future.

Co-authorship network of co-authors of Dekui Mu

This figure shows the co-authorship network connecting the top 25 collaborators of Dekui Mu. A scholar is included among the top collaborators of Dekui Mu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dekui Mu. Dekui Mu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lin, Qiaoli, et al.. (2024). Study on wetting mechanism of Sn3Sc alloy on silica and sapphire surfaces. Surfaces and Interfaces. 51. 104671–104671. 1 indexed citations
2.
Li, Mian, et al.. (2024). Influence of sintering temperature on dicing performances of metal-bonded diamond blades on sapphire. Journal of Materials Research and Technology. 29. 991–999. 3 indexed citations
3.
Li, Mian, Dekui Mu, Yueqin Wu, et al.. (2024). Influence of diamond abrasives on material removal of single crystal SiC in mechanical dicing. Journal of Materials Processing Technology. 327. 118390–118390. 10 indexed citations
4.
Liu, Zhuo, et al.. (2022). Growth mechanisms of interfacial carbides in solid-state reaction between single-crystal diamond and chromium. Journal of Material Science and Technology. 144. 138–149. 16 indexed citations
5.
Wu, Yueqin, et al.. (2022). Superior Room Temperature Compressive Plasticity of Submicron Beta‐Phase Gallium Oxide Single Crystals. Advanced Functional Materials. 32(48). 19 indexed citations
6.
Liu, Zhuo, et al.. (2022). Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy. Diamond and Related Materials. 127. 109198–109198. 13 indexed citations
7.
8.
Huang, Shuiquan, Xuliang Li, Dekui Mu, et al.. (2021). Polishing performance and mechanism of a water-based nanosuspension using diamond particles and GO nanosheets as additives. Tribology International. 164. 107241–107241. 26 indexed citations
9.
Mu, Dekui, et al.. (2019). Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys. Materials & Design. 182. 108039–108039. 22 indexed citations
10.
Lin, Qiaoli, et al.. (2019). Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond. Applied Surface Science. 504. 144508–144508. 14 indexed citations
11.
Mu, Dekui, et al.. (2019). Low-temperature wetting of sapphire using Sn–Ti active solder alloys. Ceramics International. 45(17). 22175–22182. 27 indexed citations
12.
Chen, Jinchang, Qiaoli Lin, Dekui Mu, et al.. (2018). Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures. Diamond and Related Materials. 92. 92–99. 13 indexed citations
13.
Chen, Jinchang, Dekui Mu, Guoqin Huang, et al.. (2018). Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials. 74. 52–60. 55 indexed citations
14.
Chen, Jinchang, et al.. (2018). Wettability and Interface Reaction of Sn-Cr powder alloy on Poly-crystalline Diamond (PCD). IOP Conference Series Materials Science and Engineering. 423. 12063–12063. 2 indexed citations
15.
Mu, Dekui, Jianxin Wang, Guoqin Huang, et al.. (2017). Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures. International Journal of Refractory Metals and Hard Materials. 66. 252–257. 20 indexed citations
16.
Yang, Yafeng & Dekui Mu. (2014). Simultaneous Fast Dehydrogenation of TiH2 and Rapid Synthesis of TiB2-TiC Through Self-Propagating High-Temperature Synthesis of TiH2-B4C System. Metallurgical and Materials Transactions A. 45(8). 3184–3188. 4 indexed citations
17.
Mu, Dekui, Hideyuki Yasuda, Han Huang, & Kazuhiro Nogita. (2012). Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds. 536. 38–46. 67 indexed citations
18.
Mu, Dekui, Changlin Yang, Xiaowei Wei, & Feng Liu. (2012). RESEARCH ON GRAIN REFINEMENT IN BULK UNDERCOOLED Fe-Co BASE ALLOYS. ACTA METALLURGICA SINICA. 48(12). 1409–1409. 1 indexed citations
19.
Nogita, Kazuhiro, Dekui Mu, Stuart D. McDonald, J. Read, & Yueqin Wu. (2012). Effect of Ni on phase stability and thermal expansion of Cu6−xNixSn5 (X = 0, 0.5, 1, 1.5 and 2). Intermetallics. 26. 78–85. 71 indexed citations
20.
Mu, Dekui, J. Read, Yafeng Yang, & Kazuhiro Nogita. (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of materials research/Pratt's guide to venture capital sources. 26(20). 2660–2664. 52 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Zhaopeng Hao Breakdown of academic impact, for papers by Jianyun Shen Breakdown of academic impact, for papers by YiHang Fan Breakdown of academic impact, for papers by Binbin Meng Breakdown of academic impact, for papers by Xinchun Lu Breakdown of academic impact, for papers by Chi-Feng Lin Breakdown of academic impact, for papers by M. Finot Breakdown of academic impact, for papers by Yuxiu Hu Breakdown of academic impact, for papers by R. Ebner Breakdown of academic impact, for papers by C. Braham
Rankless by CCL
2026