Joseph M. Steigerwald

2.0k total citations · 1 hit paper
15 papers, 1.3k citations indexed

About

Joseph M. Steigerwald is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, Joseph M. Steigerwald has authored 15 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Biomedical Engineering, 12 papers in Electrical and Electronic Engineering and 7 papers in Mechanical Engineering. Recurrent topics in Joseph M. Steigerwald's work include Advanced Surface Polishing Techniques (13 papers), Copper Interconnects and Reliability (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). Joseph M. Steigerwald is often cited by papers focused on Advanced Surface Polishing Techniques (13 papers), Copper Interconnects and Reliability (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). Joseph M. Steigerwald collaborates with scholars based in United States. Joseph M. Steigerwald's co-authors include S. P. Murarka, R.J. Gutmann, D. J. Duquette, David J. Price, T. Paul Chow, S. Lakshminarayanan, Lü You, Marc R. Bourgeois, David J. Duquette and J. Neirynck and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and Materials Chemistry and Physics.

In The Last Decade

Joseph M. Steigerwald

15 papers receiving 1.2k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Chemical Mechanical Planarization of Microelectronic Materials

1997 641 citations Joseph M. Steigerwald, S. P. Murarka et al. profile →

Peers

Joseph M. Steigerwald

BE

EEE

ME

MC

EOMM

Ara Philipossian United States

Xinchun Lu China

Qiusheng Yan China

Guoshun Pan China

Hua Gong China

Jiakai Zhou China

Jian Fang China

Jihua Zhang China

Nety Krishna United States

C. Madore Switzerland

Ara Philipossian United States

Joseph M. Steigerwald

1.9k ×1.8

BE

786 ×1.1

EEE

1.2k ×2.4

ME

937 ×2.1

MC

116 ×0.5

EOMM

Citations per year, relative to Joseph M. Steigerwald Joseph M. Steigerwald (= 1×) peers Ara Philipossian

Countries citing papers authored by Joseph M. Steigerwald

Since Specialization

Citations

This map shows the geographic impact of Joseph M. Steigerwald's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Joseph M. Steigerwald with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Joseph M. Steigerwald more than expected).

Fields of papers citing papers by Joseph M. Steigerwald

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Joseph M. Steigerwald. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Joseph M. Steigerwald. The network helps show where Joseph M. Steigerwald may publish in the future.

Co-authorship network of co-authors of Joseph M. Steigerwald

This figure shows the co-authorship network connecting the top 25 collaborators of Joseph M. Steigerwald. A scholar is included among the top collaborators of Joseph M. Steigerwald based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Joseph M. Steigerwald. Joseph M. Steigerwald is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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15 of 15 papers shown

1.

Griggio, Flavio, J. Palmer, Nikholas G. Toledo, et al.. (2018). Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology. 6E.3–1. 44 indexed citations

2.

Steigerwald, Joseph M.. (2008). Chemical mechanical polish: The enabling technology. 1–4. 22 indexed citations

3.

Steigerwald, Joseph M., S. P. Murarka, R.J. Gutmann, & D. J. Duquette. (2002). An investigation of the chemical mechanical polishing of copper thin films to form in-laid interconnections in the dielectric (SiO/sub 2/) films. 120–121. 1 indexed citations

4.

Steigerwald, Joseph M., S. P. Murarka, & R.J. Gutmann. (1997). Chemical Mechanical Planarization of Microelectronic Materials. 641 indexed citations breakdown →

5.

Duquette, D. J., et al.. (1996). Electrochemical effects in the chemical-mechanical polishing of copper for integrated circuits. Journal of Electronic Materials. 25(10). 1593–1598. 11 indexed citations

6.

Steigerwald, Joseph M., S. P. Murarka, R.J. Gutmann, & D. J. Duquette. (1995). Chemical processes in the chemical mechanical polishing of copper. Materials Chemistry and Physics. 41(3). 217–228. 167 indexed citations

7.

Gutmann, R.J., Joseph M. Steigerwald, Lü You, et al.. (1995). Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics. Thin Solid Films. 270(1-2). 596–600. 51 indexed citations

8.

Steigerwald, Joseph M., et al.. (1995). Mechanisms of copper removal during chemical mechanical polishing. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 13(6). 2215–2218. 41 indexed citations

9.

Steigerwald, Joseph M., D. J. Duquette, S. P. Murarka, & R.J. Gutmann. (1995). Electrochemical Potential Measurements during the Chemical‐Mechanical Polishing of Copper Thin Films. Journal of The Electrochemical Society. 142(7). 2379–2385. 44 indexed citations

10.

Gutmann, R.J., T. Paul Chow, S. Lakshminarayanan, et al.. (1995). Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics. Thin Solid Films. 270(1-2). 472–479. 25 indexed citations

11.

Lakshminarayanan, S., Joseph M. Steigerwald, Marc R. Bourgeois, et al.. (1994). Contact and via structures with copper interconnects fabricated using dual Damascene technology. IEEE Electron Device Letters. 15(8). 307–309. 49 indexed citations

12.

Steigerwald, Joseph M., et al.. (1994). Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures. Journal of The Electrochemical Society. 141(10). 2842–2848. 100 indexed citations

13.

Steigerwald, Joseph M., S. P. Murarka, D. J. Duquette, & R.J. Gutmann. (1994). Surface Layer Formation During the Chemical Mechanical Polishing of Copper Thin Films. MRS Proceedings. 337. 13 indexed citations

14.

Steigerwald, Joseph M., S. P. Murarka, R.J. Gutmann, & D. J. Duquette. (1994). Effect of Copper Ions in the Slurry on the Chemical‐Mechanical Polish Rate of Titanium. Journal of The Electrochemical Society. 141(12). 3512–3516. 33 indexed citations

15.

Murarka, S. P., Joseph M. Steigerwald, & R.J. Gutmann. (1993). Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing. MRS Bulletin. 18(6). 46–51. 42 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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