C.M. Gourlay

5.5k total citations · 1 hit paper
148 papers, 4.5k citations indexed

About

C.M. Gourlay is a scholar working on Mechanical Engineering, Aerospace Engineering and Electrical and Electronic Engineering. According to data from OpenAlex, C.M. Gourlay has authored 148 papers receiving a total of 4.5k indexed citations (citations by other indexed papers that have themselves been cited), including 102 papers in Mechanical Engineering, 92 papers in Aerospace Engineering and 73 papers in Electrical and Electronic Engineering. Recurrent topics in C.M. Gourlay's work include Aluminum Alloy Microstructure Properties (91 papers), Electronic Packaging and Soldering Technologies (72 papers) and Aluminum Alloys Composites Properties (40 papers). C.M. Gourlay is often cited by papers focused on Aluminum Alloy Microstructure Properties (91 papers), Electronic Packaging and Soldering Technologies (72 papers) and Aluminum Alloys Composites Properties (40 papers). C.M. Gourlay collaborates with scholars based in United Kingdom, Australia and Japan. C.M. Gourlay's co-authors include A. K. Dahle, S. Belyakov, Kazuhiro Nogita, Jingwei Xian, H.I. Laukli, Hideyuki Yasuda, Zhaolong Ma, Paul A. Hooper, Alessandro Piglione and Minh‐Son Pham and has published in prestigious journals such as Nature, Nature Communications and SHILAP Revista de lepidopterología.

In The Last Decade

C.M. Gourlay

142 papers receiving 4.4k citations

Hit Papers

The role of side-branching in microstructure development ... 2020 2026 2022 2024 2020 100 200 300

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C.M. Gourlay United Kingdom 42 3.4k 2.1k 1.8k 1.3k 547 148 4.5k
José Eduardo Spinelli Brazil 39 3.4k 1.0× 2.9k 1.4× 1.2k 0.7× 2.4k 1.9× 378 0.7× 230 4.4k
Stéphane Gorsse France 42 5.1k 1.5× 2.8k 1.3× 842 0.5× 2.7k 2.1× 523 1.0× 117 6.9k
Nele Moelans Belgium 30 2.1k 0.6× 1.8k 0.8× 487 0.3× 2.6k 2.1× 757 1.4× 137 3.8k
L. Katgerman Netherlands 43 5.0k 1.4× 4.4k 2.1× 490 0.3× 3.1k 2.4× 1.5k 2.7× 181 6.3k
Ying Yang United States 37 4.3k 1.3× 2.6k 1.3× 303 0.2× 2.7k 2.1× 495 0.9× 187 6.1k
Wenjun Lu China 46 5.5k 1.6× 2.8k 1.4× 442 0.2× 2.5k 1.9× 924 1.7× 145 6.6k
Yu. F. Ivanov Russia 30 2.5k 0.7× 730 0.3× 1.0k 0.6× 2.2k 1.7× 1.7k 3.2× 656 4.8k
Jianzhong Cui China 41 5.1k 1.5× 3.4k 1.6× 516 0.3× 3.3k 2.6× 1.0k 1.9× 420 6.4k
Bharat Gwalani United States 46 5.5k 1.6× 4.1k 2.0× 482 0.3× 1.1k 0.9× 504 0.9× 147 6.3k
N. Frage Israel 44 4.9k 1.4× 815 0.4× 768 0.4× 2.8k 2.2× 662 1.2× 203 6.4k

Countries citing papers authored by C.M. Gourlay

Since Specialization
Citations

This map shows the geographic impact of C.M. Gourlay's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.M. Gourlay with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.M. Gourlay more than expected).

Fields of papers citing papers by C.M. Gourlay

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.M. Gourlay. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.M. Gourlay. The network helps show where C.M. Gourlay may publish in the future.

Co-authorship network of co-authors of C.M. Gourlay

This figure shows the co-authorship network connecting the top 25 collaborators of C.M. Gourlay. A scholar is included among the top collaborators of C.M. Gourlay based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.M. Gourlay. C.M. Gourlay is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hsieh, Chen-Lin, Richard Coyle, & C.M. Gourlay. (2025). Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling. Journal of Electronic Materials. 54(4). 2657–2671. 3 indexed citations
2.
Li, Ao, et al.. (2025). Effects of Ag and melt undercooling on the microstructure of Sn–Ag solder balls. Journal of Materials Science Materials in Electronics. 36(16). 942–942.
3.
Shen, Xu, et al.. (2025). Eutectic orientation relationships in Sn-Bi solder. Journal of Alloys and Compounds. 1035. 181339–181339. 1 indexed citations
4.
Wang, Siyang, et al.. (2025). In-situ investigation of discontinuous precipitation in Sn-Bi low temperature solders. Materialia. 43. 102524–102524.
5.
Sun, Shengjun & C.M. Gourlay. (2024). Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints. Metallurgical and Materials Transactions A. 55(11). 4342–4353. 2 indexed citations
6.
Xu, Yilun, et al.. (2024). Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders. Materials Science and Engineering A. 918. 147429–147429. 4 indexed citations
7.
Xian, Jingwei, et al.. (2024). Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification. Journal of Electronic Materials. 53(12). 8024–8038. 1 indexed citations
8.
Xian, Jingwei, Yilun Xu, Stoyan Stoyanov, et al.. (2024). The role of microstructure in the thermal fatigue of solder joints. Nature Communications. 15(1). 4258–4258. 22 indexed citations
9.
Yang, Yang, et al.. (2023). Influence of β-Mg17Al12 and Al-Mn intermetallic compounds on the corrosion behaviour of cast and solution treated Mg-Al-Zn-Mn alloys. Corrosion Science. 222. 111363–111363. 28 indexed citations
10.
Gourlay, C.M., et al.. (2023). Carbides in AZ91 and their role in the grain refinement of magnesium. Journal of Alloys and Compounds. 971. 172655–172655. 5 indexed citations
11.
Xian, Jingwei, et al.. (2023). Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys. Metallurgical and Materials Transactions A. 54(3). 909–927. 15 indexed citations
12.
O’Sullivan, Catherine, et al.. (2020). Rheological transitions in semi-solid alloys: In-situ imaging and LBM-DEM simulations. Acta Materialia. 191. 24–42. 18 indexed citations
13.
Tong, Vivian, et al.. (2020). In-situ study of creep in Sn-3Ag-0.5Cu solder. Acta Materialia. 196. 31–43. 20 indexed citations
14.
Gourlay, C.M., et al.. (2018). Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder. Journal of Electronic Materials. 48(1). 107–121. 7 indexed citations
15.
Ollivier, M., Robert M. Harker, & C.M. Gourlay. (2016). Reaction-induced surface reconstruction of silver in contact with zirconium. Journal of Alloys and Compounds. 691. 624–633. 1 indexed citations
16.
Nogita, Kazuhiro, Xuan Quy Tran, Tomokazu Yamamoto, et al.. (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports. 5(1). 8450–8450. 70 indexed citations
17.
Yasuda, Hideyuki, Kazuhiro Nogita, C.M. Gourlay, Masato Yoshiya, & Tomoya Nagira. (2009). In-situ Observation of Sn alloy solidification at SPring-8. JOURNAL OF THE JAPAN WELDING SOCIETY. 78(7). 600–603. 4 indexed citations
18.
Gourlay, C.M., Kazuhiro Nogita, J. Read, & A. K. Dahle. (2009). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials. 39(1). 56–69. 48 indexed citations
19.
Gourlay, C.M., Somboon Otarawanna, H.I. Laukli, & A. K. Dahle. (2008). An overview of defect bands in high pressure die castings. Queensland's institutional digital repository (The University of Queensland). 52(1). 32–35. 4 indexed citations
20.
Gourlay, C.M. & A. K. Dahle. (2007). Dilatant shear bands in solidifying metals. Nature. 445(7123). 70–73. 194 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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