J. Neirynck

2.5k total citations
10 papers, 123 citations indexed

About

J. Neirynck is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, J. Neirynck has authored 10 papers receiving a total of 123 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in J. Neirynck's work include Advanced Surface Polishing Techniques (7 papers), Semiconductor materials and devices (6 papers) and Copper Interconnects and Reliability (5 papers). J. Neirynck is often cited by papers focused on Advanced Surface Polishing Techniques (7 papers), Semiconductor materials and devices (6 papers) and Copper Interconnects and Reliability (5 papers). J. Neirynck collaborates with scholars based in United States. J. Neirynck's co-authors include R.J. Gutmann, S. P. Murarka, G.‐R. Yang, David J. Duquette, Joseph M. Steigerwald, Lü You, Yiping Zhao, W. A. Lanford, Kelin J. Kuhn and I. Post and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and Journal of Electronic Materials.

In The Last Decade

J. Neirynck

9 papers receiving 113 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. Neirynck United States	6	82	81	35	34	32	10	123
Ricardo Cotrin Teixeira Brazil	7	140 1.7×	69 0.9×	11 0.3×	18 0.5×	53 1.7×	40	177
Shari Farrens United States	10	266 3.2×	102 1.3×	18 0.5×	12 0.4×	21 0.7×	27	310
Stan Tsai United States	9	148 1.8×	142 1.8×	27 0.8×	49 1.4×	57 1.8×	23	219
Y. Le Friec France	9	216 2.6×	59 0.7×	50 1.4×	16 0.5×	105 3.3×	30	246
J. Y. Wu Taiwan	11	311 3.8×	120 1.5×	44 1.3×	30 0.9×	92 2.9×	51	354
M. Schneegans Germany	7	124 1.5×	21 0.3×	33 0.9×	57 1.7×	23 0.7×	13	158
Neville Sun United States	6	84 1.0×	89 1.1×	64 1.8×	11 0.3×	51 1.6×	7	172
C. Surisetty United States	8	86 1.0×	84 1.0×	16 0.5×	15 0.4×	57 1.8×	11	132
E. Deloffre France	11	196 2.4×	25 0.3×	58 1.7×	21 0.6×	27 0.8×	26	208
Pierric Gueguen France	11	355 4.3×	58 0.7×	96 2.7×	30 0.9×	34 1.1×	20	390

Countries citing papers authored by J. Neirynck

Since Specialization

Citations

This map shows the geographic impact of J. Neirynck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Neirynck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Neirynck more than expected).

Fields of papers citing papers by J. Neirynck

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Neirynck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Neirynck. The network helps show where J. Neirynck may publish in the future.

Co-authorship network of co-authors of J. Neirynck

This figure shows the co-authorship network connecting the top 25 collaborators of J. Neirynck. A scholar is included among the top collaborators of J. Neirynck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Neirynck. J. Neirynck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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10 of 10 papers shown

Neirynck, J., Ying Xiao, R.J. Gutmann, & S. P. Murarka. (2003). Carbon-doped copper as a high-conductivity liner for copper/benzocyclobutene (BCB) interconnects. 167–169.

Kuhn, Kelin J., et al.. (2002). Scaling challenges for 0.13 μm generation shallow trench isolation. 187–190. 4 indexed citations

Neirynck, J., R.J. Gutmann, & S. P. Murarka. (1999). Copper/Benzocyclobutene Interconnects for Sub‐100 nm Integrated Circuit Technology: Elimination of High‐Resistivity Metallic Liners and High‐Dielectric Constant Polish Stops. Journal of The Electrochemical Society. 146(4). 1602–1607. 13 indexed citations

Yang, G.‐R., Yiping Zhao, J. Neirynck, S. P. Murarka, & R.J. Gutmann. (1997). Chemical-Mechanical Polishing of Polymer Films: Comparison of Benzocyclobutene(BCB) and Parylene-N Films by XPS and AFM. MRS Proceedings. 476. 9 indexed citations

Yang, G.‐R., et al.. (1997). Chemical‐Mechanical Polishing of Parylene N and Benzocyclobutene Films. Journal of The Electrochemical Society. 144(9). 3249–3255. 13 indexed citations

Yang, G.‐R., Yiping Zhao, J. Neirynck, S. P. Murarka, & R.J. Gutmann. (1997). Chemical-Mechanical polishing of parylene- n films: evaluation by X-Ray photoelectron spectroscopy and atomic force microscopy. Journal of Electronic Materials. 26(8). 935–940. 3 indexed citations

Neirynck, J., G.‐R. Yang, S. P. Murarka, & R.J. Gutmann. (1996). The addition of surfactant to slurry for polymer CMP: effects on polymer surface, removal rate and underlying Cu. Thin Solid Films. 290-291. 447–452. 20 indexed citations

Gutmann, R.J., Joseph M. Steigerwald, Lü You, et al.. (1995). Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics. Thin Solid Films. 270(1-2). 596–600. 51 indexed citations

Neirynck, J., S. P. Murarka, & R.J. Gutmann. (1995). Investigations Of The Chemical-Mechanical Polishing Of Polymer Films For ILD Applications. MRS Proceedings. 381. 6 indexed citations

10.

Murarka, S. P., et al.. (1994). <title>Copper interconnection schemes: elimination of the need of diffusion barrier/adhesion promoter by the use of corrosion-resistant low-resistivity-doped copper</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2335. 80–90. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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