Huamao Lin
- Mechanical Engineering top 10%
- Heat Transfer and Optimization 4
- Heat Transfer and Boiling Studies 4
- Computational Mechanics top 10%
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- Acoustic Wave Resonator Technologies 6
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- Advanced MEMS and NEMS Technologies 8
- 3D IC and TSV technologies 7
- Electronic Packaging and Soldering Technologies 6
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- High voltage insulation and dielectric phenomena 3
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- GaN-based semiconductor devices and materials 3
- Co-authors
- Khellil SefianeD. BogojevicGerard CumminsA.J. WaltonD. B. R. KenningTassos G. KarayiannisAlan J. WaltonVladimir Bliznetsov
- Partner nations
- SingaporeUnited KingdomChina
In The Last Decade
Huamao Lin
28 papers receiving 370 citations
Peers
Comparison fields: 5 of 55
- Mechanical Engineering 214
- Computational Mechanics 85
- Biomedical Engineering 93
- Electrical and Electronic Engineering 102
- Rheumatology 25
Countries citing papers authored by Huamao Lin
This map shows the geographic impact of Huamao Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huamao Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huamao Lin more than expected).
Fields of papers citing papers by Huamao Lin
This network shows the impact of papers produced by Huamao Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huamao Lin. The network helps show where Huamao Lin may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Huamao Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 1 | |
| 3 | 2024 | 4 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 5 | |
| 6 | 2024 | 1 | |
| 7 | 2024 | 0 | |
| 8 | 2022 | 13 | |
| 9 | 2017 | 0 | |
| 10 | 2015 | 19 | |
| 11 | 2010 | 59 | |
| 12 | 2008 | 11 | |
| 13 | 2008 | 2 | |
| 14 | 2008 | 14 | |
| 15 | 2007 | 33 | |
| 16 | 2006 | 4 | |
| 17 | 2002 | 2 | |
| 18 | 2002 | 1 | |
| 19 | 2002 | 0 | |
| 20 | 2002 | 1 |
About Huamao Lin
Huamao Lin is a scholar working on Electrical and Electronic Engineering, Bioengineering and Ceramics and Composites, having authored 32 papers that have together received 378 indexed citations. Recurring topics across this work include Advanced MEMS and NEMS Technologies (8 papers), 3D IC and TSV technologies (7 papers), Acoustic Wave Resonator Technologies (6 papers), Electronic Packaging and Soldering Technologies (6 papers), Heat Transfer and Optimization (4 papers), Heat Transfer and Boiling Studies (4 papers), High voltage insulation and dielectric phenomena (3 papers) and GaN-based semiconductor devices and materials (3 papers). The work is most often cited by research in Mechanical Engineering (214 citations), Computational Mechanics (85 citations) and Biomedical Engineering (93 citations). Huamao Lin has collaborated with scholars based in Singapore, United Kingdom and China. Frequent co-authors include Khellil Sefiane, D. Bogojevic, Gerard Cummins, A.J. Walton, D. B. R. Kenning, Tassos G. Karayiannis, Alan J. Walton, Vladimir Bliznetsov, J.T.M. Stevenson and D. J. Johnson. Their work appears in journals such as Applied Physics Letters, Sensors and Osteoarthritis and Cartilage.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.