David J. Duquette

800 total citations
39 papers, 644 citations indexed

About

David J. Duquette is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, David J. Duquette has authored 39 papers receiving a total of 644 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 17 papers in Materials Chemistry and 14 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in David J. Duquette's work include Copper Interconnects and Reliability (13 papers), Electrodeposition and Electroless Coatings (11 papers) and Corrosion Behavior and Inhibition (6 papers). David J. Duquette is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Electrodeposition and Electroless Coatings (11 papers) and Corrosion Behavior and Inhibition (6 papers). David J. Duquette collaborates with scholars based in United States, Singapore and Australia. David J. Duquette's co-authors include Sunjung Kim, K. S. V. Santhanam, Pulickel M. Ajayan, Frances M. Ross, R. Hull, See Wee Chee, Khalid Hattar, R.J. Gutmann, S. P. Murarka and William N. Gill and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

David J. Duquette

38 papers receiving 620 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David J. Duquette United States 15 385 289 187 131 104 39 644
Guo‐zhen Zhu Canada 13 274 0.7× 470 1.6× 135 0.7× 67 0.5× 21 0.2× 60 924
Abhay Raj Singh Gautam United States 13 209 0.5× 609 2.1× 85 0.5× 77 0.6× 32 0.3× 36 871
Ahmet Yavuz Oral Türkiye 14 397 1.0× 568 2.0× 117 0.6× 166 1.3× 43 0.4× 47 894
A. Sartre France 8 180 0.5× 168 0.6× 53 0.3× 77 0.6× 159 1.5× 13 488
Chanwon Jung South Korea 16 533 1.4× 558 1.9× 143 0.8× 107 0.8× 21 0.2× 63 974
Alexandr Knápek Czechia 13 198 0.5× 207 0.7× 80 0.4× 235 1.8× 95 0.9× 59 558
Hessam Ghassemi United States 14 430 1.1× 582 2.0× 165 0.9× 125 1.0× 31 0.3× 28 901
Aivar Tarre Estonia 18 784 2.0× 689 2.4× 119 0.6× 115 0.9× 82 0.8× 63 1.0k
Lu Qi China 14 418 1.1× 236 0.8× 120 0.6× 38 0.3× 115 1.1× 28 723
Chia‐Chin Chen Taiwan 17 1.1k 2.8× 309 1.1× 419 2.2× 52 0.4× 81 0.8× 45 1.3k

Countries citing papers authored by David J. Duquette

Since Specialization
Citations

This map shows the geographic impact of David J. Duquette's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David J. Duquette with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David J. Duquette more than expected).

Fields of papers citing papers by David J. Duquette

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David J. Duquette. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David J. Duquette. The network helps show where David J. Duquette may publish in the future.

Co-authorship network of co-authors of David J. Duquette

This figure shows the co-authorship network connecting the top 25 collaborators of David J. Duquette. A scholar is included among the top collaborators of David J. Duquette based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David J. Duquette. David J. Duquette is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Park, Jeung Hun, et al.. (2018). In situ EC-TEM Studies of Metal Thin Film Corrosion in Liquid Solutions at Elevated Temperatures. Microscopy and Microanalysis. 24(S1). 254–255. 9 indexed citations
2.
Li, Mingjie, David J. Duquette, & Ying Chen. (2018). Deformation Accommodation at Triple Junctions in Columnar-Grained Nickel. Metallurgical and Materials Transactions A. 50(1). 52–57. 9 indexed citations
3.
Chee, See Wee, et al.. (2016). An In Situ Transmission Electron Microscopy Study of Localized Corrosion on Aluminum. MRS Advances. 1(25). 1877–1882. 4 indexed citations
4.
Chee, See Wee, David J. Duquette, Frances M. Ross, & R. Hull. (2014). Metastable Structures in Al Thin Films Before the Onset of Corrosion Pitting as Observed using Liquid Cell Transmission Electron Microscopy. Microscopy and Microanalysis. 20(2). 462–468. 28 indexed citations
5.
Chee, See Wee, et al.. (2014). Studying localized corrosion using liquid cell transmission electron microscopy. Chemical Communications. 51(1). 168–171. 63 indexed citations
6.
Chee, See Wee, Frances M. Ross, David J. Duquette, & R. Hull. (2014). Corrosion of Metal Films Observed Using In Situ and Ex Situ Electron Microscopy. Microscopy and Microanalysis. 20(S3). 1540–1541. 1 indexed citations
7.
Chee, See Wee, Frances M. Ross, David J. Duquette, & R. Hull. (2013). Studies of Corrosion of Al Thin Films using Liquid Cell Transmission Electron Microscopy. MRS Proceedings. 1525. 4 indexed citations
8.
Small, Leo J., Michael T. Brumbach, Christopher A. Apblett, et al.. (2013). On the Degradation Processes of Thin Film PZT in 0.1 N H2SO4. Journal of The Electrochemical Society. 160(3). C128–C135. 3 indexed citations
9.
Hawk, Jeffrey A., et al.. (2008). Effect of Microstructure and Environment on Static Crack Growth Resistance in Alloy 706. Journal of Materials Engineering and Performance. 18(4). 361–368. 4 indexed citations
10.
Jang, Jun‐Ho, et al.. (2007). Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes. Electrochimica Acta. 52(16). 5258–5265. 29 indexed citations
11.
Eyck, Gregory A. Ten, et al.. (2006). Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier. Electrochemical and Solid-State Letters. 10(1). D13–D13. 7 indexed citations
12.
Kim, Sunjung & David J. Duquette. (2006). Effect of Chemical Composition on Adhesion of Directly Electrodeposited Copper Film on TiN. Journal of The Electrochemical Society. 153(6). C417–C417. 32 indexed citations
13.
Duquette, David J., et al.. (2006). The Evolution of Surface Roughness of Copper Electrodeposition Directly on Ultra-Thin Air Exposed TaN Layers. ECS Transactions. 1(11). 1–9. 5 indexed citations
14.
Steinbrüchel, Christoph, et al.. (2002). Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu-NH[sub 3] Bath. Journal of The Electrochemical Society. 149(8). C390–C390. 28 indexed citations
15.
Shaw, Michael, et al.. (2001). “Seedless” electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices. Journal of Electronic Materials. 30(12). 1602–1608. 18 indexed citations
16.
Lee, Byung-Chan, David J. Duquette, & R.J. Gutmann. (2001). Synthesis of Model Alumina Slurries for Damascene Patterning of Copper. MRS Proceedings. 671. 2 indexed citations
17.
Gutmann, R.J., Joseph M. Steigerwald, Lü You, et al.. (1995). Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics. Thin Solid Films. 270(1-2). 596–600. 51 indexed citations
18.
Stoloff, N.S. & David J. Duquette. (1993). Moisture and hydrogen-induced embrittlement of iron aluminides. JOM. 45(12). 30–35. 10 indexed citations
19.
Duquette, David J., et al.. (1990). Corrosion studies of a stainless steel structure for the ITER aqueous lithium salt blanket concept. Fusion Engineering and Design. 13(1). 45–52. 6 indexed citations
20.
Little, Brenda J., Patricia Wagner, & David J. Duquette. (1987). Microbiologically Induced Cathodic Depolarization. 1–7. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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