M. Schneegans

474 total citations
13 papers, 158 citations indexed

About

M. Schneegans is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, M. Schneegans has authored 13 papers receiving a total of 158 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. Recurrent topics in M. Schneegans's work include Semiconductor materials and devices (6 papers), Copper Interconnects and Reliability (4 papers) and Electronic Packaging and Soldering Technologies (2 papers). M. Schneegans is often cited by papers focused on Semiconductor materials and devices (6 papers), Copper Interconnects and Reliability (4 papers) and Electronic Packaging and Soldering Technologies (2 papers). M. Schneegans collaborates with scholars based in Germany, Switzerland and Greece. M. Schneegans's co-authors include E. Menzel, Martin Eigner, M. Vivargent, P. Lecoq, Stephan Dietrich, Jens Martin, K. Samwer, M. Moske, W. Schilling and Daniel Koch and has published in prestigious journals such as Journal of Colloid and Interface Science, Thin Solid Films and Journal of Crystal Growth.

In The Last Decade

M. Schneegans

13 papers receiving 149 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Schneegans Germany 7 124 57 33 23 21 13 158
Tushar K. Talukdar United States 9 116 0.9× 14 0.2× 29 0.9× 53 2.3× 22 1.0× 16 171
J. Neirynck United States 6 82 0.7× 34 0.6× 35 1.1× 32 1.4× 81 3.9× 10 123
Arnaud Garnier France 7 102 0.8× 15 0.3× 12 0.4× 11 0.5× 19 0.9× 27 123
C. Parks United States 8 231 1.9× 22 0.4× 130 3.9× 42 1.8× 10 0.5× 14 250
Richard Beaupre United States 10 293 2.4× 66 1.2× 56 1.7× 20 0.9× 9 0.4× 16 341
M. Miyajima Japan 11 437 3.5× 19 0.3× 63 1.9× 17 0.7× 36 1.7× 27 458
T. Stockmeier Switzerland 9 300 2.4× 32 0.6× 11 0.3× 56 2.4× 10 0.5× 24 312
R. Augur Netherlands 9 233 1.9× 15 0.3× 171 5.2× 49 2.1× 42 2.0× 27 269
Mingmin Huang China 10 273 2.2× 60 1.1× 28 0.8× 48 2.1× 6 0.3× 50 362
Hongyan Shao China 7 35 0.3× 21 0.4× 44 1.3× 15 0.7× 51 2.4× 13 116

Countries citing papers authored by M. Schneegans

Since Specialization
Citations

This map shows the geographic impact of M. Schneegans's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Schneegans with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Schneegans more than expected).

Fields of papers citing papers by M. Schneegans

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Schneegans. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Schneegans. The network helps show where M. Schneegans may publish in the future.

Co-authorship network of co-authors of M. Schneegans

This figure shows the co-authorship network connecting the top 25 collaborators of M. Schneegans. A scholar is included among the top collaborators of M. Schneegans based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Schneegans. M. Schneegans is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
Eigner, Martin, et al.. (2006). Microcontacts with sub-30μm pitch for 3D chip-on-chip integration. Microelectronic Engineering. 83(11-12). 2155–2162. 69 indexed citations
2.
Schneegans, M., et al.. (2005). Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip applications. Microelectronic Engineering. 82(3-4). 581–586. 18 indexed citations
3.
Papp, Ádám, et al.. (2002). Implementation of a WLR-program into a production line. 49–54. 6 indexed citations
4.
Papp, Ádám, et al.. (2002). Use of test structures for a wafer-level-reliability monitoring. 267–271. 3 indexed citations
5.
Robl, W., et al.. (1997). <title>Advanced PVD Ti/TiN liners for contact and via applications</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3214. 2–12. 1 indexed citations
6.
Dietrich, Stephan, M. Schneegans, M. Moske, & K. Samwer. (1996). Investigation on metallurgical properties and electromigration in AlCu metallizations for VLSI applications. Thin Solid Films. 275(1-2). 159–163. 6 indexed citations
7.
Schneegans, M., et al.. (1994). Thermal Stresses in Passivated AlSiCu-Lines From Wafer Curvature Measurement. MRS Proceedings. 356. 5 indexed citations
8.
Schneegans, M., et al.. (1989). High Contrast Single Layer Resists And Antireflection Layers - An Alternative To Multilayer Resist Techniques. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1086. 242–242. 2 indexed citations
9.
Schneegans, M., et al.. (1988). Titanium nitride for antireflection control and hillock suppression on aluminum silicon metallization. Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena. 6(4). 1113–1115. 8 indexed citations
10.
Lecoq, P., Jens Martin, M. Schneegans, & M. Vivargent. (1985). Big Detectors of BGO. Europhysics news. 16(2). 8–10. 6 indexed citations
11.
Schneegans, M. & E. Menzel. (1983). Surface melting and surface segregation on spherical Cu-Au crystals grown from a drop of melt. Journal of Crystal Growth. 63(2). 315–320. 7 indexed citations
12.
Schneegans, M. & E. Menzel. (1983). Surface topography and surface dendrites on spherical Cu-Au crystals grown from a drop of melt. Journal of Crystal Growth. 63(2). 309–314. 1 indexed citations
13.
Schneegans, M. & E. Menzel. (1982). Gold crystals solidified in air are hydrophilic. Journal of Colloid and Interface Science. 88(1). 97–99. 26 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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