Zhongfu Xia
- Biomedical Engineering top 5%
- Materials Chemistry top 10%
- Electrical and Electronic Engineering top 10%
- Polymers and Plastics top 10%
- Mechanical Engineering
- Co-authors
- Xiaoqing ZhangR. DanzArmin WedelReimund GerhardXunlin QiuYewen ZhangJinfeng HuangW. Künstler
- Topics
- High voltage insulation and dielectric phenomena (76 papers)Advanced Sensor and Energy Harvesting Materials (65 papers)Dielectric materials and actuators (46 papers)
- Partner nations
- ChinaGermanyUnited States
In The Last Decade
Zhongfu Xia
92 papers receiving 972 citations
Peers
Comparison fields: 5 of 63
- Biomedical Engineering 789
- Materials Chemistry 647
- Electrical and Electronic Engineering 320
- Polymers and Plastics 133
- Mechanical Engineering 98
Countries citing papers authored by Zhongfu Xia
This map shows the geographic impact of Zhongfu Xia's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhongfu Xia with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhongfu Xia more than expected).
Fields of papers citing papers by Zhongfu Xia
This network shows the impact of papers produced by Zhongfu Xia. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhongfu Xia. The network helps show where Zhongfu Xia may publish in the future.
Co-authorship network of co-authors of Zhongfu Xia
This figure shows the co-authorship network connecting the top 25 collaborators of Zhongfu Xia. A scholar is included among the top collaborators of Zhongfu Xia based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhongfu Xia. Zhongfu Xia is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 6 | |
| 2 | 4 | |
| 3 | 1 | |
| 4 | 3 | |
| 5 | 1 | |
| 6 | 2 | |
| 7 | 5 | |
| 8 | 46 | |
| 9 | 19 | |
| 10 | 2 | |
| 11 | 2 | |
| 12 | 33 | |
| 13 | 42 | |
| 14 | 2 | |
| 15 | 1 | |
| 16 | 1 | |
| 17 | 0 | |
| 18 | 6 | |
| 19 | Silicondioxide electret films prepared by sol-gel process | 1 |
| 20 | The field near the sample Foil in the corona system with a grid | 1 |
About Zhongfu Xia
Zhongfu Xia is a scholar working on Materials Chemistry, Biomedical Engineering and Polymers and Plastics, having authored 102 papers that have together received 1.0k indexed citations. Recurring topics across this work include High voltage insulation and dielectric phenomena (76 papers), Advanced Sensor and Energy Harvesting Materials (65 papers) and Dielectric materials and actuators (46 papers). The work is most often cited by research in Biomedical Engineering (789 citations), Materials Chemistry (647 citations) and Polymers and Plastics (133 citations). Zhongfu Xia has collaborated with scholars based in China, Germany and United States. Frequent co-authors include Xiaoqing Zhang, R. Danz, Armin Wedel, Reimund Gerhard, Xunlin Qiu, Yewen Zhang, Jinfeng Huang, W. Künstler, Zhenlian An and Feipeng Wang. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.